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Proceedings Papers

Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

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Stewart Christie, Anna Prakash, Elaina Ashton, Veronica Tanner
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111936
https://doi.org/10.1115/IPACK2023-111936
View Paper titled, Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process
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Topics: Artificial intelligence, Flaw detection, Manufacturing, Optical quality control, Errors, Computers, Electronics, Flat heat pipes, Inspection, Laptop computers
Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

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Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74278
https://doi.org/10.1115/IPACK2017-74278
View Paper titled, A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply
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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation
Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

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David Huitink
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74245
https://doi.org/10.1115/IPACK2017-74245
View Paper titled, Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

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Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48019
https://doi.org/10.1115/IPACK2015-48019
View Paper titled, Hot Spot Elimination by Thin and Smart Heat Spreader
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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis
Proceedings Papers

On the Thermal Management Challenges in Next Generation Handheld Devices

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Guy R. Wagner, William Maltz
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A046, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73237
https://doi.org/10.1115/IPACK2013-73237
View Paper titled, On the Thermal Management Challenges in Next Generation Handheld Devices
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Topics: Thermal management, Cooling, Energy dissipation, Computers, Flat heat pipes, Laptop computers, Shells, Temperature
Proceedings Papers

Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan

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Ahmad Jalilvand, Masataka Mochizuki, Yuji Saito, Yoji Kawahara, Vijit Wuttijumnong, Thang Nguyen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 367-375, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52267
https://doi.org/10.1115/IPACK2011-52267
View Paper titled, Thinner Thermal Solution Module by Combination of Thin Heat Pipe and Piezo Fan
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Topics: Diluents, Heat pipes, Cooling, Laptop computers, Packaging, Acoustics, Condensers (steam plant), Density, Flat heat pipes, Heat
Proceedings Papers

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

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Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 165-172, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52095
https://doi.org/10.1115/IPACK2011-52095
View Paper titled, Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices
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Topics: Heat pipes, Heat transfer, Heat, Cooling, Cooling systems, Water, Bubbles, Flow (Dynamics), Stress, Thermal energy
Proceedings Papers

Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics

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Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 741-747, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52191
https://doi.org/10.1115/IPACK2011-52191
View Paper titled, Exergy Analysis and Entropy Generation Minimization of Thermoelectric Waste Heat Recovery for Electronics
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Topics: Electronics, Entropy, Exergy analysis, Heat recovery, Heat, Electronic systems, Brayton cycle, Design, Energy / power systems, Energy conversion
Proceedings Papers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

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Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 571-578, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89341
https://doi.org/10.1115/InterPACK2009-89341
View Paper titled, Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications
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Topics: Flat heat pipes, Graphite, Pareto optimization, Cooling, Copper, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density
Proceedings Papers

Challenges and Advances of Heat Pipes in Cooling Notebook Systems

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Sridhar V. Machiroutu, Himanshu Pokharna, Masahiro Kuroda
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 677-687, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33249
https://doi.org/10.1115/IPACK2007-33249
View Paper titled, Challenges and Advances of Heat Pipes in Cooling Notebook Systems
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Topics: Cooling, Heat pipes, Laptop computers, Design, Computers, Condensers (steam plant), Experimental design, Heat, Heat exchangers, Manufacturing
Proceedings Papers

Thermal Performance of Natural Graphite Heat Spreaders

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Martin Smalc, Gary Shives, Gary Chen, Shrishail Guggari, Julian Norley, R. Andy Reynolds, III
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 79-89, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73073
https://doi.org/10.1115/IPACK2005-73073
View Paper titled, Thermal Performance of Natural Graphite Heat Spreaders
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Topics: Anisotropy, Flat heat pipes, Graphite, Laptop computers
Proceedings Papers

DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII

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Bryan Hsieh, Kevin Chiang, Y. P. Wang, C. S. Hsiao
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1063-1068, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73200
https://doi.org/10.1115/IPACK2005-73200
View Paper titled, DDRII Memory Packages Electrical Performance Comparison of COSBGA, TFBGA, and Standard TSOPII
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Clocks, Density, Electronics, Laptop computers, Manufacturing, Noise (Sound), Packaging, Signals
Proceedings Papers

Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application

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Masataka Mochizuki, Yuji Saito, Thang Nguyen, Vijit Wuttijumnong, Xiaoping Wu, Tien Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 431-437, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73286
https://doi.org/10.1115/IPACK2005-73286
View Paper titled, Revolution in Fan Heat Sink Cooling Technology to Extend and Maximize Air Cooling for High Performance Processors in Laptop / Desktop / Server Application
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Topics: Cooling, Heat pipes, Heat sinks, Laptop computers, Vapors, Energy dissipation, Heat, Clocks, Design, Heat flux
Proceedings Papers

Cooling of Notebook PCs by Flexible Oscillating Heat Pipes

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Yoshiro Miyazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 65-69, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73055
https://doi.org/10.1115/IPACK2005-73055
View Paper titled, Cooling of Notebook PCs by Flexible Oscillating Heat Pipes
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Topics: Cooling, Dynamic light scattering, Heat pipes, Laptop computers, Heat, Computers, Cooling systems, Copper, Heating, Hinges
Proceedings Papers

Mathematical Optimization of Electronic Enclosures

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D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
https://doi.org/10.1115/IPACK2005-73185
View Paper titled, Mathematical Optimization of Electronic Enclosures
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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans
Proceedings Papers

Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC

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Yi Jia, Pablo D. Quinones
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 349-354, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35135
https://doi.org/10.1115/IPACK2003-35135
View Paper titled, Numerical Simulation of a Heat Pipe Embedded Cooling System for a Notebook PC
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Topics: Computer simulation, Cooling systems, Heat pipes, Laptop computers, Heat, Computer software, Dynamic light scattering, Energy dissipation, Finite element model, Geometry
Proceedings Papers

Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop

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Satoru Gima, Takashi Nagata, Xing Zhang, Motoo Fujii
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 337-342, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35148
https://doi.org/10.1115/IPACK2003-35148
View Paper titled, Indirect Cooling of IC Chips Using a Two Phase Closed Thermosyphon Loop
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Topics: Cooling, Laptop computers, Condensers (steam plant), Temperature, Boiling, Heat, Computer cooling, Cooling systems, Dimensions, Fluids
Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

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Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35242
https://doi.org/10.1115/IPACK2003-35242
View Paper titled, Thermofluid Design of Energy Efficient and Compact Heat Sinks
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Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency
Proceedings Papers

Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer

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Tarek Jamal-Eddine, Lawrence Mok
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 389-394, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35186
https://doi.org/10.1115/IPACK2003-35186
View Paper titled, Experimental and Numerical Studies of the Thermal Hinge in a Notebook Computer
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Topics: Hinges, Laptop computers, Heat, Computer simulation, Flat heat pipes, Computers, Heat pipes, Springs, Acoustics, Aluminum