1-20 of 25
Microscopy
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape

Kaiying Jiang, Heungdong Kwon, Hansen Qiao, Yini He, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140287
https://doi.org/10.1115/IPACK2024-140287
View Paper titled, High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
Open the PDF for High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape in another window
Topics: Composite materials, Copper, Gallium, Liquid metals, Nanowires, Polydimethylsiloxane, Thermal characterization, Thermal resistance, ASTM International, Contact resistance
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
Open the PDF for Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels in another window
Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
Open the PDF for Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging in another window
Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8385
https://doi.org/10.1115/IPACK2018-8385
View Paper titled, Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices
Open the PDF for Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices in another window
Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
Open the PDF for Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling in another window
Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System

Alicja Palczynska, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han, Dirk Mayer, Tobias Melz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74058
https://doi.org/10.1115/IPACK2017-74058
View Paper titled, Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System
Open the PDF for Piezoresistive Silicon Stress Sensor As a Tool to Monitor Health of an Electronic System in another window
Topics: Electronic systems, Sensors, Silicon, Stress, Algorithms, Delamination, Failure, Vehicles, Accelerated life testing, Acoustics
Proceedings Papers

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74266
https://doi.org/10.1115/IPACK2017-74266
View Paper titled, Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder
Open the PDF for Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder in another window
Topics: Lead-free solders, Tin, Cross section (Physics), Microscopy, Particulate matter, Cooling, Intermetallic compounds, Nanoindentation, Polishing, Scanning electron microscopy
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48333
https://doi.org/10.1115/IPACK2015-48333
View Paper titled, Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages
Open the PDF for Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages in another window
Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Microstructural Stability of Au-Sn SLID Joints for Harsh Environments

Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48323
https://doi.org/10.1115/IPACK2015-48323
View Paper titled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
Open the PDF for Microstructural Stability of Au-Sn SLID Joints for Harsh Environments in another window
Topics: Stability, Tin, Bonding, Melting point, Fracture (Materials), Copper, Diffusion (Physics), Electronic packaging, Intermetallic compounds, Microscopy
Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73143
https://doi.org/10.1115/IPACK2013-73143
View Paper titled, Reliability of Bonded Interfaces for Automotive Power Electronics
Open the PDF for Reliability of Bonded Interfaces for Automotive Power Electronics in another window
Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage
Proceedings Papers

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 517-520, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89058
https://doi.org/10.1115/InterPACK2009-89058
View Paper titled, Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films
Open the PDF for Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films in another window
Topics: Chain, Electric fields, Electrodes, Film thickness, Glass, Irradiation (Radiation exposure), Microscopy, Polymer films, Resonance, Silicon
Proceedings Papers

An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management

Omar Sanusi, Randy D. Weinstein, Amy S. Fleischer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 529-533, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89070
https://doi.org/10.1115/InterPACK2009-89070
View Paper titled, An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management
Open the PDF for An Investigation Into the Penetration of Phase Change Material in Carbon Foam for Transient Thermal Management in another window
Topics: Carbon, Phase change materials, Thermal management, Transients (Dynamics), Electrical conductivity, Thermal conductivity, Design, Displacement, Heat, Heat conduction
Proceedings Papers

Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays

Xuejiao Hu, Lawrence S. Pan, Gang Gu, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 597-603, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89375
https://doi.org/10.1115/InterPACK2009-89375
View Paper titled, Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays
Open the PDF for Superior Thermal Interfaces Made by Metallically Anchored Carbon Nanotube Arrays in another window
Topics: Carbon nanotubes, Thermal resistance, Compression, Mechanical properties, Metals, Microscopy, Solders, Thermal conductivity
Proceedings Papers

Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

Minhua Lu, Carla Bailey, Hsichang Liu, Krystyna Semkow
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 469-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33178
https://doi.org/10.1115/IPACK2007-33178
View Paper titled, Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope
Open the PDF for Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope in another window
Topics: Acoustics, Microscopes, Failure analysis, Manufacturing, Metallurgy, Microscopy
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
https://doi.org/10.1115/IPACK2007-33629
View Paper titled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials
Open the PDF for Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials in another window
Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Proceedings Papers

Micro-Raman Thermometry of Laser Heated Surfaces

Justin R. Serrano, Leslie M. Phinney
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 327-333, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33571
https://doi.org/10.1115/IPACK2007-33571
View Paper titled, Micro-Raman Thermometry of Laser Heated Surfaces
Open the PDF for Micro-Raman Thermometry of Laser Heated Surfaces in another window
Topics: Lasers, Temperature measurement, Temperature, Polysilicon, Computer simulation, Data collection, Heating, Infrared imaging, Microelectromechanical systems, Microscopy
Proceedings Papers

Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids

Patricia E. Gharagozloo, Ken E. Goodson, John K. Eaton
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 993-998, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33293
https://doi.org/10.1115/IPACK2007-33293
View Paper titled, Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids
Open the PDF for Impact of Thermodiffusion on Temperature Fields in Stationary Nanofluids in another window
Topics: Nanofluids, Temperature, Thermal conductivity, Aluminum, Carbon nanotubes, Heat, Microscopy, Nanoparticles, Separation (Technology), Silicones
Proceedings Papers

SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions

G. Plaza, Y. Zhou, M. Osterman, A. Dasgupta
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 515-521, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33095
https://doi.org/10.1115/IPACK2007-33095
View Paper titled, SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions
Open the PDF for SnAgCu (SAC) Durability Under Vibration Loading at Different Isothermal Temperature Conditions in another window
Topics: Durability, Temperature, Vibration, Solders, Damage, Finite element analysis, High cycle fatigue, Printed circuit boards, Electrical wires, Excitation
Proceedings Papers

Using High Speed Camera for Electronic Board Failure Analysis

Wade Hezeltine, Frank Z. Liang
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1193-1198, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73223
https://doi.org/10.1115/IPACK2005-73223
View Paper titled, Using High Speed Camera for Electronic Board Failure Analysis
Open the PDF for Using High Speed Camera for Electronic Board Failure Analysis in another window
Topics: Failure analysis, Design, Failure, Corrective actions, Cross section (Physics), Cycles, Microscopy, Modeling, Product design, Teams
Proceedings Papers

Thermal Gradient in Solder Joints Under Electrical Current Stressing

Da-Jeng Yao, Chung-Yi Hsu, Chih Chen, Sheng-Hsiang Chiu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1277-1282, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73356
https://doi.org/10.1115/IPACK2005-73356
View Paper titled, Thermal Gradient in Solder Joints Under Electrical Current Stressing
Open the PDF for Thermal Gradient in Solder Joints Under Electrical Current Stressing in another window
Topics: Electric current, Solder joints, Temperature gradient, Temperature, Current density, Solders, Computer software, Errors, Finite element analysis, Heating