Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Date
Availability
1-20 of 45
Operating temperature
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Proceedings Papers
Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112036
Proceedings Papers
Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
Proceedings Papers
Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
Proceedings Papers
High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
Proceedings Papers
Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97449
Proceedings Papers
Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68870
Proceedings Papers
Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74069
Proceedings Papers
Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
Proceedings Papers
Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
Proceedings Papers
Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
Proceedings Papers
High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2659
Proceedings Papers
High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2660
Proceedings Papers
Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2675
Proceedings Papers
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6576
Proceedings Papers
Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8432
Proceedings Papers
Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
Proceedings Papers
Thermal Characterization of Si BEOL Microelectronic Structures
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8350
Proceedings Papers
Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8396
Proceedings Papers
Practical Concerns for Adoption of Microjet Cooling
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8468
Proceedings Papers
Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74169
1