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Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
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Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33986
https://doi.org/10.1115/IPACK2007-33986
View Paper titled, Process Development and Die Shear Testing in MOEMS Packaging
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Topics: Microoptoelectromechanical systems, Packaging, Shear (Mechanics), Testing, Reliability, MEMS packaging, Microelectromechanical systems, Signals, Contamination, Failure
Proceedings Papers

Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects

Alex Vukovic, Michel Savoie
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1375-1377, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73039
https://doi.org/10.1115/IPACK2005-73039
View Paper titled, Performance Characterization of a Thermal Management Concept for High-Density, High-Speed Parallel Optical Interconnects
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Topics: Density, Heat pipes, Optical interconnections, Performance characterization, Server racks, Thermal management
Proceedings Papers

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Hiren Thacker, Oluwafemi Ogunsola, Muhannad Bakir, James Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1593-1599, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73302
https://doi.org/10.1115/IPACK2005-73302
View Paper titled, Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects
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Topics: Probes, Semiconductor wafers, Testing, Columns (Structural), Microoptoelectromechanical systems, Polymers, Density, Engineering prototypes, Hardware, Microfabrication
Proceedings Papers

Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes

H. De Pauw, J. De Baets, J. Vanfleteren, A. Van Calster
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 169-176, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35192
https://doi.org/10.1115/IPACK2003-35192
View Paper titled, Integrated Optics in a Standard MCM-D Motherboard Technology Demonstrated in O/E Measurement Probes
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Topics: Optics, Probes, Fibers, Electronics, Packaging, Silicon, Anisotropy, Chemical etching, Density, Etching
Proceedings Papers

Packaging Friendly Parallel Optical Transceivers

Xiaoqing Wang, Fouad Kiamilev, George Papen, Jeremy Ekman, Ping Gui, Mike Haney, Joseph Deroba, Michael McFadden, Charles Kuznia
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 629-637, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35111
https://doi.org/10.1115/IPACK2003-35111
View Paper titled, Packaging Friendly Parallel Optical Transceivers
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Topics: Cavities, Errors, Lasers, Packaging, Algorithms, Energy consumption, Silicon-on-insulator, Circuit design, Complementary metal oxide semiconductors, Density
Proceedings Papers

Arbitrarily Configurable Optical Interconnect Fabric for Intrachip Global Communication

Michael W. Haney, Muzammil Iqbal, Michael J. McFadden
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 639-649, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35166
https://doi.org/10.1115/IPACK2003-35166
View Paper titled, Arbitrarily Configurable Optical Interconnect Fabric for Intrachip Global Communication
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Topics: Optical interconnections, Textiles, Metals, Complementary metal oxide semiconductors, Density, Design, Integrated circuits, Silicon, Wire
Proceedings Papers

Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects

Ping Gui, Fouad Kiamilev, Xiaoqing Wang, Michael McFadden, Charlie Kuznia, Jeremy Ekman, Joseph Deroba, Michael Haney
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 655-663, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35202
https://doi.org/10.1115/IPACK2003-35202
View Paper titled, Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects
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Topics: Optical interconnections, Clocks, Vacuum, Bonding, Cavities, Circuits, Complementary metal oxide semiconductors, Design, Fibers, Flip-chip
Proceedings Papers

Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module

Z. F. Shi, Albert C. W. Lu, Eric Tan, Ronson Tan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 317-321, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35141
https://doi.org/10.1115/IPACK2003-35141
View Paper titled, Numerical Study and Experimental Validation of the Thermal Performance for a Parallel Channel Optical Module
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Topics: Cavities, Computational fluid dynamics, Computer simulation, Heat sinks, Junctions, Lasers, Optical interconnections, Performance evaluation, Robustness, Signals
Proceedings Papers

Multi-Scale Optical Design for Global Chip-to-Chip Optical Interconnections and Misalignment Tolerant Packaging

Marc P. Christensen, Predrag Milojkovic, Michael J. McFadden, Michael W. Haney
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 673-680, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35287
https://doi.org/10.1115/IPACK2003-35287
View Paper titled, Multi-Scale Optical Design for Global Chip-to-Chip Optical Interconnections and Misalignment Tolerant Packaging
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Topics: Optical design techniques, Optical interconnections, Packaging, Design, Optical elements, Lenses (Optics), Multi-chip modules, Cavities, Diffraction, Errors