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Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48491
https://doi.org/10.1115/IPACK2015-48491
View Paper titled, Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach
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Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)
Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48409
https://doi.org/10.1115/IPACK2015-48409
View Paper titled, Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling
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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients
Proceedings Papers

Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing

Richard Barnett, Dave Thomas, Oliver Ansell
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48749
https://doi.org/10.1115/IPACK2015-48749
View Paper titled, Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
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Topics: Blades, Damage, Flow (Dynamics), Lasers, Plasma etching, Plasmas (Ionized gases), Reliability, Semiconductor wafers, Traction
Proceedings Papers

Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages

Pradeep Lall, Yihua Luo, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48639
https://doi.org/10.1115/IPACK2015-48639
View Paper titled, Chlorine-Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages
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Topics: Corrosion, Wire, Diffusion (Physics), Electrolytic corrosion, Ions, Copper, Electrical resistivity, Molding, Temperature, Deformation
Proceedings Papers

Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel

Shingo Hattori, Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73170
https://doi.org/10.1115/IPACK2013-73170
View Paper titled, Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel
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Topics: Plasmas (Ionized gases), Stainless steel, Tin, Erosion, Diffusion (Physics), Temperature
Proceedings Papers

Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder

Naoya Matsubara, Ikuo Shohji, Hideyuki Kuwahara
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 673-676, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52026
https://doi.org/10.1115/IPACK2011-52026
View Paper titled, Erosion Behavior of Plasma Nitriding Stainless Steel by Molten Sn-Ag-Cu Lead-Free Solder
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Topics: Erosion, Lead-free solders, Nitriding, Plasmas (Ionized gases), Stainless steel, Tin, Diffusion (Physics), Solders, Steel
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89041
https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
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Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

Baratunde A. Cola, Xianfan Xu, Timothy S. Fisher
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 967-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33824
https://doi.org/10.1115/IPACK2007-33824
View Paper titled, Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond
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Topics: Carbon nanotubes, Diamonds, Vapors, Diamond films, Nucleation (Physics), Plasmas (Ionized gases)
Proceedings Papers

A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics

Minhua Lu, Larry Mok, R. J. Bezama
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 233-238, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73170
https://doi.org/10.1115/IPACK2005-73170
View Paper titled, A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics
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Topics: Cooling, Electronics, Foams (Chemistry), Graphite, Heat flux, Vapors, Fluids, Water, Ethanol, Thermal conductivity