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Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97481
https://doi.org/10.1115/IPACK2022-97481
View Paper titled, Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling
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Topics: Artificial neural networks, Computational fluid dynamics, Cooling, Heat sinks, Machine learning, Machinery, Optimization, Thermal management
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

John Kim, Raffaele L. Amalfi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72618
https://doi.org/10.1115/IPACK2021-72618
View Paper titled, Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications
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Topics: Computer cooling, Heat transfer, Machine learning, Machinery, Refrigerants, Two-phase flow
Proceedings Papers

Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles

Bidzina Kekelia, J. Emily Cousineau, Kevin Bennion, Sreekant Narumanchi, Shajjad Chowdhury
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2524
https://doi.org/10.1115/IPACK2020-2524
View Paper titled, Comparison of Thermal Management Approaches for Integrated Traction Drives in Electric Vehicles
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Topics: Electric vehicles, Thermal management, Traction, Electronics, Machinery, Cooling, Cooling systems, Engines, Finite element analysis, Fluids
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid

Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6457
https://doi.org/10.1115/IPACK2019-6457
View Paper titled, Surface Temperature Effect on Convective Heat Transfer Coefficients for Jet Impingement Cooling of Electric Machines With Automatic Transmission Fluid
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Topics: Convection, Impingement cooling, Machinery, Temperature, Transmission fluids
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8410
https://doi.org/10.1115/IPACK2018-8410
View Paper titled, The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74306
https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
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Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74264
https://doi.org/10.1115/IPACK2017-74264
View Paper titled, Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
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Topics: Printed circuit boards, Reliability, Solders, X-rays, Deformation, Electronics, Manufacturing, Solder joints, Computerized tomography, Heating
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Centrifugally Pumped Thermosiphons for Motor Rotor Cooling

S. A. McElhinney, T. M. Jahns, T. A. Shedd
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48516
https://doi.org/10.1115/IPACK2015-48516
View Paper titled, Centrifugally Pumped Thermosiphons for Motor Rotor Cooling
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Topics: Cooling, Engines, Motors, Rotors, Machinery, Design, Heat, Manufacturing, Centrifugal force, Chemical processes
Proceedings Papers

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48622
https://doi.org/10.1115/IPACK2015-48622
View Paper titled, Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning
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Topics: Creep, Elastic moduli, Experimental characterization, Flip-chip assemblies, Hardening (Curing), Machinery, Materials properties, Mechanical properties, Microscale devices, Production equipment
Proceedings Papers

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73191
https://doi.org/10.1115/IPACK2013-73191
View Paper titled, A Study on Impact Stresses in Ceramic Capacitors
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Topics: Capacitors, Ceramics, Stress, Design engineering, Fracture (Materials), Impact testing, Machinery, Manufacturing, Printed circuit boards
Proceedings Papers

Applications of Cold Plate Units With Micro-Channel for Cooling Electronics

Koichi Mashiko, Masataka Mochizuki, Kazuhiko Goto, Makoto Takahashi, Masahiro Matsuda, Yasuhiro Horiuchi, Tien Nguyen
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73028
https://doi.org/10.1115/IPACK2013-73028
View Paper titled, Applications of Cold Plate Units With Micro-Channel for Cooling Electronics
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Topics: Cooling, Electronics, Microchannels, Computers, Water, Brazing, Cooling systems, Data centers, Collaboration, Design
Proceedings Papers

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73242
https://doi.org/10.1115/IPACK2013-73242
View Paper titled, Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging
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Topics: Mechanical behavior, Microelectronic packaging, Polymers, Mechanical properties, Stress, Tension, Adhesives, Elastic moduli, Epoxy adhesives, Epoxy resins
Proceedings Papers

New Method for Evaluating Heat Transfer Material

Yasuhiro Saito, Hiroyuki Emoto, Yuuki Tuji, Takanori Komuro
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73051
https://doi.org/10.1115/IPACK2013-73051
View Paper titled, New Method for Evaluating Heat Transfer Material
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Topics: Heat transfer, Pressure, Aluminum plate, Heat sinks, Thermal conductivity, Shapes, Flow (Dynamics), Insulation, Machinery, Reliability
Proceedings Papers

Spatially-Aware Optimization of Energy Consumption in Consolidated Data Center Systems

Hui Chen, Mukil Kesavan, Karsten Schwan, Ada Gavrilovska, Pramod Kumar, Yogendra Joshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 461-470, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52080
https://doi.org/10.1115/IPACK2011-52080
View Paper titled, Spatially-Aware Optimization of Energy Consumption in Consolidated Data Center Systems
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Topics: Data centers, Energy consumption, Optimization, Stress, Temperature, Cooling, Energy efficiency, Machinery, Air flow