1-5 of 5
Innovation
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach

Available to Purchase

Mohammad Reza Najjari, Cam Turner, Kamal Mostafavi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140918
https://doi.org/10.1115/IPACK2024-140918
View Paper titled, Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach
Open the PDF for Comprehensive Analysis of Two-Phase Flow Boiling for IT Equipment Cooling: A System and Component-Level Approach in another window
Topics: Boiling, Cooling, Two-phase flow, Refrigerants, Design, Health and safety, Innovation, Liabilities, Pressure drop
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Available to Purchase

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Open the PDF for Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components in another window
Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

Available to Purchase

Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48152
https://doi.org/10.1115/IPACK2015-48152
View Paper titled, Understanding the True Total Cost of Ownership of Water Cooling for Data Centers
Open the PDF for Understanding the True Total Cost of Ownership of Water Cooling for Data Centers in another window
Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation
Proceedings Papers

Consideration for Running Data Center at High Temperatures and Using Free Air Cooling

Available to Purchase

Yongzhan He, Guofeng Chen, Jiajun Zhang, Tianyu Zhou, Tao Liu, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A014, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48169
https://doi.org/10.1115/IPACK2015-48169
View Paper titled, Consideration for Running Data Center at High Temperatures and Using Free Air Cooling
Open the PDF for Consideration for Running Data Center at High Temperatures and Using Free Air Cooling in another window
Topics: Cooling, Data centers, High temperature, Corrosion, Internet, Temperature, Design, Operating temperature, Refrigeration, Carbon dioxide
Proceedings Papers

Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics

Available to Purchase

Srikanth Poranki, Nagen Nagarur, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 301-307, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89315
https://doi.org/10.1115/InterPACK2009-89315
View Paper titled, Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics
Open the PDF for Mapping Growth of an Emerging Technology: A Case Study of Flexible Electronics in another window
Topics: Flexible electronics, Electronics, Cycles, Diffusion (Physics), Explosions, Failure, Innovation, Patents, Plastics, Roads