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Proceedings Papers

Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer

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Naoya Saiki, Yuichiro Komasu, Kazuto Aizawa, Jun Maeda
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74010
https://doi.org/10.1115/IPACK2017-74010
View Paper titled, Investigation of Peeling Behavior of UV Curable Pressure Sensitive Adhesive for Bump-Wafer
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Topics: Adhesives, Pressure, Semiconductor wafers, Ultraviolet radiation, String, Finite element analysis, Deformation, Elongation, Finite element model, Fracture (Materials)
Proceedings Papers

Characterization of Crack Growth in BGA Under Drop Impact

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Quang Nguyen, Seungbae Park, Tung Nguyen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73110
https://doi.org/10.1115/IPACK2013-73110
View Paper titled, Characterization of Crack Growth in BGA Under Drop Impact
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Topics: Ball-Grid-Array packaging, Fracture (Materials), Solder joints, Damage, Imaging, Low cycle fatigue, Microscopes, Polishing, Tin, Vehicles
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

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Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73112
https://doi.org/10.1115/IPACK2013-73112
View Paper titled, Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

A Multiscale Damage Accumulation Theory for Solder Joint Failure

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Dhruv Bhate, Kaushik Mysore, Ganesh Subbarayan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 191-197, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89399
https://doi.org/10.1115/InterPACK2009-89399
View Paper titled, A Multiscale Damage Accumulation Theory for Solder Joint Failure
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Topics: Damage, Failure, Solder joints, Fracture (Materials), Alloys, Energy dissipation, Thermodynamics, Brittleness, Microscopes, Plasticity
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

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Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope

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Minhua Lu, Carla Bailey, Hsichang Liu, Krystyna Semkow
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 469-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33178
https://doi.org/10.1115/IPACK2007-33178
View Paper titled, Nondestructive Measurement of C4 BLM Undercut by Scanning Acoustic Microscope
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Topics: Acoustics, Microscopes, Failure analysis, Manufacturing, Metallurgy, Microscopy
Proceedings Papers

Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips

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Yuki Sato, Hideo Miura
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 473-479, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33257
https://doi.org/10.1115/IPACK2007-33257
View Paper titled, Development of a Nondestructive Inspection Method for Detecting Open Failures of Micro Bump Interconnections in Three Dimensionally Stacked LSI Chips
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Topics: Failure, Nondestructive evaluation, Deformation, Delamination, Finite element analysis, Surface deformation, Diluents, Epoxy resins, Lasers, Microscopes
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

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Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
https://doi.org/10.1115/IPACK2007-33629
View Paper titled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials
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Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Proceedings Papers

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

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Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33554
https://doi.org/10.1115/IPACK2007-33554
View Paper titled, Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method
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Topics: Lasers, Heat, Composite materials, Thermal resistance, Acoustics, Adhesives, Algorithms, Cracking (Materials), Delamination, Electronic packages
Proceedings Papers

Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures

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Yuhki Sato, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1587-1592, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73109
https://doi.org/10.1115/IPACK2005-73109
View Paper titled, Non-Destructive Inspection Method for Detecting Open Failures in Flip Chip Structures
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Topics: Failure, Flip-chip, Flip-chip devices, Nondestructive evaluation, Deformation, Silicon chips, Adhesion, Bonding, Delamination, Diluents
Proceedings Papers

Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates

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Woon Choi, Shintaro Ono, Seiichiro Yoshida, Hajime Tomokage
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1989-1993, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73469
https://doi.org/10.1115/IPACK2005-73469
View Paper titled, Evaluation of Spiral Inductors Embedded in Low Temperature Co-Fired Ceramic Substrates
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Topics: Ceramics, Inductors, Low temperature, Design, Simulation results, Microscopes, Lasers, Microwaves, System-in-package
Proceedings Papers

Fabrication of the Tip of GaAs Microwave Probe by Wet Etching

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Yang Ju, Hiroyuki Sato, Hitoshi Soyama
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1919-1922, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73140
https://doi.org/10.1115/IPACK2005-73140
View Paper titled, Fabrication of the Tip of GaAs Microwave Probe by Wet Etching
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Topics: Chemical etching, Gallium arsenide, Manufacturing, Microwaves, Probes, Etching, Atomic force microscopy, Atoms, Microscopes, Semiconductor wafers
Proceedings Papers

Planar Waveguide: Utility in Amino Acid Detection

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David R. Wulfman, Tracey Baas, Ronald McGlennen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 681-686, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35300
https://doi.org/10.1115/IPACK2003-35300
View Paper titled, Planar Waveguide: Utility in Amino Acid Detection
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Topics: Waveguides, Biomedicine, Design, Fluorescence, Glass, DNA, Engineering prototypes, Excitation, Filters, Instrumentation
Proceedings Papers

Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis

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S. Ansari, T. Cader, N. Stoddard, B. Tolman, J. Frank, D. Cotton, T. Wong, N. Pakdaman
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35206
https://doi.org/10.1115/IPACK2003-35206
View Paper titled, Spray Cooling Thermal Management of a Semiconductor Chip Undergoing Probing, Diagnostics, and Failure Analysis
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Topics: Cooling, Failure analysis, Semiconductors (Materials), Sprays, Thermal management, Temperature, Microscopes, Silicon, Coolants, Heat