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Proceedings Papers

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

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Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
https://doi.org/10.1115/IPACK2024-140062
View Paper titled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
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Topics: Temperature, Testing, Circuits, Failure, Failure mechanisms, Extruding, Polysulfone, Shock (Mechanics), Silver, Accelerometers
Proceedings Papers

Lightweight, Cost-Effective Power Modules Using Polymer Baseplates With Integrated Microconvective Cooling

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David Earley, Jordan Mizerak, Chris May, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74015
https://doi.org/10.1115/IPACK2021-74015
View Paper titled, Lightweight, Cost-Effective Power Modules Using Polymer Baseplates With Integrated Microconvective Cooling
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Topics: Cooling, Electronics, Polymers, Power density, Silicon, Thermal management
Proceedings Papers

Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers

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Gargi Kailkhura, Raphael Mandel, Amir Shooshtari, Michael Ohadi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2591
https://doi.org/10.1115/IPACK2020-2591
View Paper titled, Experimental Study of a Set of Integrated Cross-Media Heat Exchangers (iCMHXs) for Liquid Cooling in Desktop Computers
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Topics: Additive manufacturing, Computational fluid dynamics, Computers, Cooling, Heat exchangers, Urethane elastomers, Sealants, Wire, Fluids, Calibration
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

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Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

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Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

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Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6416
https://doi.org/10.1115/IPACK2019-6416
View Paper titled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

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Palash V. Acharya, Vaibhav Bahadur, Robert Hebner, Abdelhamid Ouroua, Shannon Strank
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6311
https://doi.org/10.1115/IPACK2019-6311
View Paper titled, Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics
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Topics: Cooling, Electronics, Thermal management, Heat, Electronic packages, Energy dissipation, Heat sinks, Packaging, Silicon, Copper
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

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Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
https://doi.org/10.1115/IPACK2019-6389
View Paper titled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

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Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

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Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices

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Shenghui Lei, Ertugrul Kardemir, David McCloskey, John F. Donegan, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74184
https://doi.org/10.1115/IPACK2017-74184
View Paper titled, Thermo-Mechanical Study of AlN Thin-Films As Heat Spreaders in III-V Photonic Devices
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Topics: Flat heat pipes, Photonic equipment, Thermomechanics, Thin films, Stress, Waveguides, Cladding systems (Building), Design, Failure, Polymers
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

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Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Highly Stretchable Interconnects for Flexible Electronics Applications

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Yeasir Arafat, Rahul Panat, Indranath Dutta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A029, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48130
https://doi.org/10.1115/IPACK2015-48130
View Paper titled, Highly Stretchable Interconnects for Flexible Electronics Applications
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Topics: Density, Flexible electronics, Geometry, Manufacturing, Polymers
Proceedings Papers

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

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Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48262
https://doi.org/10.1115/IPACK2015-48262
View Paper titled, Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
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Topics: Computer cooling, Copper, Permeability, Sintering, Cooling, Fluids, Capillarity, Electrodeposition, Electronics, Heat flux
Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

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Ryan Lewis, Julie Slaughter, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48503
https://doi.org/10.1115/IPACK2015-48503
View Paper titled, Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination
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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination
Proceedings Papers

A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials

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Ich-Long Ngo, Chan Byon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A089, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48740
https://doi.org/10.1115/IPACK2015-48740
View Paper titled, A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials
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Topics: Composite materials, Fillers (Materials), Nanoparticles, Thermal conductivity, Particulate matter, Polymers
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

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Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
Open the PDF for Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems in another window
Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Fabrication of a Vapor Chamber on a Plastic Board

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Fumihiko Hideyama, Shuto Nonoshita, Yasushi Koito, Toshio Tomimura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A029, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48554
https://doi.org/10.1115/IPACK2015-48554
View Paper titled, Fabrication of a Vapor Chamber on a Plastic Board
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Topics: Manufacturing, Vapors, Heat transfer, Cooling, Heat, Fluids, Water, Condensers (steam plant), Copper powders, Flat heat pipes
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

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Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
https://doi.org/10.1115/IPACK2015-48105
View Paper titled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces

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Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48149
https://doi.org/10.1115/IPACK2015-48149
View Paper titled, Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces
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Topics: Flow (Dynamics), Heat transfer, Liquid films, Heat exchangers, Cooling, Design, String, Shapes, Computer simulation, Evaporative cooling