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Proceedings Papers

A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling

Satyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
https://doi.org/10.1115/IPACK2023-112005
View Paper titled, A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
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Topics: Cooling, Data centers, Heat sinks, Heat transfer, Mixed convection, Thermal management
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
https://doi.org/10.1115/InterPACK2009-89340
View Paper titled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows

Mehmet Arik, Yogen Utturkar, Mustafa Gursoy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 123-128, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33188
https://doi.org/10.1115/IPACK2007-33188
View Paper titled, Interaction of Synthetic Jet Cooling Performance With Gravity and Buoyancy Driven Flows
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Topics: Buoyancy, Cooling, Flow (Dynamics), Gravity (Force), Heat transfer, Boundary layers, Convection, Cross-flow, Energy dissipation, Heat
Proceedings Papers

Convective Heat Transfer From Confined Heated Surfaces With Slot Jet Impingement

L. K. Liu, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 161-168, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73120
https://doi.org/10.1115/IPACK2005-73120
View Paper titled, Convective Heat Transfer From Confined Heated Surfaces With Slot Jet Impingement
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Topics: Convection, Transients (Dynamics), Steady state, Heat transfer, Buoyancy, Composite materials, Heat flux, Mixed convection
Proceedings Papers

The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows

Masaru Ishizuka, Shinji Nakagawa, Toru Honma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 11-18, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73011
https://doi.org/10.1115/IPACK2005-73011
View Paper titled, The Performance of Small Heat Sinks for LSI Packages in Combined Natural and Forced Convection Air Flows
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Topics: Air flow, Heat sinks, Mixed convection, Temperature, Convection, Design, Specific heat, Wind tunnels, Cooling, Forced convection
Proceedings Papers

Thermal Performance of Thermally Enhanced PBGA Packages

Sriram Neelakantan, Bennett Joiner
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 451-459, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73303
https://doi.org/10.1115/IPACK2005-73303
View Paper titled, Thermal Performance of Thermally Enhanced PBGA Packages
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Topics: Ball-Grid-Array packaging, Clearances (Engineering), Computational fluid dynamics, Copper, Electrical conductivity, Finite element analysis, Heat, Heat sinks, Metals, Mixed convection
Proceedings Papers

Transient Mixed-Convection With Applications to Cooling of Biomaterials

Saurabh Shrivastava, Bahgat Sammakia
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 337-344, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73235
https://doi.org/10.1115/IPACK2005-73235
View Paper titled, Transient Mixed-Convection With Applications to Cooling of Biomaterials
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Topics: Biomaterials, Cavities, Cooling, Mixed convection, Transients (Dynamics)