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Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73252
https://doi.org/10.1115/IPACK2021-73252
View Paper titled, Transient Performance and Melt Front Characterization of Phase Change Materials
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
https://doi.org/10.1115/IPACK2019-6385
View Paper titled, Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8225
https://doi.org/10.1115/IPACK2018-8225
View Paper titled, All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes
Open the PDF for All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes in another window
Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
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Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48708
https://doi.org/10.1115/IPACK2015-48708
View Paper titled, Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire
Proceedings Papers

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48499
https://doi.org/10.1115/IPACK2015-48499
View Paper titled, Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances
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Topics: Phase change materials, Thermal management, Energy dissipation, Heat, Temperature, Thermal conductivity, Density, Energy consumption, Flow (Dynamics), Heat capacity
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48720
https://doi.org/10.1115/IPACK2015-48720
View Paper titled, Modeling the Reflow Soldering Process in PCB’s
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48522
https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Enhanced Melting for Transient Thermal Management

T. Rozenfeld, R. Hayat, Y. Kozak, G. Ziskind
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A063, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48369
https://doi.org/10.1115/IPACK2015-48369
View Paper titled, Enhanced Melting for Transient Thermal Management
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Topics: Melting, Thermal management, Transients (Dynamics), Fins, Phase change materials, Heat transfer, Energy dissipation, Geometry, Heat, Latent heat
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73209
https://doi.org/10.1115/IPACK2013-73209
View Paper titled, Transient Liquid Phase Sintered Joints for Power Electronic Modules
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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Proceedings Papers

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73171
https://doi.org/10.1115/IPACK2013-73171
View Paper titled, Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls
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Topics: Electrodes, Lead-free solders, Tin, Plating baths, Shear (Mechanics), Solders, Intermetallic compounds, Melting, Nickel plating
Proceedings Papers

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

Pradeep Lall, Geeta Limaye, Sandeep Shantaram, Jeff Suhling
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73246
https://doi.org/10.1115/IPACK2013-73246
View Paper titled, Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot
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Topics: Materials properties, Alloys, Temperature, Tin, Copper, Creep, Design, Elastic moduli, Electronics, Finite element model
Proceedings Papers

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73275
https://doi.org/10.1115/IPACK2013-73275
View Paper titled, CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)
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Topics: Computational fluid dynamics, Simulation, Wave soldering, Solders, Computer software, Electronics, Flow (Dynamics), Fluids, Melting, Melting point
Proceedings Papers

Effect of Aging on Impression Creep Behavior of Pb-Free Solders

B. Talebanpour, U. Sahaym, I. Dutta, P. Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73137
https://doi.org/10.1115/IPACK2013-73137
View Paper titled, Effect of Aging on Impression Creep Behavior of Pb-Free Solders
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Topics: Creep, Lead-free solders, Tin, Alloys, Particulate matter, Solders, Temperature, Melting, Melting point, Particle size
Proceedings Papers

Development of a Hybrid PCM-Air Heat Sink

Y. Kozak, B. Abramzon, G. Ziskind
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 173-178, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52097
https://doi.org/10.1115/IPACK2011-52097
View Paper titled, Development of a Hybrid PCM-Air Heat Sink
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Topics: Heat sinks, Temperature, Heat, Melting, Energy dissipation, Phase change materials, Thermal management, Aluminum, Cooling, Delays
Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52221
https://doi.org/10.1115/IPACK2011-52221
View Paper titled, Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials
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Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)
Proceedings Papers

High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion

Rogie I. Rodriguez, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 9-17, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52049
https://doi.org/10.1115/IPACK2011-52049
View Paper titled, High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion
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Topics: High temperature, Low temperature, Temperature, Tin, Diffusion (Physics), Melting point, Bonding, Electromechanical devices, Electronic packaging, Electronics