1-17 of 17
Microwaves
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

Available to Purchase

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
https://doi.org/10.1115/IPACK2015-48179
View Paper titled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
Open the PDF for Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN in another window
Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Available to Purchase

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
Open the PDF for Advanced Cooling Designs for GaN-on-Diamond MMICs in another window
Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Novel Thermal Management of GaN Electronics: Diamond Substrates

Available to Purchase

Martin Kuball, James W. Pomeroy, Julian Anaya Calvo, Huarui Sun, Roland B. Simon, Daniel Francis, Firooz Faili, Daniel Twitchen, Stefano Rossi, Mohammed Alomari, Erhard Kohn, Lajos Tóth, Béla Pécz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T08A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48145
https://doi.org/10.1115/IPACK2015-48145
View Paper titled, Novel Thermal Management of GaN Electronics: Diamond Substrates
Open the PDF for Novel Thermal Management of GaN Electronics: Diamond Substrates in another window
Topics: Diamonds, Electronics, Gallium nitride, Thermal management, Thermal conductivity, Heat transfer, Junctions, Microwaves, Semiconductor wafers, Temperature
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Available to Purchase

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
Open the PDF for Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program in another window
Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain

Available to Purchase

Yusuke Ohashi, Yusuke Suzuki, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 703-708, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52064
https://doi.org/10.1115/IPACK2011-52064
View Paper titled, Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain
Open the PDF for Non-Contact and Remote Measurement Method of the Change of the Electrical Conductivity of Carbon Nanotubes-Dispersed Resin Under Strain in another window
Topics: Carbon, Electrical conductivity, Nanotubes, Resins, Carbon nanotubes, Microwaves, Reflectance, Impedance (Electricity), Stress, Electrical properties
Proceedings Papers

Optimization of the Tip of Microwave AFM Probe

Available to Purchase

Yang Ju, Motohiro Hamada, Atsushi Hosoi, Akifumi Fujimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 485-490, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89252
https://doi.org/10.1115/InterPACK2009-89252
View Paper titled, Optimization of the Tip of Microwave AFM Probe
Open the PDF for Optimization of the Tip of Microwave AFM Probe in another window
Topics: Atomic force microscopy, Microwaves, Optimization, Probes, Gallium arsenide, Manufacturing, Resolution (Optics), Waveguides, Cantilevers, Diffraction gratings
Proceedings Papers

Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope

Available to Purchase

Yang Ju, Tetsuya Kobayashi, Hitoshi Soyama
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 963-966, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33613
https://doi.org/10.1115/IPACK2007-33613
View Paper titled, Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope
Open the PDF for Fabrication of a GaAs Microwave Probe Used for Atomic Force Microscope in another window
Topics: Atomic force microscopy, Gallium arsenide, Manufacturing, Microwaves, Probes, Waveguides, Cantilevers, Diffraction gratings, Dimensions, Evaporation
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

Available to Purchase

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
Open the PDF for 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies in another window
Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

Available to Purchase

Woon Choi, Shintaro Ono, Seiichiro Yoshida, Hajime Tomokage
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1989-1993, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73469
https://doi.org/10.1115/IPACK2005-73469
View Paper titled, Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates
Open the PDF for Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates in another window
Topics: Ceramics, Inductors, Low temperature, Design, Simulation results, Microscopes, Lasers, Microwaves, System-in-package
Proceedings Papers

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Available to Purchase

Daniel J. Hyman, Roger Kuroda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73419
https://doi.org/10.1115/IPACK2005-73419
View Paper titled, Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry
Open the PDF for Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry in another window
Topics: Flip-chip assemblies, Microelectromechanical systems, Microwaves, Packaging, Flip-chip, Reliability, Filters, Performance characterization, Yield strength
Proceedings Papers

Fabrication of the Tip of GaAs Microwave Probe by Wet Etching

Available to Purchase

Yang Ju, Hiroyuki Sato, Hitoshi Soyama
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1919-1922, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73140
https://doi.org/10.1115/IPACK2005-73140
View Paper titled, Fabrication of the Tip of GaAs Microwave Probe by Wet Etching
Open the PDF for Fabrication of the Tip of GaAs Microwave Probe by Wet Etching in another window
Topics: Chemical etching, Gallium arsenide, Manufacturing, Microwaves, Probes, Etching, Atomic force microscopy, Atoms, Microscopes, Semiconductor wafers
Proceedings Papers

Antenna Miniaturization Using Flexible PBG Materials

Available to Purchase

Pekka Salonen, Lauri Syda¨nheimo, Mikko Keskilammi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 1-5, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35010
https://doi.org/10.1115/IPACK2003-35010
View Paper titled, Antenna Miniaturization Using Flexible PBG Materials
Open the PDF for Antenna Miniaturization Using Flexible PBG Materials in another window
Topics: Ceramics, Design, Dimensions, Energy gap, Microwaves, Physical laws, Radiation (Physics), Resonance, Signals, Standing waves
Proceedings Papers

Microwave Imaging of Conductivity Distribution of Silicon Wafers

Available to Purchase

Yang Ju, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 61-64, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35117
https://doi.org/10.1115/IPACK2003-35117
View Paper titled, Microwave Imaging of Conductivity Distribution of Silicon Wafers
Open the PDF for Microwave Imaging of Conductivity Distribution of Silicon Wafers in another window
Topics: Electrical conductivity, Imaging, Microwaves, Semiconductor wafers, Thermal conductivity, Reflectance, Sensors, Signals, Resolution (Optics)
Proceedings Papers

Characterization of Vertical Interconnects in 3-D System in a Package

Available to Purchase

Qinghua Kang, Altan M. Ferendeci
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 13-18, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35247
https://doi.org/10.1115/IPACK2003-35247
View Paper titled, Characterization of Vertical Interconnects in 3-D System in a Package
Open the PDF for Characterization of Vertical Interconnects in 3-D System in a Package in another window
Topics: System-in-package, Circuits, Microwaves, Microelectromechanical systems, Dimensions, Junctions, Microfabrication, Millimeter waves, Transmission lines, Wavelength
Proceedings Papers

Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications

Available to Purchase

Liang Chai, Aziz Shaikh, Vern Stygar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 827-831, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35134
https://doi.org/10.1115/IPACK2003-35134
View Paper titled, Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications
Open the PDF for Characterization of A6 LTCC Systems for Microwave and Millimeter-Wave Applications in another window
Topics: Microwaves, Millimeter waves, Strip transmission lines, Ceramics, Metals, Silver, Arches, Capacitors, Cavities, Imaging
Proceedings Papers

Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars

Available to Purchase

James S. Wilson
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 545-550, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35256
https://doi.org/10.1115/IPACK2003-35256
View Paper titled, Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars
Open the PDF for Microwave Module Thermal Considerations for Future Higher Powered MMICs in Phased Array Radars in another window
Topics: Design, Electricity (Physics), Energy dissipation, Energy generation, Heat, Integrated circuits, Junctions, Microwaves, Packaging, Radar
Proceedings Papers

Low Cycle Fatigue in RF Microwave Module Housings

Available to Purchase

Terry V. Baughn, Shea Chen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 859-866, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35263
https://doi.org/10.1115/IPACK2003-35263
View Paper titled, Low Cycle Fatigue in RF Microwave Module Housings
Open the PDF for Low Cycle Fatigue in RF Microwave Module Housings in another window
Topics: Low cycle fatigue, Microwaves, Metals, Pressure, Ceramics, Cycles, Electronics, High cycle fatigue, Circuits, Fatigue life