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Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6541
https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
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Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6426
https://doi.org/10.1115/IPACK2019-6426
View Paper titled, Correlated Effects of Self-Heating, Light Output, and Efficiency of GaN Light-Emitting Diodes on Junction Temperature
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Topics: Gallium nitride, Heating, Junctions, Light-emitting diodes, Temperature, Brightness (Photometry), Indium gallium nitride, Nanoparticles, Quantum wells, Temperature measurement
Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8301
https://doi.org/10.1115/IPACK2018-8301
View Paper titled, Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure
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Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability
Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8211
https://doi.org/10.1115/IPACK2018-8211
View Paper titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
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Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter
Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8226
https://doi.org/10.1115/IPACK2018-8226
View Paper titled, Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging
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Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes
Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8225
https://doi.org/10.1115/IPACK2018-8225
View Paper titled, All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes
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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering
Proceedings Papers

Advancements in Silver Wire Bonding

Subramani Manoharan, Chandradip Patel, Patrick McCluskey
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74286
https://doi.org/10.1115/IPACK2017-74286
View Paper titled, Advancements in Silver Wire Bonding
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Topics: Silver, Wire bonding, Copper, Wire, Reliability, Bonding, Corrosion, Light-emitting diodes, Palladium, Aerospace industry
Proceedings Papers

Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer

Xingjian Yu, Weicheng Shu, Bofeng Shang, Bin Xie, Yanhua Cheng, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74195
https://doi.org/10.1115/IPACK2017-74195
View Paper titled, Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
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Topics: Light-emitting diodes, Phosphors, Shapes, Geometry, Coating processes, Coatings, Computer simulation, Fluids, Temperature
Proceedings Papers

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Jiaqi Wang, Jeffery C. C. Lo, S. W. Ricky Lee, Feng Yun, Mian Tao
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A046, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48664
https://doi.org/10.1115/IPACK2015-48664
View Paper titled, Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode
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Topics: Absorption, Emissions, Light scattering, Light-emitting diodes, Modeling, Phosphors, Wavelength, Excitation, Emission spectra, Plates (structures)
Proceedings Papers

Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems

Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
https://doi.org/10.1115/IPACK2015-48326
View Paper titled, Thermal and Optical Performance of Eco-Friendly Silk Fibroin Proteins as a Cavity Encapsulation Over LED Systems
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Topics: Cavities, Proteins, Silicones, Biomaterials, Computational fluid dynamics, Light-emitting diodes, Phosphors, Polymers, Thermal conductivity, Absorption
Proceedings Papers

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

Carin Lundquist Ruiz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48769
https://doi.org/10.1115/IPACK2015-48769
View Paper titled, Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations
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Topics: Design, Modeling, Cutting, Engineers, Light-emitting diodes, Simulation, Structural design
Proceedings Papers

Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants

Sheng-Fu Mei, Zhong-Shan Deng, Jing Liu
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48318
https://doi.org/10.1115/IPACK2015-48318
View Paper titled, Hybrid Mini/Micro-Channel Heat Sink Using Liquid Metal and Water as Coolants
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Topics: Coolants, Heat sinks, Liquid metals, Microchannels, Water, Cooling, Electronics, Flow (Dynamics), Specific heat, Computer cooling
Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48785
https://doi.org/10.1115/IPACK2015-48785
View Paper titled, LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
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Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

Fernan Saiz, Cristina H. Amon
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48114
https://doi.org/10.1115/IPACK2015-48114
View Paper titled, The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
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Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat
Proceedings Papers

Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics

Boris Marovic, Mathew Clark, James Petroski
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48635
https://doi.org/10.1115/IPACK2015-48635
View Paper titled, Analyzing Temperature Changes in Powered LEDs by Combining Thermal and Radiometric Characterization With Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Light-emitting diodes, Simulation, Temperature, Workflow
Proceedings Papers

Solid State Lighting Life Prediction Using Extended Kalman Filter

Pradeep Lall, Junchao Wei, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73288
https://doi.org/10.1115/IPACK2013-73288
View Paper titled, Solid State Lighting Life Prediction Using Extended Kalman Filter
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Topics: Kalman filters, Light-emitting diodes, Failure, Physics, Failure mechanisms, High temperature, Maintenance, Noise (Sound), Climate, Damage
Proceedings Papers

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

Enes Tamdogan, Mehmet Arik, M. Baris Dogruoz
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
https://doi.org/10.1115/IPACK2013-73031
View Paper titled, Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement
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Topics: Cooling, Design, Light-emitting diodes
Proceedings Papers

Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System

Sun-min Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73064
https://doi.org/10.1115/IPACK2013-73064
View Paper titled, Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System
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Topics: Cooling systems, Temperature, Design, Light-emitting diodes, Pressure drop, Heat transfer, Laminar flow, Numerical analysis, Reynolds-averaged Navier–Stokes equations, Thermal management
Proceedings Papers

Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73305
https://doi.org/10.1115/IPACK2013-73305
View Paper titled, Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter
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Topics: Filters, Light-emitting diodes, Particulate matter
Proceedings Papers

Novel Application-Specific LED Packages Integrated With Compact Freeform Lens

Kai Wang, Fei Chen, Zongyuan Liu, Xiaobing Luo, Sheng Liu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 685-691, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89335
https://doi.org/10.1115/InterPACK2009-89335
View Paper titled, Novel Application-Specific LED Packages Integrated With Compact Freeform Lens
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Topics: Lenses (Optics), Packaging, Light-emitting diodes, Roads, Silicones, Computer simulation, Design methodology, Manufacturing, Optics