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Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
https://doi.org/10.1115/IPACK2015-48669
View Paper titled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
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Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Thermal Imaging of Two-Phase Coooled Microgap Channel Wall

Jessica Sheehan, Dae Whan Kim, Avram Bar-Cohen
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 491-499, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89238
https://doi.org/10.1115/InterPACK2009-89238
View Paper titled, Thermal Imaging of Two-Phase Coooled Microgap Channel Wall
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Topics: Absorption, Coolers, Cooling, Dielectric liquids, Electronic components, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Imaging
Proceedings Papers

Realization of Ultra-Wideband, High-Resolution TDR for Chip-Carrier Packages

Dong-Ho Han, Bao-Shu Xu, Myoung J. Choi, Jiangqi He, Scott Gardiner, Cliff Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1499-1503, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73291
https://doi.org/10.1115/IPACK2005-73291
View Paper titled, Realization of Ultra-Wideband, High-Resolution TDR for Chip-Carrier Packages
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Topics: Resolution (Optics), Transmission lines, Ball-Grid-Array packaging, Calibration, Hardware, Reflection, Signals, Stress, Testing
Proceedings Papers

Temperature Distribution in Two-Layered Composites

Wing K. Yeung, Tung T. Lam
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 293-302, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35131
https://doi.org/10.1115/IPACK2003-35131
View Paper titled, Temperature Distribution in Two-Layered Composites
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Topics: Composite materials, Temperature distribution, Anisotropy, Algorithms, Heat, Heat conduction, Reflection, Thermal conductivity, Thermal diffusion, Wave propagation