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Proceedings Papers
Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
Proceedings Papers
Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
Proceedings Papers
Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2662
Proceedings Papers
Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6356
Proceedings Papers
Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8448
Proceedings Papers
Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
Proceedings Papers
Practical Concerns for Adoption of Microjet Cooling
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8468
Proceedings Papers
Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74212
Proceedings Papers
A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48678
Proceedings Papers
Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48523
Proceedings Papers
ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48441
Proceedings Papers
Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
Proceedings Papers
Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
Proceedings Papers
An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48111
Proceedings Papers
Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
Proceedings Papers
A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
Proceedings Papers
Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73126
Proceedings Papers
Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
Proceedings Papers
Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73064
Proceedings Papers
Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink
Available to Purchase
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A031, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73141
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