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Proceedings Papers
Effect of Interfacial Thermal Conductance Between the Nanoparticles
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8212
Proceedings Papers
Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48191
Proceedings Papers
Heat Transfer in Nanoelectronics by Quantum Mechanics
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
Proceedings Papers
Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 269-276, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52174
Proceedings Papers
Multiphysics Approach to Modeling Supercapacitors for Improving Performance
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 165-174, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52081
Proceedings Papers
Thermotunneling Systems for Advanced Efficient Cooling
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Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 549-556, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89109
Proceedings Papers
Natural Convection From Finned Heat Sinks
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Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 541-546, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33036
Proceedings Papers
Effect of Packaging Stress in a Laser Chip on Its Radiation Spectrum
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 687-692, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33262
Proceedings Papers
Design of a Low-Cost Infrared Sensor Array Through Thermal System Modeling
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Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 513-519, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35277
Proceedings Papers
Boundary Effect on Temperature Gradients in Microchannels
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 401-409, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35190
Proceedings Papers
Antenna Miniaturization Using Flexible PBG Materials
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Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 1-5, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35010