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Proceedings Papers

Warpage Prediction Improvements for Thin Package-on-Package Architectures

Nakul Kothari, Karthikeyan Dhandapani, Sangjae (Brandon) Lee, Manuel Aldrete, Nidheesh Puliyath
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A033, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-144090
https://doi.org/10.1115/IPACK2024-144090
View Paper titled, Warpage Prediction Improvements for Thin Package-on-Package Architectures
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Topics: Architecture, Finite element analysis, Package on package, Warping
Proceedings Papers

Study of Reliable Chip Last Process for Fan Out Wafer Level Package

Shuai-Lin Liu, Nicholas Kao, Vito Lin, Ken Zhang, Yu-Po Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111450
https://doi.org/10.1115/IPACK2023-111450
View Paper titled, Study of Reliable Chip Last Process for Fan Out Wafer Level Package
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Topics: Package on package, Packaging, Semiconductor wafers
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48168
https://doi.org/10.1115/IPACK2015-48168
View Paper titled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
https://doi.org/10.1115/IPACK2015-48741
View Paper titled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
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Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Physics Based Requirements for Qualification of BGA Components in Temperature Cycling

Ru Han, Milena Vujosevic, Min Pei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48578
https://doi.org/10.1115/IPACK2015-48578
View Paper titled, Physics Based Requirements for Qualification of BGA Components in Temperature Cycling
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Topics: Ball-Grid-Array packaging, Physics, Temperature, Adhesives, Package on package, Deformation, Reliability, Solder joints, Computer simulation, Damage
Proceedings Papers

Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands

Frank Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48387
https://doi.org/10.1115/IPACK2015-48387
View Paper titled, Attributes of Advanced Thinning and Planarization Processes in 2.5D and 3D Packaging Recognized by Market Demands
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Topics: Metals, Package on package, Packaging, Polishing, Semiconductor wafers
Proceedings Papers

New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP

Yukio Nakamura, Kenichi Oohashi, Koji Morita, Shuji Nomoto, Takayuki Suzuki, Shin Takanezawa, Shinji Tsuchikawa, Masaaki Takekoshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48836
https://doi.org/10.1115/IPACK2015-48836
View Paper titled, New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
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Topics: Density, Diluents, Fillers (Materials), Package on package, Resins, Thermal expansion, Warping
Proceedings Papers

Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

Michael Neilsen, Paul Vianco
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73074
https://doi.org/10.1115/IPACK2013-73074
View Paper titled, Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder
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Topics: Creep, Damage, Plasticity, Solders, Fatigue, Solder joints, Finite element analysis, Fracture (Materials), Package on package, Electronic packaging
Proceedings Papers

Reliability Studies for Package-on-Package Components in Drop and Shock Environments

Pradeep Lall, Arjun Angral, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 591-602, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52231
https://doi.org/10.1115/IPACK2011-52231
View Paper titled, Reliability Studies for Package-on-Package Components in Drop and Shock Environments
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Topics: Package on package, Reliability, Shock (Mechanics), Architecture, Electronics, Failure, Engineering simulation, Simulation, Warping, Design
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89321
https://doi.org/10.1115/InterPACK2009-89321
View Paper titled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
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Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage

Jason M. Brand, Myung J. Yim, Ravi Kumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 75-81, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89414
https://doi.org/10.1115/InterPACK2009-89414
View Paper titled, Investigation of Transfer Mold Process Effects on Semiconductor Package Warpage
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Topics: Materials properties, Molding, Package on package, Semiconductors (Materials), Warping
Proceedings Papers

Mechanical Design Optimization of a Package on Package

Abhilash R. Menon, Nikhil Lakhkar, Saket Karajgikar, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 177-184, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89349
https://doi.org/10.1115/InterPACK2009-89349
View Paper titled, Mechanical Design Optimization of a Package on Package
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Topics: Design engineering, Optimization, Package on package