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Proceedings Papers

Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments

Alexis Krone, Hannah Alpert, Satish Shetty, Debbie G. Senesky, Gregory Salamo, David Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2589
https://doi.org/10.1115/IPACK2020-2589
View Paper titled, Degradation of Gallium Nitride-Based Hall-Effect Sensors in High Temperature Environments
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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Magnetic fields, Reliability, Sensors
Proceedings Papers

The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators

Gulru Babac
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48213
https://doi.org/10.1115/IPACK2015-48213
View Paper titled, The Contribution of the Bulk Modes on Electrical Conductivity in 3D Topological Insulators
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Topics: Electrical conductivity, Magnetic fields
Proceedings Papers

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

J. D. Hoffman, B. A. Dow, R. D. Lorenz
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73269
https://doi.org/10.1115/IPACK2013-73269
View Paper titled, Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing
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Topics: Electronic packages, Sensors, Design, Displacement, Finite element analysis, Semiconductors (Materials), Temperature, Currents, Eddies (Fluid dynamics), Eddy currents (Electricity)
Proceedings Papers

An Innovative Way to Measure Temperature by Using the Faraday Effect

Pranav Limaye, Anisur Rehman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 293-296, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52202
https://doi.org/10.1115/IPACK2011-52202
View Paper titled, An Innovative Way to Measure Temperature by Using the Faraday Effect
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Topics: Faraday effect, Temperature, Magnetic fields, Cables, Electromagnetic interference, Fibers, Insulation, Magnets, Optical fiber, Permanent magnets