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Proceedings Papers

Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection

Joseph Herring, Gautam Gupta, Jacob Lamotte-Dawaghreh, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
https://doi.org/10.1115/IPACK2023-112019
View Paper titled, Single-Phase Immersion Cooling Multi-Design Variable Heat Sink Optimization for Natural Convection
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Topics: Computational fluid dynamics, Cooling, Data centers, Design, Heat sinks, Natural convection, Optimization
Proceedings Papers

A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server

Gautam Gupta, Vivek Nair, Pratik Bansode, Rohit Suthar, Sai Abhideep Pundla, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112065
https://doi.org/10.1115/IPACK2023-112065
View Paper titled, A Numerical Study Comparing Forced and Natural Convection in a High-Density Single-Phase Immersed Cooled Server
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Topics: Cooling, Density, Forced convection, Natural convection
Proceedings Papers

Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application

Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111804
https://doi.org/10.1115/IPACK2023-111804
View Paper titled, Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application
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Topics: Additive manufacturing, Cooling, Design, Heat sinks, Natural convection
Proceedings Papers

Partitioned Heat Sinks for Improved Natural Convection

Todd Salamon, Roger Kempers, Brian Lynch, Kevin Terrell, Elina Simon
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2553
https://doi.org/10.1115/IPACK2020-2553
View Paper titled, Partitioned Heat Sinks for Improved Natural Convection
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Topics: Heat sinks, Natural convection
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48522
https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection

Bin Li, Chan Byon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48191
https://doi.org/10.1115/IPACK2015-48191
View Paper titled, Orientation Effects on Thermal Performance of Radial Heat Sinks Subject to Natural Convection
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Topics: Heat sinks, Natural convection, Computer simulation, Finite volume methods, Fins, Gravity (Force), Heat transfer, Radiation (Physics)
Proceedings Papers

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

Nico Setiawan Effendi, Kyoung Joon Kim
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48630
https://doi.org/10.1115/IPACK2015-48630
View Paper titled, Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management
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Topics: Heat sinks, Thermal management, Thermal resistance, Tool steel, Heat, Computational fluid dynamics, Cooling, Energy dissipation, Natural convection
Proceedings Papers

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48499
https://doi.org/10.1115/IPACK2015-48499
View Paper titled, Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances
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Topics: Phase change materials, Thermal management, Energy dissipation, Heat, Temperature, Thermal conductivity, Density, Energy consumption, Flow (Dynamics), Heat capacity
Proceedings Papers

Thermal Modeling of Remote Radio Head Units

Manasa Sahini, Betsegaw Gebrehiwot, Dereje Agonafer, Rocky Colapietro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A087, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48606
https://doi.org/10.1115/IPACK2015-48606
View Paper titled, Thermal Modeling of Remote Radio Head Units
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Topics: Modeling, Air flow, Temperature, Computational fluid dynamics, Cooling, Natural convection, Boundary-value problems, Design, Exhaust systems, Heat
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48175
https://doi.org/10.1115/IPACK2015-48175
View Paper titled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection
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Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73106
https://doi.org/10.1115/IPACK2013-73106
View Paper titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
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Topics: Copper, Foams (Chemistry), Evaporation, Computer cooling, Containers, Ethanol, Flux (Metallurgy), Heat, Heat conduction, Heat pipes
Proceedings Papers

Advanced Natural Convection Cooling Designs for LED Bulb Systems

James Petroski
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A035, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73179
https://doi.org/10.1115/IPACK2013-73179
View Paper titled, Advanced Natural Convection Cooling Designs for LED Bulb Systems
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Topics: Cooling, Heat sinks, Natural convection
Proceedings Papers

Novel Immersion Cooling Technique for a 3D Chip Stack

Ashish Sinha, Krishna Kota, Pablo Hidalgo, Yogendra Joshi, Ari Glezer
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73039
https://doi.org/10.1115/IPACK2013-73039
View Paper titled, Novel Immersion Cooling Technique for a 3D Chip Stack
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Topics: Cooling, Fluids, Electronics, Heat, Copper, Water, Convection, Energy dissipation, Heat conduction, Heat sinks
Proceedings Papers

Effect of Fin Interruptions on Natural Convection Heat Transfer From a Rectangular Interrupted Single-Wall

Golnoosh Mostafavi, Mehran Ahmadi, Majid Bahrami
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A029, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73129
https://doi.org/10.1115/IPACK2013-73129
View Paper titled, Effect of Fin Interruptions on Natural Convection Heat Transfer From a Rectangular Interrupted Single-Wall
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Topics: Computer simulation, Computer software, Convection, Fins, Heat transfer, Manufacturing, Natural convection, Steady state, Vertical plates, Weight (Mass)
Proceedings Papers

Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution

A. Tamayol, F. McGregor, E. Demian, E. Trandafir, P. Bowler, P. Rada, M. Bahrami
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 269-276, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52174
https://doi.org/10.1115/IPACK2011-52174
View Paper titled, Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution
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Topics: Fins, Heat transfer, Radiation (Physics), Natural convection, Heat, Temperature distribution
Proceedings Papers

Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance

Cong Yue, Jun Lu, Xiaotian Zhang, Yueh-Se Ho
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 285-292, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52188
https://doi.org/10.1115/IPACK2011-52188
View Paper titled, Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance
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Topics: Simulation, Wire, Thermal resistance, Finite element model, Gages, Junctions, Natural convection, Power semiconductor devices, Testing, Transistors
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89041
https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
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Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Proceedings Papers

Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer

Ronald Warzoha, Amy Fleischer, Simon D. Bird, Mahesh Gandhi, Ashok Sundaram
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89294
https://doi.org/10.1115/InterPACK2009-89294
View Paper titled, Design of a Passive Cooling System for a Solid-State 15kV / 100kVA Intelligent Universal Transformer
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Topics: Cooling systems, Design, Heat, Stress, Control systems, Forced convection, Mineral oil, Natural convection, Power grids, Renewable energy
Proceedings Papers

Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition

Jiahui Zhang, Dave Weber, Jason Waggel, Tony Pollice, Marco Matuonto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 963-972, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89310
https://doi.org/10.1115/InterPACK2009-89310
View Paper titled, Analysis for Single Board Computer Module Cooling Under Natural Air Convection Condition
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Topics: Computers, Convection, Cooling, Heat conduction, Heat sinks, Natural convection, Optimization