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Proceedings Papers
Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73262
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A043, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73202
Proceedings Papers
Masataka Mochizuki, Thang Nguyen, Koichi Mashiko, Yuji Saito, Xiao Ping Wu, Tien Nguyen, Vijit Wuttijumnong, Randeep Singh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 653-661, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52265
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 675-679, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52287
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 929-935, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89339
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1047-1056, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89389