1-20 of 54
Intermetallic compounds
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
Open the PDF for Comparing Wire Bonding Strategies for High Power Applications in another window
Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Open the PDF for Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications in another window
Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69882
https://doi.org/10.1115/IPACK2021-69882
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73348
https://doi.org/10.1115/IPACK2021-73348
View Paper titled, Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints
Open the PDF for Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints in another window
Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging

Jing Wu, Mohammad S. Alam, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2695
https://doi.org/10.1115/IPACK2020-2695
View Paper titled, Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging
Open the PDF for Investigation and Comparison of Aging Effects in SAC305 and Doped SAC+X Solders Exposed to Isothermal Aging in another window
Topics: Intermetallic compounds, Lead-free solders, Solders, Particulate matter, Tin, Alloys, Mechanical behavior, Diffusion (Physics), High temperature, Mechanical properties
Proceedings Papers

Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers

Sougata Hazra, Yashvi Singh, Mehdi Asheghi, Kenneth Goodson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2533
https://doi.org/10.1115/IPACK2020-2533
View Paper titled, Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers
Open the PDF for Characterization and Prevention of Metal Overflow in Ultra-Thin Au-Sn Eutectic Chip Bonding for Packaging and Integration of Extreme Heat Flux Micro-Coolers in another window
Topics: Bonding, Flip-chip, Heat flux, Intermetallic compounds, Metals, Microcoolers, Packaging, Tin
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2556
https://doi.org/10.1115/IPACK2020-2556
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders

Jing Wu, Mohammad S. Alam, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6571
https://doi.org/10.1115/IPACK2019-6571
View Paper titled, Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders
Open the PDF for Investigation of the Effects of High Temperature Aging on Mechanical Behavior and Microstructural Changes in Lead Free Solders in another window
Topics: Intermetallic compounds, Lead-free solders, Mechanical behavior, Temperature effects
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
Open the PDF for Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging in another window
Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn

Erick Gutierrez, Subramani Manoharan, Maxim Serebreni, Patrick McCluskey
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A018, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8392
https://doi.org/10.1115/IPACK2018-8392
View Paper titled, Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn
Open the PDF for Mechanical Characterization of Transient Liquid Phase Sintered (TLPS) Cu-Sn in another window
Topics: Tension-leg platforms, Tin, Transients (Dynamics), Alloys, High temperature, Nanoindentation, Shear (Mechanics), Stress, Copper, Electronic systems
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
Open the PDF for Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling in another window
Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments

Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8358
https://doi.org/10.1115/IPACK2018-8358
View Paper titled, Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments
Open the PDF for Copper, Silver, and PCC Wirebonds Reliability in Automotive Underhood Environments in another window
Topics: Copper, Reliability, Silver, Wire, Failure mechanisms, Shear strength, High temperature, Shear (Mechanics), Wire bonding, Aluminum
Proceedings Papers

Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74138
https://doi.org/10.1115/IPACK2017-74138
View Paper titled, Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation
Open the PDF for Prediction and Mitigation of Vertical Cracking in High-Temperature Transient Liquid Phase Sintered Joints by Thermo-Mechanical Simulation in another window
Topics: Cracking (Materials), Fracture (Process), High temperature, Simulation, Thermomechanics, Transients (Dynamics), Tension-leg platforms, Stress, Fracture (Materials), Tin
Proceedings Papers

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74266
https://doi.org/10.1115/IPACK2017-74266
View Paper titled, Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder
Open the PDF for Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder in another window
Topics: Lead-free solders, Tin, Cross section (Physics), Microscopy, Particulate matter, Cooling, Intermetallic compounds, Nanoindentation, Polishing, Scanning electron microscopy
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48009
https://doi.org/10.1115/IPACK2015-48009
View Paper titled, Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
Open the PDF for Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling in another window
Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages

Babak Talebanpour, Indranath Dutta
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48125
https://doi.org/10.1115/IPACK2015-48125
View Paper titled, Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages
Open the PDF for Fracture Mechanisms in Sn-Ag-Cu Solder Micro-Bumps for 3D Microelectronic Packages in another window
Topics: Fracture (Materials), Solders, Tin, Fracture toughness, Failure, Brittleness, Ductile fracture, Electronic packages, Fractography, Fracture mechanics
Proceedings Papers

Microstructural Stability of Au-Sn SLID Joints for Harsh Environments

Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48323
https://doi.org/10.1115/IPACK2015-48323
View Paper titled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
Open the PDF for Microstructural Stability of Au-Sn SLID Joints for Harsh Environments in another window
Topics: Stability, Tin, Bonding, Melting point, Fracture (Materials), Copper, Diffusion (Physics), Electronic packaging, Intermetallic compounds, Microscopy
Proceedings Papers

Analysis of Intermetallic Formation During Ultrasonic Ball Bonding

Panthea Sepehrband, Maryam Gholamirad
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A028, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48812
https://doi.org/10.1115/IPACK2015-48812
View Paper titled, Analysis of Intermetallic Formation During Ultrasonic Ball Bonding
Open the PDF for Analysis of Intermetallic Formation During Ultrasonic Ball Bonding in another window
Topics: Bonding, Intermetallic compounds, Alloys, Aluminum, Copper, Diffusion (Physics), Experimental analysis, Finite element analysis, Low temperature, Micromechanical devices
Proceedings Papers

High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects

Hannes Greve, S. Ali Moeini, Patrick McCluskey, Shailesh Joshi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A037, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48577
https://doi.org/10.1115/IPACK2015-48577
View Paper titled, High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects
Open the PDF for High Temperature Shear Strength of Cu-Sn Transient Liquid Phase Sintered Interconnects in another window
Topics: High temperature, Shear strength, Tin, Transients (Dynamics), Creep, Sinter (Metallurgy), Temperature, Sintering, Tension-leg platforms, Copper
Proceedings Papers

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73309
https://doi.org/10.1115/IPACK2013-73309
View Paper titled, Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators
Open the PDF for Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators in another window
Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds