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Proceedings Papers

Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity

Bidzina Kekelia, J. Emily Cousineau, Rajneesh Chaudhary, Jeff Tomerlin, Sreekant Narumanchi, Vandana Rallabandi, Jon Wilkins, Shajjad Chowdhury, Himel Barua, Mostak Mohammad, Burak Ozpineci
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141631
https://doi.org/10.1115/IPACK2024-141631
View Paper titled, Thermal Management System of an Outer-Rotor-Motor-Based Traction Drive With Integrated Power Electronics in its Central Cavity
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Topics: Cavities, Cooling, Electric motors, Electronics, Engines, Motors, Rotors, Thermal management, Traction
Proceedings Papers

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97669
https://doi.org/10.1115/IPACK2022-97669
View Paper titled, Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model
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Topics: Control systems, Design, Electric vehicles, Power converters, Automobiles, Batteries, Electronic components, Energy management, Modeling, Motors
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2524
https://doi.org/10.1115/IPACK2020-2524
View Paper titled, Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2550
https://doi.org/10.1115/IPACK2020-2550
View Paper titled, Validation and Parametric Investigations Using a Lumped Thermal Parameter Model of an Internal Permanent Magnet Motor
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Topics: Electric motors, Engines, Finite element analysis, Motors, Permanent magnets, Sensitivity analysis, Thermal management
Proceedings Papers

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6423
https://doi.org/10.1115/IPACK2019-6423
View Paper titled, Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)
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Topics: Motors, Permanent magnets, Stators, Electric propulsion, Emissions, Maintenance, Winding (process), Damage, Flaw detection, Mechanical admittance
Proceedings Papers

Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters

Bakhtiyar Mohammad Nafis, Ange Iradukunda, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8280
https://doi.org/10.1115/IPACK2018-8280
View Paper titled, Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters
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Topics: Design, Electric vehicles, Reliability, Traction, Temperature, Cooling, Roads, Temperature profiles, Batteries, Electric motors
Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8210
https://doi.org/10.1115/IPACK2018-8210
View Paper titled, Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump
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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74306
https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

Hsien-Chin Su
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48151
https://doi.org/10.1115/IPACK2015-48151
View Paper titled, A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force
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Topics: Cooling systems, Electromagnetic force, Cooling, Blades, Dimensions, Electromagnets, Bearings, Design, Energy consumption, Engines
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48516
https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot

Naveen Kannan, Niket Shah, Dereje Agonafer, Alan Bowling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 257-262, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52160
https://doi.org/10.1115/IPACK2011-52160
View Paper titled, Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot
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Topics: Control equipment, Design, Engines, Motors, Optimization, Robots, Thermal analysis, Heat, Computer programming, Computers
Proceedings Papers

Reliable Power Electronics for Wind Turbines

Patrick McCluskey, Peter Hansen, Douglas DeVoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 771-773, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89174
https://doi.org/10.1115/InterPACK2009-89174
View Paper titled, Reliable Power Electronics for Wind Turbines
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Topics: Electronics, Wind turbines, Electronic systems, Failure, Fatigue, Packaging, Heat, Temperature, Bonding, Ceramics
Proceedings Papers

System Level Transient Thermal Performance of High-Power Dynamic Microelectronics

Victor Chiriac
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89110
https://doi.org/10.1115/InterPACK2009-89110
View Paper titled, System Level Transient Thermal Performance of High-Power Dynamic Microelectronics
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Topics: Computer simulation, Microelectronic devices, Motors, Transients (Dynamics)
Proceedings Papers

Characterization of Electrical Failure Modes in Chip-on-Board Assemblies for Extreme Temperature Environments

Donald V. Schatzel, Andrew A. Shapiro
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 835-844, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73036
https://doi.org/10.1115/IPACK2005-73036
View Paper titled, Characterization of Electrical Failure Modes in Chip-on-Board Assemblies for Extreme Temperature Environments
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Topics: Failure mechanisms, Temperature, Cycles, Design, Vehicles, Electronics, Failure, Reliability, Technology development, Automotive design