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Proceedings Papers

Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling

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Yousaf Shah, Alfonso Ortega, Mehdi Mehrabi-kermani, Victor A. Martinez, Yaman Manaserh, Ali Heydari, Jeremy Rodriguez
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140277
https://doi.org/10.1115/IPACK2024-140277
View Paper titled, Effect of Aspect Ratio and Flow Rate on the Flow Regimes and Thermal Performance of Two-Phase Micro-Channel Cold Plates for Direct to Chip Cooling
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Topics: Cooling, Data centers, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack

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Ali Heydari, Deogratius Kisitu, Alfonso Ortega, Bahareh Eslami, Pardeep Shahi, Mohammad Tradat, James Costello, Benjamin Margaritondo
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140672
https://doi.org/10.1115/IPACK2024-140672
View Paper titled, Commissioning and Thermohydraulic Characterization of a Single-Phase Liquid-Cooled High-Density Data Center Rack
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Topics: Cooling, Data centers, Density, Plates (structures)
Proceedings Papers

Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System

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Bharath Ram Ravi, Jiwon Yu, Stephen Keefe, Herman Chu, Chase Wealther
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
https://doi.org/10.1115/IPACK2024-139429
View Paper titled, Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
Open the PDF for Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System in another window
Topics: Cooling, Thermofluids, Heat, Internet of things, Artificial intelligence, Blockchain technology, Carbon footprint, Coolants, Cooling systems, Data centers
Proceedings Papers

Boiling Limit on Textured Oil-Impregnated Surfaces

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Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111736
https://doi.org/10.1115/IPACK2023-111736
View Paper titled, Boiling Limit on Textured Oil-Impregnated Surfaces
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Topics: Boiling, Bubbles, Critical heat flux, Pool boiling, Thermal management, Vapors, Heat, Copper, Delays, Failure
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

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Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

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Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

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Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

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Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
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Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

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Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
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Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

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Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97425
https://doi.org/10.1115/IPACK2022-97425
View Paper titled, Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment
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Topics: Cooling, Data centers, Flow control, Plates (structures), Transients (Dynamics)
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

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Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

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Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Open the PDF for Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server in another window
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

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Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74108
https://doi.org/10.1115/IPACK2021-74108
View Paper titled, Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
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Topics: Additive manufacturing, Cooling, Graphics processing units, Nitrogen, Plates (structures)
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

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Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement

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Deogratius Kisitu, Alfonso Ortega
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73283
https://doi.org/10.1115/IPACK2021-73283
View Paper titled, Thermal-Hydraulic Analytical Models of Split-Flow Microchannel Liquid-Cooled Cold Plates With Flow Impingement
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Topics: Cooling, Flow (Dynamics), Microchannels, Plates (structures)
Proceedings Papers

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

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Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8255
https://doi.org/10.1115/IPACK2018-8255
View Paper titled, Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System
Open the PDF for Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System in another window
Topics: Coolants, Cooling, Water, Data centers, Pumps, Stress, Temperature, Energy consumption, Heat exchangers, Exhaust systems
Proceedings Papers

Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation

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Dogacan Kara, F. Nazli Donmezer Akgun
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74125
https://doi.org/10.1115/IPACK2017-74125
View Paper titled, Electrothermal Analysis of the Field-Plated AlGaN/GaN HEMTs With SiO 2 Passivation
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Topics: Gallium nitride, Plates (structures), Collapse, Electrons, Heating, Reliability, Electric fields, Electron mobility, Engineering simulation, Joules
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

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Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48664
https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Proceedings Papers

Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters

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Suchismita Sarangi, Will A. Kuhn, Scott Rider, Claude Wright, Shankar Krishnan
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48640
https://doi.org/10.1115/IPACK2015-48640
View Paper titled, Evaluation of Cooling Technologies for Xeon Phi™ Based High Performance Computing Clusters
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Topics: Cooling, Fluids, Temperature, Boiling, Bose-Einstein condensates, Air flow, Coating processes, Coatings, Coolants, Engineering standards
Proceedings Papers

Thermodynamic Analysis of Full Liquid-Cooled Data Centers

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A. Bhalerao, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A028, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48439
https://doi.org/10.1115/IPACK2015-48439
View Paper titled, Thermodynamic Analysis of Full Liquid-Cooled Data Centers
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Topics: Data centers, Heat, Plates (structures), Cooling, Exergy, Computers, Cooling towers, Modeling, Systems analysis