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Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

High-Performance Microchannels Development Using Magnetic Stabilization

Seth Newport, Geoffrey Ormston, Michael Benedict, Ayyoub Mehdizadeh Momen
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74147
https://doi.org/10.1115/IPACK2017-74147
View Paper titled, High-Performance Microchannels Development Using Magnetic Stabilization
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Topics: Microchannels, Particulate matter, Pressure drop, Heat transfer, Ferrites (Magnetic materials), Flow (Dynamics), Heat, Manufacturing, Mass transfer, Packing (Shipments)
Proceedings Papers

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48745
https://doi.org/10.1115/IPACK2015-48745
View Paper titled, Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach
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Topics: Aluminum alloys, Heat sinks, Metal foams, Computer-aided design, Computerized tomography, Finite element analysis, Geometry, Computer software, Engineering systems and industry applications, Mechanical behavior
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48720
https://doi.org/10.1115/IPACK2015-48720
View Paper titled, Modeling the Reflow Soldering Process in PCB’s
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48535
https://doi.org/10.1115/IPACK2015-48535
View Paper titled, Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A039, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73187
https://doi.org/10.1115/IPACK2013-73187
View Paper titled, Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass
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Topics: Energy efficiency, Heat sinks, Optimization, Porous materials, Heat transfer, Porosity, Fluids, Density, Electrical conductivity, Energy consumption
Proceedings Papers

Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity

John J. Podhiny, Alfonso Ortega
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A040, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73189
https://doi.org/10.1115/IPACK2013-73189
View Paper titled, Analysis of Single-Phase Multi-Layer Heat Sinks Using a Porous Media Approach: Influence of Spatially Varying Porosity
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Topics: Heat sinks, Porosity, Porous materials, Design, Heat exchangers, Design methodology, Fluids, Modeling, Pressure drop, Scaling laws (Mathematical physics)
Proceedings Papers

Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale

Feng Zhou, David Geb, Ivan Catton
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 47-57, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52020
https://doi.org/10.1115/IPACK2011-52020
View Paper titled, Cooling Performance Comparisons of Five Different Plate-Pin Compound Heat Sinks Based on Two Different Length Scale
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Topics: Cooling, Heat sinks, Heat transfer, Pressure drop, Reynolds number, Computational fluid dynamics, Computer simulation, Design, Flow (Dynamics), Heat
Proceedings Papers

Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows

Sidharth Paranjape, Susan N. Ritchey, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 193-202, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52116
https://doi.org/10.1115/IPACK2011-52116
View Paper titled, Impedance-Based Void Fraction Measurement and Flow Regime Identification in Microchannel Flows
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Topics: Flow (Dynamics), Microchannel flow, Porosity, Impedance (Electricity), Two-phase flow, Electrical conductance, Electrical properties, Microchannels, Signals, Transparency
Proceedings Papers

Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders

Ram Ranjan, Abhijeet Patel, Suresh V. Garimella, Jayathi Y. Murthy
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 131-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52041
https://doi.org/10.1115/IPACK2011-52041
View Paper titled, Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders
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Topics: Columns (Structural), Cooling, Evaporation, Flat heat pipes, Heat pipes, Particulate matter, Permeability, Porosity, Pressure, Reverse engineering
Proceedings Papers

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 479-490, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89219
https://doi.org/10.1115/InterPACK2009-89219
View Paper titled, Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling
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Topics: Computer cooling, Porosity, Vents, Flow (Dynamics), Cooling, Density, Fans, Pressure
Proceedings Papers

Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling

Sarng Woo Karng, Kyudae Hwang, Jongmin Moon, Seo Young Kim
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1057-1062, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89410
https://doi.org/10.1115/InterPACK2009-89410
View Paper titled, Thermal Performance of a Mini Liquid-Cooled Cold Plates for Robot Cooling
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Topics: Cooling, Plates (structures), Robots, Aluminum, Copper, Water, Energy dissipation, Flow (Dynamics), Heat, Heat transfer
Proceedings Papers

Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center

Emad Samadiani, Jeffrey Rambo, Yogendra Joshi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 757-764, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33428
https://doi.org/10.1115/IPACK2007-33428
View Paper titled, Numerical Modeling of Perforated Tile Flow Distribution in a Raised-Floor Data Center
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Topics: Computer simulation, Data centers, Flow (Dynamics), Tiles, Computers, Modeling, Pipes, Air conditioning, Air flow, Porosity
Proceedings Papers

Area-Averaged Void Fraction Analysis of Flow Boiling in a Microscale Branching Channel Network

Douglas Heymann, Younghoon Kwak, Lee Edward, Vinod Narayanan, James Liburdy, Deborah Pence
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 335-346, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33517
https://doi.org/10.1115/IPACK2007-33517
View Paper titled, Area-Averaged Void Fraction Analysis of Flow Boiling in a Microscale Branching Channel Network
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Topics: Boiling, Flow (Dynamics), Microscale devices, Porosity, Heat sinks, Flux (Metallurgy), Momentum, Algorithms, Bubbles, Evaporation
Proceedings Papers

Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites

Rory J. Jones, Daniel T. Pate, Sushil H. Bhavnani
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 347-358, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33602
https://doi.org/10.1115/IPACK2007-33602
View Paper titled, Control of Instabilities in Two-Phase Microchannel Flow Using Artificial Nucleation Sites
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Topics: Microchannel flow, Nucleation (Physics), Flow (Dynamics), Microchannels, Heat, Subcooling, Cavities, Heat sinks, Bubbly flow, Electronics
Proceedings Papers

Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures

Kiran Balantrapu, Deepti Rao Sarde, Christopher M. Herald, Richard A. Wirtz
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 267-275, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73191
https://doi.org/10.1115/IPACK2005-73191
View Paper titled, Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures
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Topics: Anisotropy, Porosity, Thermal conductivity
Proceedings Papers

Pool Boiling of Water and FC-72 on Copper and Graphite Foams

Saeed Moghaddam, Michael Ohadi, Jianwei Qi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 675-680, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35316
https://doi.org/10.1115/IPACK2003-35316
View Paper titled, Pool Boiling of Water and FC-72 on Copper and Graphite Foams
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Topics: Copper, Foams (Chemistry), Graphite, Pool boiling, Water, Boiling, Porosity, Heat, Heat transfer, Metals