1-17 of 17
Porosity
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Paper No: IPACK2020-2613
DOI: https://doi.org/10.1115/IPACK2020-2613
View Paper
PDF
Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

High-Performance Microchannels Development Using Magnetic Stabilization

Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 29–September 1, 2017
Paper No: IPACK2017-74147
DOI: https://doi.org/10.1115/IPACK2017-74147
View Paper
PDF
Topics: Microchannels, Particulate matter, Pressure drop, Heat transfer, Ferrites (Magnetic materials), Flow (Dynamics), Heat, Manufacturing, Mass transfer, Packing (Shipments)
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Paper No: IPACK2015-48720
DOI: https://doi.org/10.1115/IPACK2015-48720
View Paper
PDF
Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Paper No: IPACK2015-48535
DOI: https://doi.org/10.1115/IPACK2015-48535
View Paper
PDF
Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A008, July 6–9, 2015
Paper No: IPACK2015-48745
DOI: https://doi.org/10.1115/IPACK2015-48745
View Paper
PDF
Topics: Aluminum alloys, Heat sinks, Metal foams, Computer-aided design, Computerized tomography, Finite element analysis, Geometry, Computer software, Engineering systems and industry applications, Mechanical behavior
Proceedings Papers

Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A039, July 16–18, 2013
Paper No: IPACK2013-73187
DOI: https://doi.org/10.1115/IPACK2013-73187
View Paper
PDF
Topics: Energy efficiency, Heat sinks, Optimization, Porous materials, Heat transfer, Porosity, Fluids, Density, Electrical conductivity, Energy consumption
Proceedings Papers

Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity

John J. Podhiny, Alfonso Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A040, July 16–18, 2013
Paper No: IPACK2013-73189
DOI: https://doi.org/10.1115/IPACK2013-73189
View Paper
PDF
Topics: Heat sinks, Porosity, Porous materials, Design, Heat exchangers, Design methodology, Fluids, Modeling, Pressure drop, Scaling laws (Mathematical physics)
Proceedings Papers

Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale

Feng Zhou, David Geb, Ivan Catton
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 47-57, July 6–8, 2011
Paper No: IPACK2011-52020
DOI: https://doi.org/10.1115/IPACK2011-52020
View Paper
PDF
Topics: Cooling, Heat sinks, Heat transfer, Pressure drop, Reynolds number, Computational fluid dynamics, Computer simulation, Design, Flow (Dynamics), Heat
Proceedings Papers

Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows

Sidharth Paranjape, Susan N. Ritchey, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 193-202, July 6–8, 2011
Paper No: IPACK2011-52116
DOI: https://doi.org/10.1115/IPACK2011-52116
View Paper
PDF
Topics: Flow (Dynamics), Microchannel flow, Porosity, Impedance (Electricity), Two-phase flow, Electrical conductance, Electrical properties, Microchannels, Signals, Transparency
Proceedings Papers

Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders

Ram Ranjan, Abhijeet Patel, Suresh V. Garimella, Jayathi Y. Murthy
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 131-142, July 6–8, 2011
Paper No: IPACK2011-52041
DOI: https://doi.org/10.1115/IPACK2011-52041
View Paper
PDF
Topics: Columns (Structural), Cooling, Evaporation, Flat heat pipes, Heat pipes, Particulate matter, Permeability, Porosity, Pressure, Reverse engineering
Proceedings Papers

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 479-490, July 19–23, 2009
Paper No: InterPACK2009-89219
DOI: https://doi.org/10.1115/InterPACK2009-89219
View Paper
PDF
Topics: Computer cooling, Porosity, Vents, Flow (Dynamics), Cooling, Density, Fans, Pressure
Proceedings Papers

Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling

Sarng Woo Karng, Kyudae Hwang, Jongmin Moon, Seo Young Kim
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1057-1062, July 19–23, 2009
Paper No: InterPACK2009-89410
DOI: https://doi.org/10.1115/InterPACK2009-89410
View Paper
PDF
Topics: Cooling, Plates (structures), Robots, Aluminum, Copper, Water, Energy dissipation, Flow (Dynamics), Heat, Heat transfer
Proceedings Papers

Area-Averaged Void Fraction Analysis of Flow Boiling in a Microscale Branching Channel Network

Douglas Heymann, Younghoon Kwak, Lee Edward, Vinod Narayanan, James Liburdy, Deborah Pence
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 335-346, July 8–12, 2007
Paper No: IPACK2007-33517
DOI: https://doi.org/10.1115/IPACK2007-33517
View Paper
PDF
Topics: Boiling, Flow (Dynamics), Microscale devices, Porosity, Heat sinks, Flux (Metallurgy), Momentum, Algorithms, Bubbles, Evaporation
Proceedings Papers

Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites

Rory J. Jones, Daniel T. Pate, Sushil H. Bhavnani
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 347-358, July 8–12, 2007
Paper No: IPACK2007-33602
DOI: https://doi.org/10.1115/IPACK2007-33602
View Paper
PDF
Topics: Microchannel flow, Nucleation (Physics), Flow (Dynamics), Microchannels, Heat, Subcooling, Cavities, Heat sinks, Bubbly flow, Electronics
Proceedings Papers

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 757-764, July 8–12, 2007
Paper No: IPACK2007-33428
DOI: https://doi.org/10.1115/IPACK2007-33428
View Paper
PDF
Topics: Computer simulation, Data centers, Flow (Dynamics), Tiles, Computers, Modeling, Pipes, Air conditioning, Air flow, Porosity
Proceedings Papers

Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures

Kiran Balantrapu, Deepti Rao Sarde, Christopher M. Herald, Richard A. Wirtz
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 267-275, July 17–22, 2005
Paper No: IPACK2005-73191
DOI: https://doi.org/10.1115/IPACK2005-73191
View Paper
PDF
Topics: Anisotropy, Porosity, Thermal conductivity
Proceedings Papers

Pool Boiling of Water and FC-72 on Copper and Graphite Foams

Saeed Moghaddam, Michael Ohadi, Jianwei Qi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 675-680, July 6–11, 2003
Paper No: IPACK2003-35316
DOI: https://doi.org/10.1115/IPACK2003-35316
View Paper
PDF
Topics: Copper, Foams (Chemistry), Graphite, Pool boiling, Water, Boiling, Porosity, Heat, Heat transfer, Metals