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Proceedings Papers

Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter

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Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141874
https://doi.org/10.1115/IPACK2024-141874
View Paper titled, Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter
Open the PDF for Thermal Cycling Reliability of In-Mold Direct Write Additively Printed Integrator and Active Low-Pass Filter in another window
Topics: Filters, Low-pass filters, Reliability, Automobiles, Durability, Electronics, Adhesives, Computer software, Cutting, Engineering simulation
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

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Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Open the PDF for Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components in another window
Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

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J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
Open the PDF for 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies in another window
Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Embedded RF Filters for WLAN and Bluetooth Applications

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Telesphor Kamgaing, Jiangqi He, Rockwell Hsu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1621-1624, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73319
https://doi.org/10.1115/IPACK2005-73319
View Paper titled, Embedded RF Filters for WLAN and Bluetooth Applications
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Topics: Filters, Wireless LAN, Ceramics, Design, Low-pass filters, Manufacturing