1-6 of 6
Photonics
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Open the PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter in another window
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74181
https://doi.org/10.1115/IPACK2017-74181
View Paper titled, Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
Open the PDF for Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates in another window
Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, David A. Brooks, Marc Hodes, Matthew van Lieshout, Vincent P. Manno
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 37-45, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52019
https://doi.org/10.1115/IPACK2011-52019
View Paper titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
Open the PDF for Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control in another window
Topics: Heat, Temperature control, Heat sinks, Temperature, Energy consumption, Algorithms, Thermal resistance, Circuits, Currents, Electrical resistivity
Proceedings Papers

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33986
https://doi.org/10.1115/IPACK2007-33986
View Paper titled, Process Development and Die Shear Testing in MOEMS Packaging
Open the PDF for Process Development and Die Shear Testing in MOEMS Packaging in another window
Topics: Microoptoelectromechanical systems, Packaging, Shear (Mechanics), Testing, Reliability, MEMS packaging, Microelectromechanical systems, Signals, Contamination, Failure
Proceedings Papers

Thermal Management Design of a Nanoscale Biocalorimeter

Gregory J. Kowalski, Amir Talakoub, Dale Larson
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 939-946, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33404
https://doi.org/10.1115/IPACK2007-33404
View Paper titled, Thermal Management Design of a Nanoscale Biocalorimeter
Open the PDF for Thermal Management Design of a Nanoscale Biocalorimeter in another window
Topics: Design, Nanoscale phenomena, Thermal management, Temperature, Sensors, Biosensors, Calorimetry, Plasmons (Physics), Drugs, Engineering simulation
Proceedings Papers

Structural Analysis of Microelectronic and Photonic Systems

E. Suhir
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 907-920, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73249
https://doi.org/10.1115/IPACK2005-73249
View Paper titled, Structural Analysis of Microelectronic and Photonic Systems
Open the PDF for Structural Analysis of Microelectronic and Photonic Systems in another window
Topics: Photonic systems, Structural analysis, Modeling, Design, ASME honors and awards, Engineering disciplines, Engineering research, Experimental methods, Fibers, Finite element analysis