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Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74066
https://doi.org/10.1115/IPACK2021-74066
View Paper titled, Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning
Open the PDF for Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning in another window
Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72682
https://doi.org/10.1115/IPACK2021-72682
View Paper titled, A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases
Proceedings Papers

Module-Level TIM Degradation in HALT

Joshua Tompkins, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69511
https://doi.org/10.1115/IPACK2021-69511
View Paper titled, Module-Level TIM Degradation in HALT
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Topics: Aluminum, Cooling, Cycles, Electronics, Energy dissipation, Heating, Junctions, Life testing, Maintenance, Random vibration
Proceedings Papers

Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)

Madi Zholbaryssov, Azeem Sarwar
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6423
https://doi.org/10.1115/IPACK2019-6423
View Paper titled, Stator Diagnosis in Permanent Magnet Synchronous Motor (PMSM)
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Topics: Motors, Permanent magnets, Stators, Electric propulsion, Emissions, Maintenance, Winding (process), Damage, Flaw detection, Mechanical admittance
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6530
https://doi.org/10.1115/IPACK2019-6530
View Paper titled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74028
https://doi.org/10.1115/IPACK2017-74028
View Paper titled, Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)
Proceedings Papers

Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension

Yusuke Nakajo, Hiroaki Nishi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74341
https://doi.org/10.1115/IPACK2017-74341
View Paper titled, Temperature-Based Request Distribution for Effective CRAC and Equipment Life-Cycle Extension
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Topics: Cycles, Temperature, Data centers, Stress, Air conditioning, Failure, Heat, Maintenance, Semiconductors (Materials), Energy consumption
Proceedings Papers

Monitoring Fugitive Methane Gas Emission From Natural Gas Pads

Levente J. Klein, Ted van Kessel, Dhruv Nair, Ramachandran Muralidhar, Hendrik Hamann, Norma Sosa
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74191
https://doi.org/10.1115/IPACK2017-74191
View Paper titled, Monitoring Fugitive Methane Gas Emission From Natural Gas Pads
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Topics: Emissions, Methane, Natural gas, Leakage, Sensors, Plumes (Fluid dynamics), Governments, Maintenance, Regulations, Wind
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74208
https://doi.org/10.1115/IPACK2017-74208
View Paper titled, Application Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches
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Topics: Electronics, Reliability, Safety, Automotive industry, Failure, Vehicles, Actuators, Computation, Design, Electric vehicles
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
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Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48169
https://doi.org/10.1115/IPACK2015-48169
View Paper titled, Consideration for Running Data Center at High Temperatures and Using Free Air Cooling
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Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide
Proceedings Papers

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48441
https://doi.org/10.1115/IPACK2015-48441
View Paper titled, ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels
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Topics: Finite element methods, Heat, Mass transfer, Microchannels, Two-phase flow, Bubbles, Computer programming, Cooling, Design, Electronics
Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48724
https://doi.org/10.1115/IPACK2015-48724
View Paper titled, Prognostics Health Management Model for LED Package Failure Under Contaminated Environment
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Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability
Proceedings Papers

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Junchao Wei, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73288
https://doi.org/10.1115/IPACK2013-73288
View Paper titled, Solid State Lighting Life Prediction Using Extended Kalman Filter
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Topics: Kalman filters, Light-emitting diodes, Failure, Physics, Failure mechanisms, High temperature, Maintenance, Noise (Sound), Climate, Damage
Proceedings Papers

Measured-Temperature Interpolation and Visualization for Data Centers

Xuanhang (Simon) Zhang, Christopher M. Healey, Zachary R. Sheffer, James W. VanGilder
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73081
https://doi.org/10.1115/IPACK2013-73081
View Paper titled, Measured-Temperature Interpolation and Visualization for Data Centers
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Topics: Data centers, Interpolation, Temperature, Visualization, Cooling, Temperature sensors, Computation, Computational fluid dynamics, Fluid dynamics, Maintenance
Proceedings Papers

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

Pradeep Lall, Madhura Hande, Chandan Bhat, Jeff Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 101-116, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33876
https://doi.org/10.1115/IPACK2007-33876
View Paper titled, Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses
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Topics: Electronics, Packaging, Reliability, Stress, Thermomechanics, Failure, Damage, Algorithms, Architecture, Automotive safety