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Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48785
https://doi.org/10.1115/IPACK2015-48785
View Paper titled, LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
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Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89016
https://doi.org/10.1115/InterPACK2009-89016
View Paper titled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)
Proceedings Papers

Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools

Ryan T. Marinis, Ryszard J. Pryputniewicz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 471-476, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89222
https://doi.org/10.1115/InterPACK2009-89222
View Paper titled, Direct Measurement of Gyroscope Quadrature Error Using Interferometric Tools
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Topics: Errors, Rotation, Interferometry, Coriolis force, Excitation, Resonance, Sensors, Shapes
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89014
https://doi.org/10.1115/InterPACK2009-89014
View Paper titled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33967
https://doi.org/10.1115/IPACK2007-33967
View Paper titled, An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging
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Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)
Proceedings Papers

Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses

Jin Yang, I. Charles Ume
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 365-374, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33542
https://doi.org/10.1115/IPACK2007-33542
View Paper titled, Quality Inspection of Flip Chip Solder Bump Using Analytical, Numerical and Experimental Modal Analyses
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Topics: Flip-chip, Flip-chip devices, Inspection, Modal analysis, Solders, Computer simulation, Dynamic response, Electronics, Experimental methods, Interferometry
Proceedings Papers

Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions

Phil Geng, Robert R. Martinson, Richard L. Williams, Michael Mello, Steve Cho
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1583-1586, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73046
https://doi.org/10.1115/IPACK2005-73046
View Paper titled, Shadow Moire´ Evaluation of Motherboard Warpage Under Preload CPU Thermal Solutions
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Topics: Shades and shadows, Warping, Temperature, Creep, Failure mechanisms, Heating, Interferometry, Shapes
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
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Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics