1-20 of 92
Microelectromechanical systems
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

Available to Purchase

Pradeep Lall, Amrit Abrol, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74252
https://doi.org/10.1115/IPACK2017-74252
View Paper titled, Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone
Open the PDF for Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone in another window
Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms
Proceedings Papers

Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps

Available to Purchase

Li-Anne Liew, Ching-Yi Lin, Alexander Yersak, Ryan Lewis, Collin Coolidge, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48814
https://doi.org/10.1115/IPACK2015-48814
View Paper titled, Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps
Open the PDF for Atomic Layer Deposited TiO2 as Sacrificial Layers and Internal Coatings for Nanoscale Gaps in another window
Topics: Coatings, Nanoscale phenomena, Membranes, Semiconductor wafers, Valves, Compression, Diaphragms (Mechanical devices), Diaphragms (Structural), Microelectromechanical systems, Cavities
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Available to Purchase

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48010
https://doi.org/10.1115/IPACK2015-48010
View Paper titled, MEMS Die Warpage During Curing of Die Attach Material
Open the PDF for MEMS Die Warpage During Curing of Die Attach Material in another window
Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Available to Purchase

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48086
https://doi.org/10.1115/IPACK2015-48086
View Paper titled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
Open the PDF for Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage in another window
Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Available to Purchase

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48790
https://doi.org/10.1115/IPACK2015-48790
View Paper titled, Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments
Open the PDF for Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments in another window
Topics: Accelerometers, Microelectromechanical systems, Shock (Mechanics), Reliability, Automotive industry, Complementary metal oxide semiconductors, Design, Failure mechanisms, Low temperature, Lumber
Proceedings Papers

Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments

Available to Purchase

Pradeep Lall, Nakul Kothari, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48457
https://doi.org/10.1115/IPACK2015-48457
View Paper titled, Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments
Open the PDF for Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments in another window
Topics: Accelerometers, Event history analysis, Microelectromechanical systems, Modeling, Shock (Mechanics), Failure mechanisms, Capacitance, Failure, Defense industry, Deflection
Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Available to Purchase

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
https://doi.org/10.1115/IPACK2015-48744
View Paper titled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
Open the PDF for Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir in another window
Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation
Proceedings Papers

Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics

Available to Purchase

Kaustubh Nagarkar, Craig Galligan, Michael Klitzke, James Rose, Binoy Shah, Donna Sherman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48704
https://doi.org/10.1115/IPACK2015-48704
View Paper titled, Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics
Open the PDF for Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics in another window
Topics: Biomedicine, Electronics, Packaging, Circuits, Laminates, Manufacturing, Microelectromechanical systems, Pressure sensors, Sensors
Proceedings Papers

Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency

Available to Purchase

Jingshi Meng, Abhijit Dasgupta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48669
https://doi.org/10.1115/IPACK2015-48669
View Paper titled, Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency
Open the PDF for Influence of Secondary Impact on Failure Modes in PWAs With High Resonant Frequency in another window
Topics: Failure mechanisms, Resonance, Reflection, Stress, Circuits, Diluents, Disperse systems, Electrical wires, Impulse (Physics), Microelectromechanical systems
Proceedings Papers

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Available to Purchase

Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73317
https://doi.org/10.1115/IPACK2013-73317
View Paper titled, Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging
Open the PDF for Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging in another window
Topics: Packaging, Semiconductor wafers, Silicon, Stress, Tin, Vehicles, Bonding, Modeling, Transistors, Bolometers
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

Available to Purchase

Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73156
https://doi.org/10.1115/IPACK2013-73156
View Paper titled, Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
Open the PDF for Highly Sensitive 2D Strain Sensor Using Carbon Nanotube in another window
Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design
Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Available to Purchase

Zhimin Wan, Yogendra Joshi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73080
https://doi.org/10.1115/IPACK2013-73080
View Paper titled, Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux
Open the PDF for Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux in another window
Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Available to Purchase

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
Open the PDF for Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors in another window
Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

Available to Purchase

Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73290
https://doi.org/10.1115/IPACK2013-73290
View Paper titled, Micro Cryogenic Coolers With Mixed Refrigerants
Open the PDF for Micro Cryogenic Coolers With Mixed Refrigerants in another window
Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Available to Purchase

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
https://doi.org/10.1115/IPACK2013-73175
View Paper titled, Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
Open the PDF for Multiphysics Simulation of RF-MEMS With Quantified Uncertainties in another window
Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

Design, Reliability and Manufacturing Readiness for MEMS Microphone

Available to Purchase

Ganesh Iyer, Wei Li, Lavanya Gopalakrishnan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 369-374, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52002
https://doi.org/10.1115/IPACK2011-52002
View Paper titled, Design, Reliability and Manufacturing Readiness for MEMS Microphone
Open the PDF for Design, Reliability and Manufacturing Readiness for MEMS Microphone in another window
Topics: Design, Manufacturing, Microelectromechanical systems, Microphones, Reliability, Signals, Acoustics, Condensers (steam plant)
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Available to Purchase

Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52100
https://doi.org/10.1115/IPACK2011-52100
View Paper titled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
Open the PDF for Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging in another window
Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Available to Purchase

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52062
https://doi.org/10.1115/IPACK2011-52062
View Paper titled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
Open the PDF for Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin in another window
Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes
Proceedings Papers

Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor

Available to Purchase

Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 395-399, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52183
https://doi.org/10.1115/IPACK2011-52183
View Paper titled, Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor
Open the PDF for Combined Temperature and Humidity Effects on MEMS Vibratory Gyroscope Sensor in another window
Topics: Microelectromechanical systems, Sensors, Temperature
Proceedings Papers

Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications

Available to Purchase

Siddharth Bhopte, Parthiban Arunasalam, Fadi Alsaleem, Arvind Rao, Nataraj Hariharan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 617-625, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52296
https://doi.org/10.1115/IPACK2011-52296
View Paper titled, Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications
Open the PDF for Power Allocation Towards Hermetic Solder Joint Health of High Powered MEMS Chip for Harsh Environment Applications in another window
Topics: Microelectromechanical systems, Solder joints, Solders, Actuators, Metals, Pressure sensors, Refrigeration, Reliability, Flow (Dynamics), Flow control