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Proceedings Papers

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74088
https://doi.org/10.1115/IPACK2021-74088
View Paper titled, Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing
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Topics: Accelerated life testing, Flexible electronics, Lamination, Lithium-ion batteries
Proceedings Papers

Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design

Chang-Chun Lee, Pei-Chen Huang, Chi-Wei Wang, Oscar Chuang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6541
https://doi.org/10.1115/IPACK2019-6541
View Paper titled, Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design
Open the PDF for Stress Evaluation of Flexible Displays With Multiple-Laminations Architecture Enabled by Experimental Measurement and Simulation Based Factorial Design in another window
Topics: Design, Finite element analysis, Lamination, Light-emitting diodes, Simulation, Stress, Adhesives, Coatings, Fatigue, Materials properties
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8386
https://doi.org/10.1115/IPACK2018-8386
View Paper titled, Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

Ryan Lewis, Julie Slaughter, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48503
https://doi.org/10.1115/IPACK2015-48503
View Paper titled, Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination
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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination
Proceedings Papers

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)

Pushkraj Tumne, Vikram Venkatadri, Santosh Kudtarkar, Michael Delaus, Daryl Santos, Ross Havens, Krishnaswami Srihari
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 713-721, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52078
https://doi.org/10.1115/IPACK2011-52078
View Paper titled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages (WLCSP)
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Topics: Design, Semiconductor wafers, Solders, Reliability, Electronics, Failure, Flip-chip, Intermetallic compounds, Brittle fracture, Failure mechanisms
Proceedings Papers

Assembly Cost Reduction With Wafer Level Die Attach Film

Stewart Dunlap
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 7-9, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33121
https://doi.org/10.1115/IPACK2007-33121
View Paper titled, Assembly Cost Reduction With Wafer Level Die Attach Film
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Topics: Manufacturing, Semiconductor wafers, Adhesives, Lamination, Silicon
Proceedings Papers

Process Development and Die Shear Testing in MOEMS Packaging

Nikhil Lakhkar, Abiodun Fasoro, Amit Patil, Woo Ho Lee, Dan Popa, Dereje Agonafer, Harry Stephanou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 971-977, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33986
https://doi.org/10.1115/IPACK2007-33986
View Paper titled, Process Development and Die Shear Testing in MOEMS Packaging
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Topics: Microoptoelectromechanical systems, Packaging, Shear (Mechanics), Testing, Reliability, MEMS packaging, Microelectromechanical systems, Signals, Contamination, Failure
Proceedings Papers

A Novel Discrete Passives Integration on Organic Substrate

Vasudivan Sunappan, Chee Wai Lu, Lai Lai Wai, Wei Fan, Boon Keng Lok
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1963-1967, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73102
https://doi.org/10.1115/IPACK2005-73102
View Paper titled, A Novel Discrete Passives Integration on Organic Substrate
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Topics: Capacitors, Inductors, Integrated circuits, Lamination, Manufacturing, Printed circuit boards, Reliability, Resistors, Resonance, Solder joints