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Proceedings Papers

Silica Nanoparticle Formation by Using Droplet-Based Microreactor

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Arsalan Nikdoost, Alican Ozkan, Yusuf Kelestemur, Hilmi Volkan Demir, E. Yegan Erdem
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74178
https://doi.org/10.1115/IPACK2017-74178
View Paper titled, Silica Nanoparticle Formation by Using Droplet-Based Microreactor
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Topics: Drops, Nanoparticles, Coating processes, Coatings, Microfluidics, Particulate matter, Quantum dots
Proceedings Papers

A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment

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Yichao Yang, Jiayue Shen, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48134
https://doi.org/10.1115/IPACK2015-48134
View Paper titled, A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment
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Topics: Biological tissues, Microfluidics, Tactile sensors, Sensors, Deflection, Transducers, Elasticity, Electrolytes, Phantoms, Power presses
Proceedings Papers

Molybdenum Disulfide (MoS 2 ) Nanomechanical Resonators Integrated on Microchannels

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Rui Yang, Zhenyu Li, Philip X.-L. Feng
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48590
https://doi.org/10.1115/IPACK2015-48590
View Paper titled, Molybdenum Disulfide (MoS 2 ) Nanomechanical Resonators Integrated on Microchannels
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Topics: Microchannels, Molybdenum, Nanomechanical resonators, Resonance, Microfluidics, Plasma desorption mass spectrometry, Thermomechanics, Cantilevers, Fluids, Membranes
Proceedings Papers

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

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Yichao Yang, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48133
https://doi.org/10.1115/IPACK2015-48133
View Paper titled, A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection
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Topics: Microfluidics, Tactile sensors, Torque, Transducers, Microchannels, Electrolytes, Computer numerical control machine tools, Electrodes, Engineering prototypes, Lithography
Proceedings Papers

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

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Caleb Serafy, Ankur Srivastava, Avram Bar-Cohen, Donald Yeung
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48344
https://doi.org/10.1115/IPACK2015-48344
View Paper titled, Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization
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Topics: Design, Microfluidics, Optimization, Cooling, Energy efficiency, Circuits
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

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Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48370
https://doi.org/10.1115/IPACK2015-48370
View Paper titled, Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

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David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
https://doi.org/10.1115/IPACK2015-48179
View Paper titled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets

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John Ditri, Joseph Hahn, Roland Cadotte, Michael McNulty, Denise Luppa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48689
https://doi.org/10.1115/IPACK2015-48689
View Paper titled, Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
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Topics: Cooling, Electronics, Heat flux, Jets, Microfluidics, Simulation, Computational fluid dynamics, Reliability, Coolers, Cooling systems
Proceedings Papers

Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling

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Karen M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48409
https://doi.org/10.1115/IPACK2015-48409
View Paper titled, Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling
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Topics: Cooling, Microchannels, Plasma etching, Silicon, Gallium nitride, Electronics, Density, Etching, Finite element analysis, Heat transfer coefficients
Proceedings Papers

3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

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Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48584
https://doi.org/10.1115/IPACK2015-48584
View Paper titled, 3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Microfluidics, Heat sinks, Atmospheric pressure, Coolants, Heat flux, Heat transfer coefficients, Pressure drop, Silicon, Testing
Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

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Zhimin Wan, Yogendra Joshi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73080
https://doi.org/10.1115/IPACK2013-73080
View Paper titled, Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
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Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature
Proceedings Papers

Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers

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Josef L. Miler, Roger Flynn, Gamal Refai-Ahmed, Maxat Touzelbaev, Milnes David, Julie Steinbrenner, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 563-569, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89325
https://doi.org/10.1115/InterPACK2009-89325
View Paper titled, Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers
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Topics: Heat exchangers, Microchannels, Transient heat transfer, Two-phase flow, Heating, Bubbles, Heat sinks, Microfluidics, Nucleation (Physics), Steady state
Proceedings Papers

Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger

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Milnes P. David, Julie Steinbrenner, Josef Miler, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 437-444, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89192
https://doi.org/10.1115/InterPACK2009-89192
View Paper titled, Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
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Topics: Copper, Heat exchangers, Microchannels, Visualization, Flow (Dynamics), Membranes, Vapors, Pressure, Air flow, Cooling
Proceedings Papers

Electrical, Optical and Thermofluidic Chip I/O Interconnections

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Muhannad S. Bakir, Bing Dang, James D. Meindl
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 11-17, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33464
https://doi.org/10.1115/IPACK2007-33464
View Paper titled, Electrical, Optical and Thermofluidic Chip I/O Interconnections
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Topics: Complementary metal oxide semiconductors, Coolants, Cooling, Flip-chip, Heat sinks, Manufacturing, Microchannels, Microfluidics, Microscale devices, Silicon
Proceedings Papers

Dimensional and Locational Integrity in the Replication of Polymeric Microdevices

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Byoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 955-959, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33482
https://doi.org/10.1115/IPACK2007-33482
View Paper titled, Dimensional and Locational Integrity in the Replication of Polymeric Microdevices
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Topics: Dimensions, Embossing, Injection molding, Manufacturing, Microfluidics, Molding, Polymers, Shrinkage (Materials), Thermal expansion
Proceedings Papers

Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink

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Roger Flynn, Ching-Hsiang Cheng, Kenneth Goodson
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 179-184, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33484
https://doi.org/10.1115/IPACK2007-33484
View Paper titled, Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink
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Topics: Boiling, Cooling, Flow (Dynamics), Heat sinks, Microchannels, Thermal resistance, Convection, Design, Flow instability, Microfluidics
Proceedings Papers

Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice

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Hing Wah Lee, Parthiban Arunasalam, Ishak A. Azid, Kankanhally N. Seetharamu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73280
https://doi.org/10.1115/IPACK2005-73280
View Paper titled, Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice
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Topics: Chain, Flow (Dynamics), Optimization, Temperature control, Artificial neural networks, Finite element analysis, Microfluidics, Simulation results, Temperature distribution, Annealing
Proceedings Papers

A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects

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Bing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73416
https://doi.org/10.1115/IPACK2005-73416
View Paper titled, A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
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Topics: Cooling, Heat sinks, Microfluidics, Silicon chips, Complementary metal oxide semiconductors, Density, Electroplating, Engineering prototypes, Flip-chip, Flip-chip assemblies
Proceedings Papers

An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV

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Daichi Suzuki, Takashi Nagumo, Shinji Honami, Shoji Kamiunten
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2011-2015, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73194
https://doi.org/10.1115/IPACK2005-73194
View Paper titled, An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV
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Topics: Flow sensors, Flow (Dynamics), Columns (Structural), Bonding, Microelectromechanical systems, Microfluidics, Wire, Design, Microparticles, Pins (Engineering)
Proceedings Papers

Surface Micromachined Microfluidics: Example Microsystems, Challenges and Opportunities

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Paul Galambos, Conrad James
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2023-2032, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73491
https://doi.org/10.1115/IPACK2005-73491
View Paper titled, Surface Micromachined Microfluidics: Example Microsystems, Challenges and Opportunities
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Topics: Ejectors, Microelectromechanical systems, Microfluidics, Micromachining