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Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

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Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours

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Pradeep Lall, Amrit Abrol, Nakul Kothari, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6569
https://doi.org/10.1115/IPACK2019-6569
View Paper titled, Process Capability of Aerosol-Jet Additive Processes for Long-Runs up to 10-Hours
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Topics: Additive manufacturing, Aerosols, Temperature, Printing, Sintering, Shear (Mechanics), Stress, Failure, Manufacturing, Mechanical properties
Proceedings Papers

Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach

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M. Niessner, G. Haubner, W. Hartner, S. Pahlke
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8379
https://doi.org/10.1115/IPACK2018-8379
View Paper titled, Controlling the Solder Joint Reliability of eWLB Packages in Automotive Radar Applications Using a Design for Reliability Approach
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Topics: Design, Radar, Reliability, Solder joints, Simulation, Laminates, Accelerated life testing, Ball-Grid-Array packaging, Materials properties, Mechanical properties
Proceedings Papers

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

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Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8386
https://doi.org/10.1115/IPACK2018-8386
View Paper titled, Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems
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Topics: Condition monitoring, Electronic systems, Sensors, Vibration, Failure, Delamination, Electronics, Manufacturing, Physics, Reflow soldering
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

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Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics

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Kaustubh Nagarkar, Craig Galligan, Michael Klitzke, James Rose, Binoy Shah, Donna Sherman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A031, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48704
https://doi.org/10.1115/IPACK2015-48704
View Paper titled, Novel Flexible Interconnects and Packaging for Minimally Invasive Medical Electronics
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Topics: Biomedicine, Electronics, Packaging, Circuits, Laminates, Manufacturing, Microelectromechanical systems, Pressure sensors, Sensors
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

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Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48626
https://doi.org/10.1115/IPACK2015-48626
View Paper titled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination

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Ryan Lewis, Julie Slaughter, Y. C. Lee
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48503
https://doi.org/10.1115/IPACK2015-48503
View Paper titled, Improved Flexibility of Alumina Ultrathin Barrier Films by Nano-Lamination
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Topics: Ceramics, Cracking (Materials), Elastic moduli, Flexible electronics, Fracture (Materials), Fracture (Process), Fracture mechanics, Heat pipes, Laminates, Lamination
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

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Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
https://doi.org/10.1115/IPACK2013-73062
View Paper titled, Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
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Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

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Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
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Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

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Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

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David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Thermal Performance of Laminate-to-Aluminum Attachment Materials

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John F. Maddox, Roy W. Knight, Sushil H. Bhavnani, John Evans
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 327-333, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89097
https://doi.org/10.1115/InterPACK2009-89097
View Paper titled, Thermal Performance of Laminate-to-Aluminum Attachment Materials
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Topics: Aluminum, Laminates, Adhesives, Cycles, Delamination, Lumber, Hardening (Curing), Temperature, Testing, Thermal conductivity
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

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Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
https://doi.org/10.1115/InterPACK2009-89209
View Paper titled, Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies
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Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

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Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
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Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

Die Stress Variation During Thermal Cycling Reliability Tests

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M. Kaysar Rahim, Jordan Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 481-492, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33548
https://doi.org/10.1115/IPACK2007-33548
View Paper titled, Die Stress Variation During Thermal Cycling Reliability Tests
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Topics: Reliability, Stress, Sensors, Temperature, Cycles, Packaging, Electronic packaging, Solders, Accelerated life testing, Constitutive equations
Proceedings Papers

Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies

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M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1237-1252, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73348
https://doi.org/10.1115/IPACK2005-73348
View Paper titled, Evolution of Die Stress and Delamination During Thermal Cycling of Flip Chip Assemblies
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Topics: Delamination, Flip-chip assemblies, Stress, Flip-chip, Flip-chip devices, Sensors, Silicon, Cycles, Manufacturing, Solder joints
Proceedings Papers

Effects of Interlayer Resin Bonding on Fatigue Crack Initiation/Propagation in Laminate Materials With a Surface Layer of Copper Film

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Akira Matsuba, Tashiyuki Torii, DongHui Ma
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1719-1724, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73168
https://doi.org/10.1115/IPACK2005-73168
View Paper titled, Effects of Interlayer Resin Bonding on Fatigue Crack Initiation/Propagation in Laminate Materials With a Surface Layer of Copper Film
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Topics: Annealing, Bonding, Copper, Crack propagation, Fatigue cracks, Laminates, Resins
Proceedings Papers

Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments

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Pradeep Lall, Nokibul Islam, Prakriti Choudhary, Jeff Suhling
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1535-1543, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73426
https://doi.org/10.1115/IPACK2005-73426
View Paper titled, Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments
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Topics: Electronics, Failure, Damage, Ball-Grid-Array packaging, Design, Electronic components, Intermetallic compounds, Laminates, MEMS packages, Solders
Proceedings Papers

Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes

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Eiichi Aoyama, Hisaya Kondou, Ryu Minagi, Tsutao Katayama, Toshiki Hirogaki, Hisahiro Inoue
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 317-323, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35086
https://doi.org/10.1115/IPACK2003-35086
View Paper titled, Quality Estimating Model Based on Temperature of Hole Bottom in Laser Drilling of Blind Holes
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Topics: Drilling, Lasers, Temperature, Circuits, Printed circuit boards, Copper foil, Heat, Absorption, Damage, Finite element methods