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Proceedings Papers

Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications

Qianying Wu, Chi Zhang, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2603
https://doi.org/10.1115/IPACK2020-2603
View Paper titled, Design and Fabrication of Graded Copper Inverse Opals (g-CIOs) for Capillary-Fed Boiling in High Heat Flux Cooling Applications
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Topics: Boiling, Cooling, Copper, Design, Heat flux, Manufacturing, Critical heat flux, Heat, Modeling, Permeability
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8456
https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48262
https://doi.org/10.1115/IPACK2015-48262
View Paper titled, Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
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Topics: Computer cooling, Copper, Permeability, Sintering, Cooling, Fluids, Capillarity, Electrodeposition, Electronics, Heat flux
Proceedings Papers

Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders

Ram Ranjan, Abhijeet Patel, Suresh V. Garimella, Jayathi Y. Murthy
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 131-142, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52041
https://doi.org/10.1115/IPACK2011-52041
View Paper titled, Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders
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Topics: Columns (Structural), Cooling, Evaporation, Flat heat pipes, Heat pipes, Particulate matter, Permeability, Porosity, Pressure, Reverse engineering
Proceedings Papers

Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures

Pramod Chamarthy, H. Peter J. de Bock, Boris Russ, Shakti Chauhan, Brian Rush, Stanton E. Weaver, Tao Deng, Kripa Varanasi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 419-425, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89173
https://doi.org/10.1115/InterPACK2009-89173
View Paper titled, Novel Fluorescent Visualization Method to Characterize Transport Properties in Micro/Nano Heat Pipe Wick Structures
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Topics: Heat pipes, Visualization, Permeability, Design, Computer cooling, Condensed matter, Condensers (steam plant), Flow (Dynamics), Gravity (Force), Physics
Proceedings Papers

A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics

Minhua Lu, Larry Mok, R. J. Bezama
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 233-238, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73170
https://doi.org/10.1115/IPACK2005-73170
View Paper titled, A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics
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Topics: Cooling, Electronics, Foams (Chemistry), Graphite, Heat flux, Vapors, Fluids, Water, Ethanol, Thermal conductivity
Proceedings Papers

Liquid Crystal Polymer for RF MEMS Packaging

Faheem F. Faheem, Y. C. Lee
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2061-2065, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73442
https://doi.org/10.1115/IPACK2005-73442
View Paper titled, Liquid Crystal Polymer for RF MEMS Packaging
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Topics: Liquid crystalline polymers, MEMS packaging, Microelectromechanical systems, Permeability, Sealing (Process), Circuits, Flip-chip, Flip-chip devices, Glass, Helium