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Proceedings Papers

Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Matthew Bowman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140062
https://doi.org/10.1115/IPACK2024-140062
View Paper titled, Behavior of Printed Hybrid Electronic Assemblies With Embedded Components in Polymeric Substrates Subject to Extreme Acceleration Levels and Elevated Temperatures
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Topics: Temperature, Testing, Circuits, Failure, Failure mechanisms, Extruding, Polysulfone, Shock (Mechanics), Silver, Accelerometers
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
Open the PDF for Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels in another window
Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
Open the PDF for Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures in another window
Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48623
https://doi.org/10.1115/IPACK2015-48623
View Paper titled, Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
Open the PDF for Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints in another window
Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
Open the PDF for Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments in another window
Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers

J. Teye Brown, Ajay M. Popat, Chad B. O’Neal, Yixiang Xie
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 743-748, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33906
https://doi.org/10.1115/IPACK2007-33906
View Paper titled, Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers
Open the PDF for Intermetallic Effects of Electroplated Lead-Free Solder Bumps Using a Novel Single Chamber Electroplating Process for Large Diameter Wafers in another window
Topics: Electroplating, Intermetallic compounds, Lead-free solders, Semiconductor wafers, Solders, Alloys, Polishing, Cross section (Physics), Electrons, Flux (Metallurgy)
Proceedings Papers

Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias

M. Reid, J. Punch, B. Rodgers, T. Galkin, T. Stenberg, O. Rusanenc, E. Elonen, M. Vile`n, K. Va¨keva¨inen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1271-1276, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73353
https://doi.org/10.1115/IPACK2005-73353
View Paper titled, Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias
Open the PDF for Prolonged Steady-State Exposure of Printed Wiring Boards Under Conditions of Temperature Humidity and Bias in another window
Topics: Printed circuit boards, Steady state, Temperature, Failure, Condensation, Density, Electronic packaging, High temperature, Microelectronic packaging, Optical microscopy
Proceedings Papers

Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball

Seungbae Park, Ramji Dhakal, Lawrence Lehman, Eric Cotts
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1095-1100, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73058
https://doi.org/10.1115/IPACK2005-73058
View Paper titled, Grain Formation and Intergrain Stresses in a Sn-Ag-Cu Solder Ball
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Topics: Solders, Stress, Tin, Solder joints, Ball-Grid-Array packaging, Deformation, Optical microscopy, Fatigue life, Grain boundaries, Imaging
Proceedings Papers

Evaluation of Surface Finish on Build Up Substrate

L. Y. Hung, Y. P. Wang, C. S. Hsiao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 839-843, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35153
https://doi.org/10.1115/IPACK2003-35153
View Paper titled, Evaluation of Surface Finish on Build Up Substrate
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Topics: Finishes, High temperature, Intermetallic compounds, Nickel, Storage, Plating, Solder joints, Shear (Mechanics), Ball-Grid-Array packaging, Electrons