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Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
https://doi.org/10.1115/IPACK2013-73062
View Paper titled, Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
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Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel

Yan Fan, Poh Seng Lee, Li-Wen Jin, Beng Wah Chua, Na-Si Mou, Mrinal Jagirdar
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A033, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73162
https://doi.org/10.1115/IPACK2013-73162
View Paper titled, A Parametric Numerical Study in Cylindrical Oblique Fin Minichannel
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Topics: Computational fluid dynamics, Dimensions, Engineering simulation, Flow (Dynamics), Forced convection, Heat, Heat flux, Heat sinks, Heat transfer, Laminar flow
Proceedings Papers

Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink

Afzal Husain, Jun-Hee Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73063
https://doi.org/10.1115/IPACK2013-73063
View Paper titled, Thermal Performance of a Silicon-Based Multiple Micro-Jet Impingement Heat Sink
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Topics: Heat sinks, Silicon, Flow (Dynamics), Laminar flow, Design, Boundary-value problems, Cross-flow, Electronics, Heat flux, Heat transfer
Proceedings Papers

Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System

Sun-min Kim, Kwang-Yong Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73064
https://doi.org/10.1115/IPACK2013-73064
View Paper titled, Parametric Study on Thermal and Hydraulic Performance of a Hybrid Double-Side Micro-Jet Cooling System
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Topics: Cooling systems, Temperature, Design, Light-emitting diodes, Pressure drop, Heat transfer, Laminar flow, Numerical analysis, Reynolds-averaged Navier–Stokes equations, Thermal management
Proceedings Papers

Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A039, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73187
https://doi.org/10.1115/IPACK2013-73187
View Paper titled, Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass
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Topics: Energy efficiency, Heat sinks, Optimization, Porous materials, Heat transfer, Porosity, Fluids, Density, Electrical conductivity, Energy consumption
Proceedings Papers

Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles

Leyuan Yu, Dong Liu, Frank Botz
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 343-355, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52256
https://doi.org/10.1115/IPACK2011-52256
View Paper titled, Laminar Convective Heat Transfer of Alumina-Polyalphaolefin Nanofluids Containing Spherical and Non-Spherical Nanoparticles
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Topics: Convection, Nanofluids, Nanoparticles, Fluids, Heat transfer, Particulate matter, Water, Friction, Laminar flow, Nanorods
Proceedings Papers

Enhanced Microchannel Heat Sinks Using Oblique Fins

Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 253-260, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89059
https://doi.org/10.1115/InterPACK2009-89059
View Paper titled, Enhanced Microchannel Heat Sinks Using Oblique Fins
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Topics: Fins, Heat sinks, Microchannels, Heat transfer, Flow (Dynamics), Boundary layers, Fluids, Heat transfer coefficients, Laminar flow, Numerical analysis
Proceedings Papers

Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 953-961, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89306
https://doi.org/10.1115/InterPACK2009-89306
View Paper titled, Comparison of Numerical Modeling to Experimental Data in a Small Data Center Test Cell
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Topics: Computer simulation, Data centers, Computational fluid dynamics, Turbulence, Flow (Dynamics), Temperature, Compacting, Cooling, Design, Heat transfer
Proceedings Papers

Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates

Shuichi Torii, Wen Jei Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 547-554, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33054
https://doi.org/10.1115/IPACK2007-33054
View Paper titled, Thermal Fluid Flow Transport Phenomena in a Channel Containing Slot-Perforated Flat Plates
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Topics: Channel flow, Flat plates, Flow (Dynamics), Fluid dynamics, Fluids, Heat transfer, Laminar flow, Reynolds number, Thermal boundary layers, Thermofluids
Proceedings Papers

Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels

Y. L. Hao, Y.-X. Tao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 449-459, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35224
https://doi.org/10.1115/IPACK2003-35224
View Paper titled, Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels
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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Heat transfer, Laminar flow, Particulate matter, Computational fluid dynamics, Computer simulation, Computers, Ducts
Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35242
https://doi.org/10.1115/IPACK2003-35242
View Paper titled, Thermofluid Design of Energy Efficient and Compact Heat Sinks
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Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency
Proceedings Papers

A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets

Jorge L. Rosales, Victor A. Chiriac
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 381-387, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35183
https://doi.org/10.1115/IPACK2003-35183
View Paper titled, A Novel Microelectronics Cooling Technique Using a Pair of Unsteady Confined Impinging Air Jets
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Topics: Air jets, Cooling, Microelectronic devices, Jets, Reynolds number, Heat transfer, Flow (Dynamics), Heat, Bubbles, Heat transfer coefficients