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Microfluidics
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Proceedings Papers
Silica Nanoparticle Formation by Using Droplet-Based Microreactor
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74178
Proceedings Papers
A Two-Dimensional Microfluidic-Based Tactile Sensor for Tissue Palpation Under the Influence of Misalignment
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48134
Proceedings Papers
Molybdenum Disulfide (MoS 2 ) Nanomechanical Resonators Integrated on Microchannels
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48590
Proceedings Papers
A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48133
Proceedings Papers
Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48344
Proceedings Papers
Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48370
Proceedings Papers
Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
Proceedings Papers
Embedded Cooling of High Heat Flux Electronics Utilizing Distributed Microfluidic Impingement Jets
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48689
Proceedings Papers
Inductive Coupled Plasma Etching of High Aspect Ratio Silicon Carbide Microchannels for Localized Cooling
Available to PurchaseKaren M. Dowling, Ateeq J. Suria, Yoonjin Won, Ashwin Shankar, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson, Debbie G. Senesky
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48409
Proceedings Papers
3D IC With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
Available to PurchaseXuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48584
Proceedings Papers
Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73080
Proceedings Papers
Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers
Available to PurchaseJosef L. Miler, Roger Flynn, Gamal Refai-Ahmed, Maxat Touzelbaev, Milnes David, Julie Steinbrenner, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 563-569, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89325
Proceedings Papers
Visualization and Analysis of Venting From a Single Microchannel Two-Phase Copper Heat Exchanger
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 437-444, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89192
Proceedings Papers
Electrical, Optical and Thermofluidic Chip I/O Interconnections
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 11-17, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33464
Proceedings Papers
Dimensional and Locational Integrity in the Replication of Polymeric Microdevices
Available to PurchaseByoung Hee You, Daniel S. Park, Ping-Chuan Chen, Wilfredo M. Caceres, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 955-959, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33482
Proceedings Papers
Decoupled Thermal and Fluidic Effects on Hotspot Cooling in a Boiling Flow Microchannel Heat Sink
Available to Purchase
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 179-184, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33484
Proceedings Papers
Neural-Genetic Optimization of Temperature Control in a Continuous Flow Polymerase Chain Reaction Microdevice
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 733-740, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73280
Proceedings Papers
A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects
Available to PurchaseBing Dang, Paul J. Joseph, Xiaojin Wei, Muhannad S. Bakir, Paul A. Kohl, Yogendra K. Joshi, James D. Meindl
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 605-610, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73416
Proceedings Papers
An Evaluation of Auxiliary Part Configuration in the Micro Flow Sensor by Using Micro PIV
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2011-2015, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73194
Proceedings Papers
Surface Micromachined Microfluidics: Example Microsystems, Challenges and Opportunities
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2023-2032, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73491
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