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Proceedings Papers

Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node

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Shrinath Shrinivas Ramdas, Tushar Chauhan, Mark Patterson, Dwayne R. Shirley, Lijuan Zhang, Roberto Coccioli
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141335
https://doi.org/10.1115/IPACK2024-141335
View Paper titled, Minimizing Die Cracking Risk by Copper Pillar Design Optimization for Advanced 5nm Silicon Node
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Topics: Columns (Structural), Copper, Delamination, Design, Finite element analysis, Fracture (Process), Optimization, Risk, Silicon
Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

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Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers

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Daeyoung Kong, Heungdong Kwon, Haeun Lee, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141064
https://doi.org/10.1115/IPACK2024-141064
View Paper titled, Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers
Open the PDF for Computational Fluid Dynamics (CFD) Modeling and Optimization of Large-Scale (3 cm X 3 cm) Silicon-Based Embedded Microchannels With 3D Manifold Micro-Coolers in another window
Topics: Computational fluid dynamics, Manifolds, Microchannels, Microcoolers, Modeling, Optimization, Silicon
Proceedings Papers

Enabling Reduced Footprint SMT Components in IC Packages: A Simulation-Based Approach for Solder Paste Volume Optimization

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Nidheesh Puliyath, Huxiao Xie, Cecille Alcira, Nakul Kothari
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A034, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-149381
https://doi.org/10.1115/IPACK2024-149381
View Paper titled, Enabling Reduced Footprint SMT Components in IC Packages: A Simulation-Based Approach for Solder Paste Volume Optimization
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Topics: Optimization, Simulation, Solders
Proceedings Papers

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

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Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141171
https://doi.org/10.1115/IPACK2024-141171
View Paper titled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms
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Topics: Computational fluid dynamics, Design, Evolutionary algorithms, Optimization, Workflow, Delays, Energy consumption, Intellectual property, Temperature, Thermal analysis
Proceedings Papers

Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection

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Joseph Herring, Gautam Gupta, Jacob Lamotte-Dawaghreh, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
https://doi.org/10.1115/IPACK2023-112019
View Paper titled, Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection
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Topics: Computational fluid dynamics, Cooling, Data centers, Design, Heat sinks, Natural convection, Optimization
Proceedings Papers

Optimization of a Air-Cooled Heatsink for Immersion Cooling Application

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Gautam Gupta, Vivek Nair, Sai Abhideep Pundla, Pratik Bansode, Rohit Suthar, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112054
https://doi.org/10.1115/IPACK2023-112054
View Paper titled, Optimization of a Air-Cooled Heatsink for Immersion Cooling Application
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Topics: Cooling, Fluids, Heat sinks, Optimization
Proceedings Papers

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

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Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97886
https://doi.org/10.1115/IPACK2022-97886
View Paper titled, A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)
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Topics: Design, Heat sinks, Optimization
Proceedings Papers

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

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Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
https://doi.org/10.1115/IPACK2022-97204
View Paper titled, Power Envelope Analysis for the Thermal Optimization of a Chiplet Module
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Topics: Design, Heat sinks, Junctions, Optimization, Reliability, Resistors, Risk, Simulation, Temperature
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

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Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97481
https://doi.org/10.1115/IPACK2022-97481
View Paper titled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

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Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97218
https://doi.org/10.1115/IPACK2022-97218
View Paper titled, Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
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Topics: Bonding, Computation, Computer simulation, Deformation, Design, Engineering prototypes, Flow (Dynamics), Levitation, Optimization, Physics
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

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Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

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Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98066
https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

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Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97186
https://doi.org/10.1115/IPACK2022-97186
View Paper titled, AI/ML Applications for Thermally Aware SoC Designs
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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

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Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

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Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

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Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

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Xuhui Feng, Gilberto Moreno, Sreekant Narumanchi, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97355
https://doi.org/10.1115/IPACK2022-97355
View Paper titled, Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module
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Topics: Cooling, Design, Electronics, Finite element analysis, Optimization, Silicon
Proceedings Papers

Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module

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Hayden Carlton, Md Maksudul Hossain, Arman Ur Rashid, Yuxiang Chen, Alan Mantooth, Asif Imran, Fang Luo, John Harris, Alexis Krone, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72726
https://doi.org/10.1115/IPACK2021-72726
View Paper titled, Thermal and Electrical Co-Optimization of a Multi-Chip Double-Sided Cooled GaN Module
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Topics: Bridges (Structures), Cooling, Gallium nitride, Gates (Closures), Optimization
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

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Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74069
https://doi.org/10.1115/IPACK2021-74069
View Paper titled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages