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Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Paper No: IPACK2021-73456
DOI: https://doi.org/10.1115/IPACK2021-73456
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Paper No: IPACK2019-6347
DOI: https://doi.org/10.1115/IPACK2019-6347
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Paper No: IPACK2018-8257
DOI: https://doi.org/10.1115/IPACK2018-8257
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Paper No: IPACK2018-8386
DOI: https://doi.org/10.1115/IPACK2018-8386
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Paper No: IPACK2017-74017
DOI: https://doi.org/10.1115/IPACK2017-74017
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Paper No: IPACK2015-48605
DOI: https://doi.org/10.1115/IPACK2015-48605
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Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Paper No: IPACK2015-48720
DOI: https://doi.org/10.1115/IPACK2015-48720
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Paper No: IPACK2013-73315
DOI: https://doi.org/10.1115/IPACK2013-73315
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 317-323, July 6–8, 2011
Paper No: IPACK2011-52237
DOI: https://doi.org/10.1115/IPACK2011-52237
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Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement
Proceedings Papers

A Novel Approach to Optimizing Solder Reflow Process in Assembling PQFN Packages

Youmin Yu, Y. Q. Su, S. A. Yao, Y. W. Jiang, Sonder Wang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 329-334, July 19–23, 2009
Paper No: InterPACK2009-89408
DOI: https://doi.org/10.1115/InterPACK2009-89408
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Topics: Errors, Heat, Heat transfer, Heating, Optimization, Ovens, Reflow soldering, Reliability, Solders
Proceedings Papers

Strength Evaluation of Conductive Adhesive Paste for Die Bonding During Reflow Soldering

Kisho Ashida, Kenya Kawano, Naotaka Tanaka, Atsushi Nishikizawa, Nobuya Koike
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 825-831, July 19–23, 2009
Paper No: InterPACK2009-89273
DOI: https://doi.org/10.1115/InterPACK2009-89273
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Topics: Adhesives, Bonding, Reflow soldering, Silver, Fracture (Process), Fracture toughness, Copper, Failure, Resins, Stress
Proceedings Papers

Characterization of Die Stress Distributions in Area Array Flip Chip Packaging

Jordan Roberts, M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Ron Zhang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009
Paper No: InterPACK2009-89383
DOI: https://doi.org/10.1115/InterPACK2009-89383
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Topics: Flip-chip, Flip-chip devices, Packaging, Stress, Sensors, Ceramics, Adhesives, Cycles, Manufacturing, Silicon
Proceedings Papers

Thermal Degradation and Mass Transport of Underfill Material

Wen-Hao Lee, D. S. Liang, W. P. Wang, C. S. Hsiao
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 719-723, July 8–12, 2007
Paper No: IPACK2007-33057
DOI: https://doi.org/10.1115/IPACK2007-33057
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Topics: Absorption, Adhesion, Bond strength, Bonding, Chain, Cracking (Materials), Diffusion (Physics), Epoxy adhesives, Epoxy resins, Failure
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Paper No: IPACK2007-33170
DOI: https://doi.org/10.1115/IPACK2007-33170
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Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography
Proceedings Papers

A New Modified Crack Surface Displacement Extrapolation Method for Analysis of Package Delamination

Guojun Hu, Andrew A. O. Tay
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1207-1213, July 17–22, 2005
Paper No: IPACK2005-73238
DOI: https://doi.org/10.1115/IPACK2005-73238
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Topics: Delamination, Displacement, Fracture (Materials), Reflow soldering, Vapor pressure, Density, Diffusion (Physics), Lead-free solders, Solders, Stress
Proceedings Papers

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography

Toshihiko Sayama, Hiroyuki Tsuritani, Kentaro Uesugi, Akira Tsuchiyama, Tsukasa Nakano, Hideyuki Yasuda, Takeshi Takayanagi, Takao Mori
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1115-1121, July 17–22, 2005
Paper No: IPACK2005-73083
DOI: https://doi.org/10.1115/IPACK2005-73083
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Topics: Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Joining, Reliability, Tin, Cycles, Density, Flip-chip
Proceedings Papers

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

Toru Ikeda, Won-Keun Kim, Noriyuki Miyazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1167-1175, July 17–22, 2005
Paper No: IPACK2005-73153
DOI: https://doi.org/10.1115/IPACK2005-73153
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Topics: Bonding, Delamination, Flip-chip packages, Reflow soldering, Flip-chip, Flip-chip devices, Reliability, Fracture (Materials), Solder joints, Stress
Proceedings Papers

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

Changqing Liu, Paul Conway, Dezhi Li, Michael Hendriksen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 147-153, July 6–11, 2003
Paper No: IPACK2003-35130
DOI: https://doi.org/10.1115/IPACK2003-35130
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Topics: Flip-chip, Flip-chip devices, Solders, Manufacturing, Brittleness, Reliability, Shear (Mechanics), Shear strength, Testing, Tin
Proceedings Papers

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

Won-Keun Kim, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 741-747, July 6–11, 2003
Paper No: IPACK2003-35093
DOI: https://doi.org/10.1115/IPACK2003-35093
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Topics: Flip-chip, Flip-chip devices, Fracture (Materials), Reliability, Stress, Electronic packages, Packaging, Adhesives, Anisotropy, Delamination
Proceedings Papers

Crack Area Analysis of SnPb and SnAg Solder Joints in Plastic Ball Grid Array Packages From Dye Penetration Studies

Changyoung Park, Jose Marcio Dias Filho, Donghyun Kim, Andrew Mawer, Glenn Y. Masada, Tess J. Moon
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 701-708, July 6–11, 2003
Paper No: IPACK2003-35028
DOI: https://doi.org/10.1115/IPACK2003-35028
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Cycles, Temperature, Corners (Structural elements), Electronic packages, Furnaces, Reflow soldering, Reliability