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Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
https://doi.org/10.1115/IPACK2020-2677
View Paper titled, Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C
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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
https://doi.org/10.1115/IPACK2020-2661
View Paper titled, Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
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Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8405
https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
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Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction

Cody J. Marbut, Mahsa Montazeri, David Huitink
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8275
https://doi.org/10.1115/IPACK2018-8275
View Paper titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction
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Topics: Fatigue failure, Reliability, Stress, Damage, Design, Fatigue, Finite element analysis, Solders, Failure, Flip-chip
Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74245
https://doi.org/10.1115/IPACK2017-74245
View Paper titled, Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries
Proceedings Papers

Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs

Jun Lu, Michelle C. Lin, Bernie Short
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A072, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48146
https://doi.org/10.1115/IPACK2015-48146
View Paper titled, Measuring and Optimizing Thermal Interface Material Performance for VR Heatsink Designs
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Topics: Air flow, Design, Fillers (Materials), Mechanical testing, Power regulators, Silicones, Testing, Thermal resistance, Wind tunnels
Proceedings Papers

Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials

Taryn J. Davis, Tuhin Sinha, Ken Marston, Sushumna Iruvanti
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48712
https://doi.org/10.1115/IPACK2015-48712
View Paper titled, Effect of Temperature Cycling and High Temperature Aging on the Elastic Properties and Failure Modes of Thermal Interface Materials
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Topics: Adhesion, Aluminum, Elasticity, Failure mechanisms, Finite element analysis, Finite element methods, Finite element model, Flip-chip, High temperature, Mechanical testing
Proceedings Papers

Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology

S. Saiyed, S. A. Kudtarkar, R. Murcko, K. Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 923-930, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33691
https://doi.org/10.1115/IPACK2007-33691
View Paper titled, Assessment of 20 Micrometer Diameter Wires for Wire Bond Interconnect Technology
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Topics: Wire, Bonding, Reliability, High temperature, Stress, Aluminum, Bond strength, Catalysts, Mechanical testing, Shear (Mechanics)
Proceedings Papers

Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications

Kazuki Takashima, Timothy P. Halford, Yakichi Higo
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1679-1683, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73038
https://doi.org/10.1115/IPACK2005-73038
View Paper titled, Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications
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Topics: Fatigue testing, Fracture (Materials), Microelectromechanical systems, Fatigue cracks, Alloys, Fatigue, Fatigue life, Fracture mechanics, Fracture toughness, Machinery
Proceedings Papers

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, L. Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1471-1478, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73258
https://doi.org/10.1115/IPACK2005-73258
View Paper titled, High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation
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Topics: Materials characterization, Resolution (Optics), Composite materials, Computer software, Displacement, B-splines, Fibers, High temperature, Mechanical testing, Packaging
Proceedings Papers

Measurement of the Constitutive Behavior of Underfill Encapsulants

M. Saiful Islam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 923-931, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35321
https://doi.org/10.1115/IPACK2003-35321
View Paper titled, Measurement of the Constitutive Behavior of Underfill Encapsulants
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Topics: Creep, Design engineering, Dimensions, Electronic packages, Flip-chip assemblies, Flow (Dynamics), Machinery, Materials properties, Mechanical testing, Microscale devices
Proceedings Papers

Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders

Qian Zhang, Abhijit Dasgupta, Peter Haswell
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 955-960, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35361
https://doi.org/10.1115/IPACK2003-35361
View Paper titled, Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders
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Topics: Creep, Fatigue, High temperature, Lead-free solders, Solders, Durability, Stress, Temperature, Alloys, Damage