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Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance

Thomas L. Bougher, John H. Taphouse, Baratunde A. Cola
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48587
https://doi.org/10.1115/IPACK2015-48587
View Paper titled, Characterization of Carbon Nanotube Forest Interfaces Using Time Domain Thermoreflectance
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Topics: Carbon nanotubes, Thermoreflectance, Contact resistance, Heat transfer, Heating, Mechanical properties, Metrology, Probes, Thermal conductivity, Uncertainty
Proceedings Papers

Nonlinear Response of a Printed Circuit Board in Shock

M. Vujosevic, P. Raghavan, G. Ramanathan, W. Hezeltine, K. Blue
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 45-54, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89094
https://doi.org/10.1115/InterPACK2009-89094
View Paper titled, Nonlinear Response of a Printed Circuit Board in Shock
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Topics: Printed circuit boards, Shock (Mechanics), Deformation, Stress, Lumber, Membranes, Metrology, Strain measurement, Finite element methods, Inertia (Mechanics)
Proceedings Papers

Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters

Jungchul Lee, Hanif Hunter, Fabian Goericke, Nisarga Naik, Mark Allen, Ari Glezer, William P. King
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 163-169, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33291
https://doi.org/10.1115/IPACK2007-33291
View Paper titled, Measurements of Microjet Cooling and Phase Change Characteristics Using Microcantilever Heaters
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Topics: Boiling, Cooling, Flow (Dynamics), Flux (Metallurgy), Heat, Microcantilevers, Critical heat flux, Metrology, Micromachining, Microscale devices
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
https://doi.org/10.1115/IPACK2007-33629
View Paper titled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials
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Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Proceedings Papers

Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging

Chin Hock Toh, Arun Raman, Thomas Fitzgerald, Madhuri Narkhede, Alfred A. La Mar, Dennis Prem Kumar Chandran
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 979-984, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33505
https://doi.org/10.1115/IPACK2007-33505
View Paper titled, Effects of Thermal Lids Gold Plating Thickness on Thermal Interface Reliability for Flip Chip Packaging
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Topics: Flip-chip, Flip-chip devices, Gold plating, Packaging, Reliability, Plating, Solders, Soldering, Corners (Structural elements), Cycles
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73405
https://doi.org/10.1115/IPACK2005-73405
View Paper titled, Theta_JC Metrology Development: Fixture Design Modeling
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

Shaw Fong Wong, Wei Keat Loh, Yung Hsiang Lee, Eng Hooi Yap, Siang Woen Wong, Tze Yang Hin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1441-1447, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73215
https://doi.org/10.1115/IPACK2005-73215
View Paper titled, A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application
Open the PDF for A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application in another window
Topics: Ball-Grid-Array packaging, Dynamic response, Flip-chip, Flip-chip devices, Fracture (Materials), Risk, Solder joints, Accelerometers, Computer software, Design
Proceedings Papers

Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology

George F. Raiser, Dudi Amir
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 857-865, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73045
https://doi.org/10.1115/IPACK2005-73045
View Paper titled, Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology
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Topics: Metrology, Nickel, Reliability, Shear (Mechanics), Shock (Mechanics), Solder joints