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Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74116
https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
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Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Proceedings Papers

Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics

Margie Guerrero, Pedro Quintero, Ozan Ozdemir, Tricia Schwartz
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69270
https://doi.org/10.1115/IPACK2021-69270
View Paper titled, Cold Gas Spray of Copper on Aluminum Nitride as Substrate for Power Electronics
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Topics: Aluminum, Copper, Electronics, Sprays, Ceramics, Manufacturing, Additive manufacturing, Bonding, Deformation, Electrical properties
Proceedings Papers

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2533
https://doi.org/10.1115/IPACK2020-2533
View Paper titled, Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers
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Topics: Bonding, Flip-chip, Heat flux, Intermetallic compounds, Metals, Microcoolers, Packaging, Tin
Proceedings Papers

Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials

Nhi V. Quach, Quang N. Pham, Ju-Hwan Han, Youngjoon Suh, Jin-Seong Park, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2613
https://doi.org/10.1115/IPACK2020-2613
View Paper titled, Surface Engineering Through Atomic Layer Deposition on Three-Dimensionally Structured Materials
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Topics: Architecture, Coatings, Condensation, Condensed matter, Drops, Fluids, Hydrophilicity, Membranes, Metals, Nickel
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A013, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6436
https://doi.org/10.1115/IPACK2019-6436
View Paper titled, Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Metals, Transients (Dynamics), Ceramics, Copper, Finite element analysis, Materials properties, MOSFET transistors, Semiconductors (Materials)
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
https://doi.org/10.1115/IPACK2019-6385
View Paper titled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
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Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink

Michael Ozeh, A. G. Agwu Nnanna
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8354
https://doi.org/10.1115/IPACK2018-8354
View Paper titled, Waste Heat Recovery for Powering Mobile Devices Using Thermoelectric Generators and Evaporatively-Cooled Heat Sink
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Topics: Generators, Heat recovery, Heat sinks, Heat pipes, Nanoparticles, Electronics, Heat, Heat exchangers, Metals, Temperature gradient
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
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Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer

Kazuhisa Yuki, Katsuki Fukushima, Koichi Suzuki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48628
https://doi.org/10.1115/IPACK2015-48628
View Paper titled, Boiling/Evaporation Characteristics of a Droplet on a Nano-Particles-Accumlated Bi-Porous Layer
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Topics: Boiling, Drops, Evaporation, Particulate matter, Nanoparticles, Adhesion, Temperature, Bubbles, Critical heat flux, Heat transfer
Proceedings Papers

Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications

Chi Zhang, Guoguang Rong, James W. Palko, Thomas J. Dusseault, Mehdi Asheghi, Juan G. Santiago, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48262
https://doi.org/10.1115/IPACK2015-48262
View Paper titled, Tailoring of Permeability in Copper Inverse Opal for Electronic Cooling Applications
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Topics: Computer cooling, Copper, Permeability, Sintering, Cooling, Fluids, Capillarity, Electrodeposition, Electronics, Heat flux
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48019
https://doi.org/10.1115/IPACK2015-48019
View Paper titled, Hot Spot Elimination by Thin and Smart Heat Spreader
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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis