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Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

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Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72975
https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

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Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6501
https://doi.org/10.1115/IPACK2019-6501
View Paper titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat
Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

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Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

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L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74130
https://doi.org/10.1115/IPACK2017-74130
View Paper titled, Power Packaging Thermal and Stress Model for Quick Parametric Analyses
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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model

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Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74129
https://doi.org/10.1115/IPACK2017-74129
View Paper titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model
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Topics: Mechanical properties, Network models, Particulate matter, Thermal conductivity, Brittleness, Computer simulation, Elastic moduli, Heat, Heat sinks, Particle size
Proceedings Papers

Development of a Raised-Floor Plenum Design Tool

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James W. VanGilder, Xuanhang (Simon) Zhang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48432
https://doi.org/10.1115/IPACK2015-48432
View Paper titled, Development of a Raised-Floor Plenum Design Tool
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Topics: Design, Air flow, Tiles, Computational fluid dynamics, Cables, Construction, Cooling, Engineering simulation, Flow (Dynamics), Leakage
Proceedings Papers

A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

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Stephen H. Taylor, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A051, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73283
https://doi.org/10.1115/IPACK2013-73283
View Paper titled, A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions
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Topics: Capacitance, Electrodes, Junctions, Electric fields, Design, Sensors, Circuits, Dimensions, Fracture (Materials), Network models
Proceedings Papers

A Flow-Network Model for Predicting Rack Cooling in Containment Systems

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Saurabh K. Shrivastava, James W. VanGilder
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 785-791, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89161
https://doi.org/10.1115/InterPACK2009-89161
View Paper titled, A Flow-Network Model for Predicting Rack Cooling in Containment Systems
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Topics: Containment systems, Cooling, Flow (Dynamics), Air flow, Computational fluid dynamics, Containment, Cooling systems, Data centers, Dimensions, Heat
Proceedings Papers

An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

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Bo Dan, Sasanka Kanuparthi, Ganesh Subbarayan, Bahgat G. Sammakia
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 69-81, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89116
https://doi.org/10.1115/InterPACK2009-89116
View Paper titled, An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
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Topics: Network models, Particulate matter, Thermal conductivity, Approximation, Dimensions, Finite element model, Engineering simulation, Fillers (Materials), Simulation, Temperature distribution
Proceedings Papers

Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board

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Wataru Nakayama, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 645-652, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33605
https://doi.org/10.1115/IPACK2007-33605
View Paper titled, Heat Conduction in Printed Circuit Boards: Part I — Overview and the Case of a JEDEC Test Board
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Topics: Heat conduction, Printed circuit boards, Modeling, Temperature, Ball-Grid-Array packages, Composite materials, Computation, Convection, Electronic equipment, Heat transfer
Proceedings Papers

Modeling and Optimization of Multilayer Minichannel Heat Sinks in Single-Phase Flow

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Ning Lei, Alfonso Ortega, Ranji Vaidyanathan
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 29-43, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33329
https://doi.org/10.1115/IPACK2007-33329
View Paper titled, Modeling and Optimization of Multilayer Minichannel Heat Sinks in Single-Phase Flow
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Topics: Flow (Dynamics), Heat sinks, Modeling, Optimization, Copper, Simulation, Thermal resistance, Heat, Pressure drop, Channel flow
Proceedings Papers

Electro Thermal Modeling of the Micro Flow Sensor With Feedback Control Circuit Using SPICE

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Shoji Kamiunten, Hidetomo Nagayo, Masahiro Motosuke, Shinji Honami
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 343-350, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33769
https://doi.org/10.1115/IPACK2007-33769
View Paper titled, Electro Thermal Modeling of the Micro Flow Sensor With Feedback Control Circuit Using SPICE
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Topics: Circuits, Feedback, Flow sensors, Modeling, Flow (Dynamics), Simulation, Channel flow, Convection, Energy budget (Physics), Fluid dynamics
Proceedings Papers

Simplified Network Based Modeling of Cold Plate in a CFD Environment

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Debabrata Pal, Mark Severson
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1421-1426, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73202
https://doi.org/10.1115/IPACK2005-73202
View Paper titled, Simplified Network Based Modeling of Cold Plate in a CFD Environment
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Topics: Computational fluid dynamics, Modeling, Flow (Dynamics), Electronics, Manufacturing, Plates (structures), Aerospace industry, Boundary-value problems, Design, Heat
Proceedings Papers

Thermal Characterization of Dual-Core Processor in Computer Equipment

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Manoj Nagulapally, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 487-491, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73365
https://doi.org/10.1115/IPACK2005-73365
View Paper titled, Thermal Characterization of Dual-Core Processor in Computer Equipment
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Topics: Agglomeration (Materials), Boundary-value problems, Computational fluid dynamics, Computers, Energy conservation, Engineering simulation, Network models, Physics, Simulation, Simulation results
Proceedings Papers

Automatic Generation and Validation of Compact Network Models for a Fine Pitch BGA Package

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Manoj Nagulapally, Sam Ziqun Zhao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 411-416, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35196
https://doi.org/10.1115/IPACK2003-35196
View Paper titled, Automatic Generation and Validation of Compact Network Models for a Fine Pitch BGA Package
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Topics: Ball-Grid-Array packages, Network models, Computational fluid dynamics, Engineering simulation, Simulation, Agglomeration (Materials), Ball-Grid-Array packaging, Boundary-value problems, Computer simulation, Cooling