1-20 of 74
Integrated circuits
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC

David Geb, Subodh Deodhar, Nitin Netake, Tejas Jeurkar
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140403
https://doi.org/10.1115/IPACK2024-140403
View Paper titled, A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC
Open the PDF for A Thermal Reduced Order Model for Power Throttling Simulations of a 3D IC in another window
Topics: Simulation, Thermal management, Cooling, Design, Algorithms, Control equipment, Temperature, Heat, Integrated circuits, Sensors
Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
Open the PDF for Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots in another window
Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
Open the PDF for Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors in another window
Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels

Hayden Richards, Hisham Abusalma, Abhijit Dasgupta, Jian Yu, Andres Bujanda, Harvey Tsang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111895
https://doi.org/10.1115/IPACK2023-111895
View Paper titled, Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels
Open the PDF for Survivability and Reliability Testing and Modeling of Printed Hybrid Electronic (PHE) Assemblies Subject to Extreme Acceleration Levels in another window
Topics: Accelerated life testing, Accelerometers, Additive manufacturing, Aluminum, Circuits, Computer numerical control machine tools, Cracking (Materials), Delamination, Domes (Structural elements), Durability
Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6417
https://doi.org/10.1115/IPACK2019-6417
View Paper titled, Thermal Analysis of 3D ICs With TSVs Placement Optimization
Open the PDF for Thermal Analysis of 3D ICs With TSVs Placement Optimization in another window
Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
Open the PDF for Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) in another window
Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide

Richard C. Jaeger, Jun Chen, Jeffrey C. Suhling, Leonid Fursin
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8219
https://doi.org/10.1115/IPACK2018-8219
View Paper titled, Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide
Open the PDF for Design and Calibration of Resistive Stress Sensors on 4H Silicon Carbide in another window
Topics: Calibration, Design, Sensors, Silicon, Stress, Resistors, Temperature, Aerospace systems, Drilling, Geothermal power stations
Proceedings Papers

Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging

Dinesh P. R. Thanu, Roozbeh Danaei, Alexander Bermudez, Sergio A. Chan, Suzana Prstic
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8254
https://doi.org/10.1115/IPACK2018-8254
View Paper titled, Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging
Open the PDF for Fundamental Study of Polymer to Metal Bonding in Integrated Circuit Packaging in another window
Topics: Integrated circuit packaging, Metal bonding, Polymers, Bonding, Manufacturing, Metals, Adhesion, Warping, Adhesives, Chemistry
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
Open the PDF for Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line in another window
Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74224
https://doi.org/10.1115/IPACK2017-74224
View Paper titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
Open the PDF for Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips in another window
Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48738
https://doi.org/10.1115/IPACK2015-48738
View Paper titled, Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Open the PDF for Pre-Applied Inter Chip Fill for 3D-IC Chip Joining in another window
Topics: Joining, Pellet fusion, Thermal conductivity, Fillers (Materials), Aluminum, Boron, Composite materials, Cooling, Density, Epoxy adhesives
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
https://doi.org/10.1115/IPACK2015-48741
View Paper titled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
Open the PDF for Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application in another window
Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

Ah-Young Park, S. B. Park
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A066, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48042
https://doi.org/10.1115/IPACK2015-48042
View Paper titled, Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding
Open the PDF for Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding in another window
Topics: Bonding, Design, Thermal management, Finite element analysis, Packaging, Solders, Dimensions, Energy consumption, Heat transfer, Integrated circuits
Proceedings Papers

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits

Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48690
https://doi.org/10.1115/IPACK2015-48690
View Paper titled, Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
Open the PDF for Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits in another window
Topics: Cavities, Cooling, Design, Integrated circuits, Fluids, Pressure, Blocks (Building materials), Computer simulation, Construction, Drainage
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48370
https://doi.org/10.1115/IPACK2015-48370
View Paper titled, Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
Open the PDF for Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling in another window
Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN

David H. Altman, Anurag Gupta, Matthew Tyhach
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48179
https://doi.org/10.1115/IPACK2015-48179
View Paper titled, Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN
Open the PDF for Development of a Diamond Microfluidics-Based Intra-Chip Cooling Technology for GaN in another window
Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Junctions, Heat, Integrated circuits, Packaging, Power density, Temperature
Proceedings Papers

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

Fanghao Yang, Mark Schultz, Pritish Parida, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, John Knickerbocker, Timothy Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48341
https://doi.org/10.1115/IPACK2015-48341
View Paper titled, Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels
Open the PDF for Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels in another window
Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Heating, Temperature, Cooling, Resistance thermometers, Coolants, Density
Proceedings Papers

Advanced Cooling Designs for GaN-on-Diamond MMICs

Geoffrey Campbell, Henry Eppich, Keith Lang, Carlton Creamer, Thomas Yurovchak, Kanin Chu, Adonis Kassinos, Michael Ohadi, Amir Shooshtari, Serguei Dessiatoun
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48429
https://doi.org/10.1115/IPACK2015-48429
View Paper titled, Advanced Cooling Designs for GaN-on-Diamond MMICs
Open the PDF for Advanced Cooling Designs for GaN-on-Diamond MMICs in another window
Topics: Cooling, Diamonds, Gallium nitride, Temperature, Coolers, Microchannels, Thermal resistance, Cooling systems, Design, Engineering prototypes
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
Open the PDF for Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program in another window
Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48489
https://doi.org/10.1115/IPACK2015-48489
View Paper titled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling
Open the PDF for Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling in another window
Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits