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Proceedings Papers
Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
Proceedings Papers
Advanced Cooling Designs for GaN-on-Diamond MMICs
Available to PurchaseGeoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
Proceedings Papers
Novel Thermal Management of GaN Electronics: Diamond Substrates
Available to PurchaseMartin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
Proceedings Papers
Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
Proceedings Papers
Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 703-708, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52064
Proceedings Papers
Optimization of the Tip of Microwave AFM Probe
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 485-490, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89252
Proceedings Papers
Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 963-966, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33613
Proceedings Papers
3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
Proceedings Papers
Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1989-1993, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73469
Proceedings Papers
Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73419
Proceedings Papers
Fabrication of the Tip of GaAs Microwave Probe by Wet Etching
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1919-1922, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73140
Proceedings Papers
Antenna Miniaturization Using Flexible PBG Materials
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 1-5, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35010
Proceedings Papers
Microwave Imaging of Conductivity Distribution of Silicon Wafers
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35117
Proceedings Papers
Characterization of Vertical Interconnects in 3-D System in a Package
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Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 13-18, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35247
Proceedings Papers
Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 827-831, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35134
Proceedings Papers
Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 545-550, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35256
Proceedings Papers
Low Cycle Fatigue in RF Microwave Module Housings
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 859-866, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35263