1-20 of 47
Nanoparticles
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

Available to Purchase

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
https://doi.org/10.1115/IPACK2023-111958
View Paper titled, Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer
Open the PDF for Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer in another window
Topics: Aerosols, Failure, Inks, Nanoparticles, Shear (Mechanics), Silver, Stress, Sustainability, Water
Proceedings Papers

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

Available to Purchase

Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
https://doi.org/10.1115/IPACK2023-111957
View Paper titled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink
Open the PDF for Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink in another window
Topics: Additive manufacturing, Aerosols, Circuits, Inks, Nanoparticles, Silver, Surface mount components, Sustainability, Water
Proceedings Papers

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Available to Purchase

Joshua Kasitz, Larry Marshall, Jr., David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
https://doi.org/10.1115/IPACK2022-97399
View Paper titled, Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability
Open the PDF for Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability in another window
Topics: Cooling, Heat transfer, Nanoparticles, Phase change materials, Thermal conductivity
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Available to Purchase

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Open the PDF for Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits in another window
Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Available to Purchase

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69254
https://doi.org/10.1115/IPACK2021-69254
View Paper titled, Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material
Open the PDF for Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material in another window
Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Available to Purchase

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68121
https://doi.org/10.1115/IPACK2021-68121
View Paper titled, An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems
Open the PDF for An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems in another window
Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink

Available to Purchase

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2664
https://doi.org/10.1115/IPACK2020-2664
View Paper titled, Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink
Open the PDF for Development of Process-Recipes for Multi-Layer Circuitry Printing With Z-Axis Interconnects Using Aerosol-Jet Nanoparticle Ink in another window
Topics: Aerosols, Failure, Inks, Nanoparticles, Printing, Shear (Mechanics), Stress
Proceedings Papers

CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles

Available to Purchase

Pardeep Shahi, Sarthak Agarwal, Satyam Saini, Amirreza Niazmand, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2592
https://doi.org/10.1115/IPACK2020-2592
View Paper titled, CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles
Open the PDF for CFD Analysis on Liquid Cooled Cold Plate Using Copper Nanoparticles in another window
Topics: Computational fluid dynamics, Copper, Data centers, Nanoparticles
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Available to Purchase

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
Open the PDF for Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density in another window
Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Available to Purchase

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6426
https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
Open the PDF for Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature in another window
Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Available to Purchase

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
Open the PDF for Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours in another window
Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Available to Purchase

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8301
https://doi.org/10.1115/IPACK2018-8301
View Paper titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure
Open the PDF for Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure in another window
Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability
Proceedings Papers

A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light

Available to Purchase

Ashreet Mishra, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A017, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8387
https://doi.org/10.1115/IPACK2018-8387
View Paper titled, A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light
Open the PDF for A Novel Activated Carbon Enabled Steam Generation System Under Simulated Solar Light in another window
Topics: Activated carbon, Steam, Sunlight, Carbon nanotubes, Nanoparticles, Water, Solar energy, Evaporation, Light, Medical devices
Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Available to Purchase

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8212
https://doi.org/10.1115/IPACK2018-8212
View Paper titled, Effect of Interfacial Thermal Conductance Between the Nanoparticles
Open the PDF for Effect of Interfacial Thermal Conductance Between the Nanoparticles in another window
Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management
Proceedings Papers

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

Available to Purchase

Michael Ozeh, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8354
https://doi.org/10.1115/IPACK2018-8354
View Paper titled, Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink
Open the PDF for Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink in another window
Topics: Generators, Heat recovery, Heat sinks, Heat pipes, Nanoparticles, Electronics, Heat, Heat exchangers, Metals, Temperature gradient
Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Available to Purchase

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74173
https://doi.org/10.1115/IPACK2017-74173
View Paper titled, Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
Open the PDF for Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering in another window
Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation
Proceedings Papers

Advanced Cooling of 3D ICs With Nanoparticle Packings

Available to Purchase

Anil Yuksel, Paul S. Ho, Jayathi Murthy
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74137
https://doi.org/10.1115/IPACK2017-74137
View Paper titled, Advanced Cooling of 3D ICs With Nanoparticle Packings
Open the PDF for Advanced Cooling of 3D ICs With Nanoparticle Packings in another window
Topics: Cooling, Nanoparticles, Packings (Cushioning), Energy dissipation, Heat, Thermal management, Dimensions, High temperature, Phonons, Polaritons
Proceedings Papers

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

Available to Purchase

Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74178
https://doi.org/10.1115/IPACK2017-74178
View Paper titled, Silica Nanoparticle Formation by Using Droplet-Based Microreactor
Open the PDF for Silica Nanoparticle Formation by Using Droplet-Based Microreactor in another window
Topics: Drops, Nanoparticles, Coating processes, Coatings, Microfluidics, Particulate matter, Quantum dots
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Available to Purchase

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
Open the PDF for Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes in another window
Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method

Available to Purchase

Md Taibur Rahman, Rahul Panat, Deuk Heo
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48187
https://doi.org/10.1115/IPACK2015-48187
View Paper titled, 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method
Open the PDF for 3-D Antenna Structures Using Novel Direct-Write Additive Manufacturing Method in another window
Topics: Additive manufacturing, Aerosols, Metals, Inks, Manufacturing, Nanoparticles, Shapes, Sintering, Ultraviolet radiation, Wavelength