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Proceedings Papers

L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
https://doi.org/10.1115/IPACK2023-111564
View Paper titled, L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
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Topics: Air conditioning, Cooling, Coolants, Heat, HVAC equipment, Artificial intelligence, Cooling loads, Data centers, Density, Fans
Proceedings Papers

Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
https://doi.org/10.1115/IPACK2017-74339
View Paper titled, Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
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Topics: Design, Tiles, Air flow, Computational fluid dynamics, Containment, Cooling, Data centers, Density, Engineering simulation, Flow (Dynamics)
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
https://doi.org/10.1115/IPACK2017-74030
View Paper titled, Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device

Jing Liu, Zhong-Shan Deng, Zhi-Zhu He
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A059, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48698
https://doi.org/10.1115/IPACK2015-48698
View Paper titled, Art and Science Towards Noiseless Driving of Liquid Metal for Advanced Thermal Management of High Heat Flux Device
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Topics: Heat flux, Liquid metals, Thermal management, Cooling, Coolants, Flow (Dynamics), Energy consumption, Heat, Batteries, Design
Proceedings Papers

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Junchao Wei, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73288
https://doi.org/10.1115/IPACK2013-73288
View Paper titled, Solid State Lighting Life Prediction Using Extended Kalman Filter
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Topics: Kalman filters, Light-emitting diodes, Failure, Physics, Failure mechanisms, High temperature, Maintenance, Noise (Sound), Climate, Damage
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52166
https://doi.org/10.1115/IPACK2011-52166
View Paper titled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
https://doi.org/10.1115/IPACK2011-52267
View Paper titled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52144
https://doi.org/10.1115/IPACK2011-52144
View Paper titled, Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures
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Topics: Bridges (Structures), Convection, Heat conduction, Nanoscale phenomena, Simulation, Displacement, Pressure, Silicon, Cooling, Diamonds
Proceedings Papers

Signal Integrity Analysis for RF System-in-Package

Jeff Chen, Weiping Li, Feng Ling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 671-674, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52282
https://doi.org/10.1115/IPACK2011-52282
View Paper titled, Signal Integrity Analysis for RF System-in-Package
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Topics: Signals, System-in-package, Design methodology, Architects, Design, Electromagnetic compatibility, Engineering simulation, Noise (Sound), Packaging, Simulation
Proceedings Papers

Signal and Power Integrity Co-Simulation on DDR Memory

Md. Ruhul Quddus, Sanjiv Soman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 641-646, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52274
https://doi.org/10.1115/IPACK2011-52274
View Paper titled, Signal and Power Integrity Co-Simulation on DDR Memory
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Topics: Signals, Simulation, Noise (Sound)
Proceedings Papers

Thermal Challenges Due to Improved RF Performance

Mitesh Parikh, Roberto Montan˜ez, Patrick Loney
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 155-159, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89180
https://doi.org/10.1115/InterPACK2009-89180
View Paper titled, Thermal Challenges Due to Improved RF Performance
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Topics: Cycles, Design, Heat, Junctions, Military systems, Modeling, Noise (Sound), Radar, Reliability, Temperature
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89016
https://doi.org/10.1115/InterPACK2009-89016
View Paper titled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89041
https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
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Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

Lang Yuan, Jignesh Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89377
https://doi.org/10.1115/InterPACK2009-89377
View Paper titled, Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
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Topics: Acoustics, Air filters, Design, Fibers, Noise (Sound), Telecommunications, Thermal management
Proceedings Papers

System Level Thermal Design Challenges in Validation Platforms

Rahima K. Mohammed, Ridvan A. Sahan, Ying-Feng Pang
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1077-1086, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89412
https://doi.org/10.1115/InterPACK2009-89412
View Paper titled, System Level Thermal Design Challenges in Validation Platforms
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Topics: Design, Cooling, Engineering simulation, Simulation, Computational fluid dynamics, Semiconductor industry, Silicon, Acoustics, Cables, Heating
Proceedings Papers

Numerical Analysis of Mist-Cooled High Power Components in Cabinets

Niru Kumari, Vaibhav Bahadur, Marc Hodes, Todd Salamon, Alan Lyons, Paul Kolodner, Suresh V. Garimella
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 933-944, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89269
https://doi.org/10.1115/InterPACK2009-89269
View Paper titled, Numerical Analysis of Mist-Cooled High Power Components in Cabinets
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Topics: Numerical analysis, Flow (Dynamics), Heat sinks, Drops, Evaporation, Telecommunications, Thermal management, Acoustics, Circuits, Cooling
Proceedings Papers

Area-Averaged Void Fraction Analysis of Flow Boiling in a Microscale Branching Channel Network

Douglas Heymann, Younghoon Kwak, Lee Edward, Vinod Narayanan, James Liburdy, Deborah Pence
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 335-346, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33517
https://doi.org/10.1115/IPACK2007-33517
View Paper titled, Area-Averaged Void Fraction Analysis of Flow Boiling in a Microscale Branching Channel Network
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Topics: Boiling, Flow (Dynamics), Microscale devices, Porosity, Heat sinks, Flux (Metallurgy), Momentum, Algorithms, Bubbles, Evaporation
Proceedings Papers

Fixed Vane Stator Development for Axial Fan Performance Improvement in Electronics Cooling

Gavin D. Stanley
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 555-564, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33306
https://doi.org/10.1115/IPACK2007-33306
View Paper titled, Fixed Vane Stator Development for Axial Fan Performance Improvement in Electronics Cooling
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Topics: Computer cooling, Stators, Computational fluid dynamics, Flow (Dynamics), Pressure, Blades, Fans, Modeling, Experimental design, Acoustics
Proceedings Papers

Closed Loop Liquid Cooling for High Performance Computer Systems

Sukhvinder Kang, David Miller, John Cennamo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 509-515, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33870
https://doi.org/10.1115/IPACK2007-33870
View Paper titled, Closed Loop Liquid Cooling for High Performance Computer Systems
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Topics: Computers, Cooling, Heat, Cooling systems, Copper, Fluids, Graphics processing units, Stress, Temperature, Coolants