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Proceedings Papers

Mechanical Behavior of Heat Activated Film Adhesives

Prabhat Janamanchi, Abhijit Dasgupta, Narendra Singh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69719
https://doi.org/10.1115/IPACK2021-69719
View Paper titled, Mechanical Behavior of Heat Activated Film Adhesives
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Topics: Adhesives, Heat, Mechanical behavior, Mechanical properties, Phase transitions
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
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Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6571
https://doi.org/10.1115/IPACK2019-6571
View Paper titled, Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders
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Topics: Intermetallic compounds, Lead-free solders, Mechanical behavior, Temperature effects
Proceedings Papers

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L., Huanyu Liao, Ganesh Subbarayan
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6501
https://doi.org/10.1115/IPACK2019-6501
View Paper titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Packing (Shipments), Packings (Cushioning), Nonlinear programming, Optimization algorithms, Simulation, Computer programming, Gradient methods, Heat
Proceedings Papers

The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials

Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8405
https://doi.org/10.1115/IPACK2018-8405
View Paper titled, The Effects of Curing Profile, Temperature, and Aging on the Mechanical Behavior of Solder Mask Materials
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Topics: Hardening (Curing), Mechanical behavior, Solder masks, Temperature, Ultraviolet radiation, Creep, Mechanical properties, Elastic moduli, Stress, Tensile testing
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8392
https://doi.org/10.1115/IPACK2018-8392
View Paper titled, Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn
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Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8396
https://doi.org/10.1115/IPACK2018-8396
View Paper titled, Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders
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Topics: Lead-free solders, Mechanical behavior, Temperature effects, High temperature, Solders, Temperature, Mechanical properties, Alloys, Stress, Tensile strength
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74133
https://doi.org/10.1115/IPACK2017-74133
View Paper titled, Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions

Emad A. Poshtan, Sudarshan Hegde, Andreas Roessle
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74021
https://doi.org/10.1115/IPACK2017-74021
View Paper titled, Mechanical Behavior of Thermal Interface Materials in Electronic Components Under Dynamic Loading Conditions
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Topics: Dynamic testing (Materials), Electronic components, Mechanical behavior, Capacitors, Flat heat pipes, Heat, Materials properties, Reliability, Thermomechanics
Proceedings Papers

Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach

Khaled S. Al-Athel, Shahzada P. Aly, Abul Fazal M. Arif, Javad Mostaghimi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48745
https://doi.org/10.1115/IPACK2015-48745
View Paper titled, Thermal Behavior of Aluminum Alloy Metal Foam Heat Sinks: A Computational and Experimental Approach
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Topics: Aluminum alloys, Heat sinks, Metal foams, Computer-aided design, Computerized tomography, Finite element analysis, Geometry, Computer software, Engineering systems and industry applications, Mechanical behavior
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48619
https://doi.org/10.1115/IPACK2015-48619
View Paper titled, Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Proceedings Papers

Characterization of Doped SAC Solder Materials and Determination of Anand Parameters

Sudan Ahmed, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48624
https://doi.org/10.1115/IPACK2015-48624
View Paper titled, Characterization of Doped SAC Solder Materials and Determination of Anand Parameters
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Topics: Solders, Alloys, Reliability, Silver, Stress-strain curves, Temperature, Tin, Constitutive equations, Copper, Economics
Proceedings Papers

Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)

Hao Huang, Abhijit Dasgupta, Ehsan Mirbagheri, Srini Boddapati
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48707
https://doi.org/10.1115/IPACK2015-48707
View Paper titled, Mechanical Characterization of Assemblies Bonded With Pressure-Sensitive Adhesives (PSAs)
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Topics: Adhesives, Pressure, Bonding, Manufacturing, Mechanical behavior, Stress, Creep, Temperature, Failure mechanisms
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73245
https://doi.org/10.1115/IPACK2013-73245
View Paper titled, A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73242
https://doi.org/10.1115/IPACK2013-73242
View Paper titled, Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging
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Topics: Mechanical behavior, Microelectronic packaging, Polymers, Mechanical properties, Stress, Tension, Adhesives, Elastic moduli, Epoxy adhesives, Epoxy resins
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Hung-Yun Lin, Abhishek Tambat, Ian Claydon, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 351-356, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52258
https://doi.org/10.1115/IPACK2011-52258
View Paper titled, Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks
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Topics: Deformation, Fracture (Process), Risk, Temperature, Computer software, Cooling, Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
https://doi.org/10.1115/InterPACK2009-89209
View Paper titled, Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves