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Proceedings Papers

Standardized Approach for Assessing Fiber Device Resiliency

Conor Galligan, Daniel Alves
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141204
https://doi.org/10.1115/IPACK2024-141204
View Paper titled, Standardized Approach for Assessing Fiber Device Resiliency
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Topics: Fibers, Resilience, Testing, Governments, Photonic equipment, Engineering prototypes, Failure, Lasers, Manufacturing, Photonics
Proceedings Papers

Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures

Pradeep Lall, Ved Soni, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142113
https://doi.org/10.1115/IPACK2024-142113
View Paper titled, Evaluation of Printed Logic Circuits With Additively Packaged GaN Bare Die Devices at High Temperatures
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Topics: Circuits, Electronics, Gallium nitride, High temperature, Lasers
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97220
https://doi.org/10.1115/IPACK2022-97220
View Paper titled, High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering
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Topics: Brightness (Photometry), Diffusion (Physics), Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics)
Proceedings Papers

Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure

Sougata Hazra, Tanya Liu, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2640
https://doi.org/10.1115/IPACK2020-2640
View Paper titled, Lasered Roughness to Increase Wicking Rates in Pin-Fin Microstructure
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Topics: Lasers, Surface roughness, Vapors
Proceedings Papers

Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal

Sougata Hazra, Ki Wook Jung, Madhusudan Iyengar, Chris Malone, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6539
https://doi.org/10.1115/IPACK2019-6539
View Paper titled, Addressing the Challenges in Laser Micro-Machining and Bonding of Silicon Microchannel Cold-Plate and 3D-Manifold for Embedded Cooling Applications: Perfect Debris Removal
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Topics: Bonding, Cooling, Lasers, Manifolds, Microchannels, Microfabrication, Micromachining, Silicon
Proceedings Papers

Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins

Yuta Nakamura, Kazuyoshi Fushinobu, Asato Tamura
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6356
https://doi.org/10.1115/IPACK2019-6356
View Paper titled, Numerical Analysis of Pulse Laser Assisted Curing Region of Photocurable Resins
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Topics: Additive manufacturing, Computer simulation, Hardening (Curing), Lasers, Numerical analysis, Photons, Polymerization, Resins, Manufacturing, Nanoscale phenomena
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

True Concurrent Modulation of a Multi-Channel Ring Modulator Transmitter Driven by a Comb Laser

Ashkan Seyedi, Marco Fiorentino, Ray Beausoleil
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74337
https://doi.org/10.1115/IPACK2017-74337
View Paper titled, True Concurrent Modulation of a Multi-Channel Ring Modulator Transmitter Driven by a Comb Laser
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Topics: Lasers, Quantum dots
Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74173
https://doi.org/10.1115/IPACK2017-74173
View Paper titled, Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering
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Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates

Shenghui Lei, Alexandre Shen, Ryan Enright
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74181
https://doi.org/10.1115/IPACK2017-74181
View Paper titled, Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates
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Topics: Photonics, Silicon, Thermal resistance, Etching, Silicon-on-insulator, Cladding systems (Building), Thermal conductivity, Aluminum, Crystals, Diffusion (Physics)
Proceedings Papers

Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing

Richard Barnett, Dave Thomas, Oliver Ansell
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48749
https://doi.org/10.1115/IPACK2015-48749
View Paper titled, Singulation by Plasma Etching: Integration Techniques to Enable Low Damage, High Productivity Dicing
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Topics: Blades, Damage, Flow (Dynamics), Lasers, Plasma etching, Plasmas (Ionized gases), Reliability, Semiconductor wafers, Traction
Proceedings Papers

Laser Processing by Using Fluidic Laser Beam Shaper

Hong Duc Doan, Naoki Iwatani, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73059
https://doi.org/10.1115/IPACK2013-73059
View Paper titled, Laser Processing by Using Fluidic Laser Beam Shaper
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Topics: Laser beams, Lasers, Laser materials, Drilling
Proceedings Papers

Fundamental Research on Via Processing by Using Short Pulse Laser in SiC

Naoki Iwatani, Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73060
https://doi.org/10.1115/IPACK2013-73060
View Paper titled, Fundamental Research on Via Processing by Using Short Pulse Laser in SiC
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Topics: Lasers, Water, Ablation (Vaporization technology), Fluence (Radiation measurement), Fracture (Materials), Semiconductor wafers, Drilling, Etching, Film thickness, Nd-YAG lasers
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73112
https://doi.org/10.1115/IPACK2013-73112
View Paper titled, Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Hong Duc Doan, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73050
https://doi.org/10.1115/IPACK2013-73050
View Paper titled, Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate
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Topics: Compression, Lasers, Thermoreflectance, Electrons, Temperature, Computer simulation, Density, Reflectance, Thermal analysis
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52243
https://doi.org/10.1115/IPACK2011-52243
View Paper titled, Spectral Detail of Phonon Conduction and Scattering in Graphene
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

Fluidic Laser Beam Shaper by Using Thermal Lens Effect

Hong Duc Doan, Yoshihiko Akamine, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 749-755, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52214
https://doi.org/10.1115/IPACK2011-52214
View Paper titled, Fluidic Laser Beam Shaper by Using Thermal Lens Effect
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Topics: Laser beams, Lenses (Optics), Lasers, Pumps, Absorption, Probes, Refractive index, Optics, Temperature distribution
Proceedings Papers

A Novel Precision Die Attach Technique for Opto-Electronics Packaging

V. Bhagavatula, S. Chaparala, J. Himmelreich
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 1-7, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52028
https://doi.org/10.1115/IPACK2011-52028
View Paper titled, A Novel Precision Die Attach Technique for Opto-Electronics Packaging
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Topics: Gravity (Force), Lasers, Optoelectronic devices, Packaging