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Proceedings Papers

Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies

Pradeep Lall, Aathi Raja Ram Pandurangan, Jeff Suhling, John Deep
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2648
https://doi.org/10.1115/IPACK2020-2648
View Paper titled, Non-Perpendicular Orientation High-G Impact Reliability of Electronics Potted Assemblies
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Topics: Electronics, Reliability, Shock (Mechanics), Vehicles, Manufacturing, Solder joints, Aerospace industry, Ball-Grid-Array packaging, Capacitors, Ceramics
Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6580
https://doi.org/10.1115/IPACK2019-6580
View Paper titled, Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements
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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48623
https://doi.org/10.1115/IPACK2015-48623
View Paper titled, Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
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Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments

Pradeep Lall, Amrit Abrol, Lee Simpson, Jessica Glover
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48790
https://doi.org/10.1115/IPACK2015-48790
View Paper titled, Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Mechanical Shock Environments
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Topics: Accelerometers, Microelectromechanical systems, Shock (Mechanics), Reliability, Automotive industry, Complementary metal oxide semiconductors, Design, Failure mechanisms, Low temperature, Lumber
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48620
https://doi.org/10.1115/IPACK2015-48620
View Paper titled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
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Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 713-721, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52078
https://doi.org/10.1115/IPACK2011-52078
View Paper titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)
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Topics: Design, Semiconductor wafers, Solders, Reliability, Electronics, Failure, Flip-chip, Intermetallic compounds, Brittle fracture, Failure mechanisms
Proceedings Papers

Integrating an Electronics Component Database Into a Thermal Design Tool

Patrick Loney
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 731-740, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89080
https://doi.org/10.1115/InterPACK2009-89080
View Paper titled, Integrating an Electronics Component Database Into a Thermal Design Tool
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Topics: Databases, Design, Electronics, Engineers, Junctions, Lumber, Temperature, Computer software, Cooling, Electrical conductivity
Proceedings Papers

Nonlinear Response of a Printed Circuit Board in Shock

M. Vujosevic, P. Raghavan, G. Ramanathan, W. Hezeltine, K. Blue
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 45-54, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89094
https://doi.org/10.1115/InterPACK2009-89094
View Paper titled, Nonlinear Response of a Printed Circuit Board in Shock
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Topics: Printed circuit boards, Shock (Mechanics), Deformation, Stress, Lumber, Membranes, Metrology, Strain measurement, Finite element methods, Inertia (Mechanics)
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

Thermal Performance of Laminate-to-Aluminum Attachment Materials

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani, John Evans
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 327-333, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89097
https://doi.org/10.1115/InterPACK2009-89097
View Paper titled, Thermal Performance of Laminate-to-Aluminum Attachment Materials
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Topics: Aluminum, Laminates, Adhesives, Cycles, Delamination, Lumber, Hardening (Curing), Temperature, Testing, Thermal conductivity
Proceedings Papers

Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets

Nobuyuki Isoshima, Masatoshi Watanabe, Mika Ri, Yutaka Yamada, Koichi Sugimoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 681-692, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89041
https://doi.org/10.1115/InterPACK2009-89041
View Paper titled, Development of a Low-Noise and High-Performance Cooling Structure for Full-HD Plasma Display TV Sets
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Topics: Cooling, Noise (Sound), Plasmas (Ionized gases), Fans, Flow (Dynamics), Low temperature, Computational fluid dynamics, Heat transfer, Lumber, Natural convection
Proceedings Papers

Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine

Ashok Thiagarajan, Purushothaman Damodaran, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 931-936, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33808
https://doi.org/10.1115/IPACK2007-33808
View Paper titled, Optimizing the Cycle Time of a Multi-Spindle Pick-and-Place Machine
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Topics: Cycles, Machinery, Assembly lines, Computer software, Lumber, Nozzles, Solders, Electronics, Manufacturing, Ovens
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
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Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

High Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures Considering Line Patterns of Multilayered Circuit Boards

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 631-636, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33372
https://doi.org/10.1115/IPACK2007-33372
View Paper titled, High Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures Considering Line Patterns of Multilayered Circuit Boards
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Topics: Junctions, Printed circuit boards, Semiconductors (Materials), Temperature, Thermal analysis, Thermofluids, Anisotropy, Computer-aided design, Lumber, Modeling
Proceedings Papers

Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling

Roy W. Knight, Yasser Elkady, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 663-670, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33626
https://doi.org/10.1115/IPACK2007-33626
View Paper titled, Causes of Degradation of Thermal Performance of Ball Grid Arrays After Thermal Cycling
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Topics: Ball-Grid-Array packaging, Thermal resistance, Cracking (Materials), Cycles, Fracture (Process), Lumber, Solders, Delamination, Solder joints, Ball-Grid-Array packages
Proceedings Papers

Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

Guhan Subbarayan, Robert Kinyanjui, Pei Fang Tsai, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 43-49, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33666
https://doi.org/10.1115/IPACK2007-33666
View Paper titled, Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes
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Topics: Finishes, Reliability, Tin, Testing, Hazardous substances, Integrated circuits, Intermetallic compounds, Lumber, Nickel, Optical microscopes
Proceedings Papers

System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices

Victor Chiriac, Tien-Yu Tom Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 241-247, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33707
https://doi.org/10.1115/IPACK2007-33707
View Paper titled, System Level Thermal Optimization of an Automotive Lightning Module Incorporating Several Power Devices
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Topics: Lightning, Optimization, Energy dissipation, Temperature, Design, Pins (Engineering), Heat, Heat budget (Physics), Junctions, Automotive industry