1-10 of 10
Liquid crystals
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
Open the PDF for Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components in another window
Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52218
https://doi.org/10.1115/IPACK2011-52218
View Paper titled, High Performance Thermal Conductive Sheets Made of Carbon Fibers
Open the PDF for High Performance Thermal Conductive Sheets Made of Carbon Fibers in another window
Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance
Proceedings Papers

Cooling Effect of Several Rods on a Heated Flat Surface by Impinging Jet

Koichi Ichimiya, Yosuke Fujimori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 113-118, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89085
https://doi.org/10.1115/InterPACK2009-89085
View Paper titled, Cooling Effect of Several Rods on a Heated Flat Surface by Impinging Jet
Open the PDF for Cooling Effect of Several Rods on a Heated Flat Surface by Impinging Jet in another window
Topics: Cooling, Rods, Nozzles, Temperature distribution, Algorithms, Convection, Finite difference methods, Flow (Dynamics), Heat, Heat transfer
Proceedings Papers

Hygro-Mechanical Analysis of LCD Panels

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 815-824, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89267
https://doi.org/10.1115/InterPACK2009-89267
View Paper titled, Hygro-Mechanical Analysis of LCD Panels
Open the PDF for Hygro-Mechanical Analysis of LCD Panels in another window
Topics: Adhesives, Boundary layers, Deformation, Diffusion (Physics), Finite element methods, Gas laws (Thermodynamics), Glass, Liquid crystals, Manufacturing, Plates (structures)
Proceedings Papers

Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)

Pin-Chuan Chen, Michael W. Mitchell, Dimitris E. Nikitopoulos, Steven A. Soper, Michael C. Murphy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 129-135, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33330
https://doi.org/10.1115/IPACK2007-33330
View Paper titled, Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR)
Open the PDF for Assessment and Improvement of the Thermal Performance of a Polycarbonate Micro Continuous Flow Polymerase Chain Reactor (CFPCR) in another window
Topics: Chain, Flow (Dynamics), Temperature, Temperature distribution, Biomedical microelectromechanical systems, Liquid crystals, Copper, Thermal management, Thermocouples, Thin films
Proceedings Papers

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 465-472, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33212
https://doi.org/10.1115/IPACK2007-33212
View Paper titled, Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet
Open the PDF for Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet in another window
Topics: Stress analysis (Engineering), Thermomechanics, Finite element methods, Polarizers (Light), Liquid crystals, Warping, Diffusion (Physics), Leakage, Stress, Thermal stresses
Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73366
https://doi.org/10.1115/IPACK2005-73366
View Paper titled, A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
Open the PDF for A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli in another window
Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components
Proceedings Papers

Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique

S. T. Kuo, M. P. Wang, M. C. Wu, Y. H. Hung
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 73-80, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35020
https://doi.org/10.1115/IPACK2003-35020
View Paper titled, Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique
Open the PDF for Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique in another window
Topics: Heat sinks, Liquid crystals, Transients (Dynamics)
Proceedings Papers

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

Tarek Jamal-Eddine, Lawrence Mok
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 389-394, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35186
https://doi.org/10.1115/IPACK2003-35186
View Paper titled, Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer
Open the PDF for Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer in another window
Topics: Hinges, Laptop computers, Heat, Computer simulation, Flat heat pipes, Computers, Heat pipes, Springs, Acoustics, Aluminum
Proceedings Papers

Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack

Won-Keun Kim, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 741-747, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35093
https://doi.org/10.1115/IPACK2003-35093
View Paper titled, Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack
Open the PDF for Reliability Evaluation of Flip Chip Using Stress Intensity Factors of an Interface Crack in another window
Topics: Flip-chip, Flip-chip devices, Fracture (Materials), Reliability, Stress, Electronic packages, Packaging, Adhesives, Anisotropy, Delamination