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Proceedings Papers

Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

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Faramarz Kahbandeh, Daniel Harris, Mehmet Arik
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
https://doi.org/10.1115/IPACK2024-141130
View Paper titled, Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
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Topics: Electronics, Heat transfer, Numerical analysis, Thermal management
Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

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Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid

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Amirreza Niazmand, Prajwal Murthy, Satyam Saini, Pardeep Shahi, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2662
https://doi.org/10.1115/IPACK2020-2662
View Paper titled, Numerical Analysis of Oil Immersion Cooling of a Server Using Mineral Oil and Al2O3 Nanofluid
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Topics: Cooling, Mineral oil, Nanofluids, Numerical analysis, Temperature, Thermal conductivity
Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

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Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6356
https://doi.org/10.1115/IPACK2019-6356
View Paper titled, Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins
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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena
Proceedings Papers

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger

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Zhuo Yang, Tariq Amin Khan, Wei Li, Hua Zhu, Zhijian Sun, Zhengjiang Zhang, Jincai Du, Jianxin Zhou
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A022, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8448
https://doi.org/10.1115/IPACK2018-8448
View Paper titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-and-Tube Heat Exchanger
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Topics: Heat exchangers, Optimization, Artificial neural networks, Flow (Dynamics), Reynolds number, Friction, Pressure drop, Computational fluid dynamics, Computer simulation, Design
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

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Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics
Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

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Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8468
https://doi.org/10.1115/IPACK2018-8468
View Paper titled, Practical Concerns for Adoption of Microjet Cooling
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Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness
Proceedings Papers

Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap

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Mahmoud Elzouka, Sidy Ndao
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74212
https://doi.org/10.1115/IPACK2017-74212
View Paper titled, Meshed Photonic Crystals for Manipulating Near-Field Thermal Radiation Across Variable Nano/Micro Gap
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Topics: Crystals, Thermal radiation, Heat transfer, Heat, Flow (Dynamics), Radiative heat transfer, Vacuum, Electronics, Engineering prototypes, Numerical analysis
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

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Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48678
https://doi.org/10.1115/IPACK2015-48678
View Paper titled, A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

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Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48523
https://doi.org/10.1115/IPACK2015-48523
View Paper titled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

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Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48441
https://doi.org/10.1115/IPACK2015-48441
View Paper titled, ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels
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Topics: Finite element methods, Heat, Mass transfer, Microchannels, Two-phase flow, Bubbles, Computer programming, Cooling, Design, Electronics
Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

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Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
https://doi.org/10.1115/IPACK2015-48744
View Paper titled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation
Proceedings Papers

Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices

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Hideo Koguchi, Naoki Kimura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48105
https://doi.org/10.1115/IPACK2015-48105
View Paper titled, Evaluation of the Strength of Interface for Multi-Layered Materials in Photonic Devices
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Topics: Bonding, Boundary element methods, Cooling, Corners (Structural elements), Delamination, Joining, Numerical analysis, Packaging, Photonic equipment, Polymers
Proceedings Papers

An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress

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Mario Gonzalez, Joeri De Vos, Geert Van der Plas, Eric Beyne
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48111
https://doi.org/10.1115/IPACK2015-48111
View Paper titled, An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
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Topics: Design, Flip-chip packages, Stress, Copper, Columns (Structural), Polishing equipment, Solders, Finite element model, Flip-chip, Flip-chip devices
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

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Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

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Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
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Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

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Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73126
https://doi.org/10.1115/IPACK2013-73126
View Paper titled, Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM
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Topics: Finite element methods, Reliability, Temperature, Finite element analysis, Resins, Electronic packages, Hardening (Curing), Heat, Integrated circuits, Materials properties
Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

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Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
https://doi.org/10.1115/IPACK2013-73063
View Paper titled, Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer
Proceedings Papers

Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System

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Sun-min Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73064
https://doi.org/10.1115/IPACK2013-73064
View Paper titled, Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System
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Topics: Cooling systems, Temperature, Design, Light-emitting diodes, Pressure drop, Heat transfer, Laminar flow, Numerical analysis, Reynolds-averaged Navier–Stokes equations, Thermal management
Proceedings Papers

Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink

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Cheng Chen, Emad Samadiani, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A031, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73141
https://doi.org/10.1115/IPACK2013-73141
View Paper titled, Comparative Numerical Analysis of Angled Branching Microchannel Heat Sink
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Topics: Heat sinks, Microchannels, Numerical analysis, Cooling systems, Heat, Pressure, Computational fluid dynamics, Design, Electronic components, Finite element analysis