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Proceedings Papers

Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects

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Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141879
https://doi.org/10.1115/IPACK2024-141879
View Paper titled, Additively Printed Circuits Using Biodegradable Substrates on Aerosol-Jet With Aqueous-Based Silver Conductive Paste Using ECA and Low-Temperature Interconnects
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Topics: Aerosols, Biodegradation, Circuits, Inks, Low temperature, Silver, Water
Proceedings Papers

Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process

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Pradeep Lall, Daniel Karakitie, Ved Soni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142110
https://doi.org/10.1115/IPACK2024-142110
View Paper titled, Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process
Open the PDF for Evaluation of Additively Printed Filters on High-Temperature Performance on the Aerojet Platform Using Ceramics Substrate and Laser Ablation Process in another window
Topics: Additive manufacturing, Aerosols, Ceramics, Circuits, Filters, High temperature, Inks, Laser ablation
Proceedings Papers

Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

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Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
https://doi.org/10.1115/IPACK2024-141871
View Paper titled, Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling
Open the PDF for Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling in another window
Topics: Electronics, Flexible electronics, Low temperature, Manufacturing, Water based printing inks, Bonding, Electrical conductivity, Inks, Accelerated life testing, Additive manufacturing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

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Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications

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Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112069
https://doi.org/10.1115/IPACK2023-112069
View Paper titled, Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications
Open the PDF for Functional Circuit Performance of Printable Formable Inks for In-Mold Electronics Applications in another window
Topics: Adhesives, Circuits, Electronics, Inks, Printing
Proceedings Papers

Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink

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Pradeep Lall, Sabina Bimali, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112066
https://doi.org/10.1115/IPACK2023-112066
View Paper titled, Component Attach Process Recipe and Performance on Aerosol Printed Sustainable Silver Ink
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Topics: Adhesives, Aerosols, Failure, Inks, Printing, Shear (Mechanics), Silver, Sintering, Stress, Sustainability
Proceedings Papers

Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability

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Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112058
https://doi.org/10.1115/IPACK2023-112058
View Paper titled, Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability
Open the PDF for Evaluation of Additive Circuits Printed With Sustainable Aqueous Silver Inks Using Aerosol Jet Printing and Gravure Offset Printing and Investigation of Circuit Repairability in another window
Topics: Aerosols, Batteries, Circuits, Electronics, Inks, Offset printing, Printing, Silver, Sustainability
Proceedings Papers

Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks

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Hua Xu, Jeffery C. C. Lo, Xing Qiu, Yuanjie Cheng, Mian Tao, S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111648
https://doi.org/10.1115/IPACK2023-111648
View Paper titled, Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks
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Topics: Electrical resistivity, Electronics, Inks, Silver, Sintering
Proceedings Papers

Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film

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Keisuke Kichise, Yoshihiro Harada, Shinichi Kuramoto, Masami Kadonaga, Kazuyoshi Fushinobu, Koichi Kato
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111660
https://doi.org/10.1115/IPACK2023-111660
View Paper titled, Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film
Open the PDF for Evolution of Physical Properties of Liquid Film During Evaporation Process: Drying and Evaporation Process of Inkjet Liquid Film in another window
Topics: Drying, Dynamic light scattering, Evaporation, Liquid films, Viscosity, Inks, Lubrication theory, Drops, Heat, Mass transfer
Proceedings Papers

Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer

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Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111958
https://doi.org/10.1115/IPACK2023-111958
View Paper titled, Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer
Open the PDF for Process Performance Interactions for Additively Printed Water-Based Nanoparticle Sustainable Silver-Ink With Ultrasonic Atomization on Aerosol Jet Printer in another window
Topics: Aerosols, Failure, Inks, Nanoparticles, Shear (Mechanics), Silver, Stress, Sustainability, Water
Proceedings Papers

Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink

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Pradeep Lall, Daniel Karakitie, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111957
https://doi.org/10.1115/IPACK2023-111957
View Paper titled, Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink
Open the PDF for Surface-Mount Component Attachment on Aerosol Jet Printed Sustainable Water-Base Silver Nanoparticle Ink in another window
Topics: Additive manufacturing, Aerosols, Circuits, Inks, Nanoparticles, Silver, Surface mount components, Sustainability, Water
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

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Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
Open the PDF for Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits in another window
Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

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Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit

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Pradeep Lall, Sabina Bimali, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112064
https://doi.org/10.1115/IPACK2023-112064
View Paper titled, Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit
Open the PDF for Reparability Test of Aerosol-Jet Printed Sustainable Silver Ink Circuit in another window
Topics: Adhesives, Aerosols, Circuits, Failure, Inks, Shear (Mechanics), Silver, Stress, Sustainability
Proceedings Papers

Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors

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Pradeep Lall, Shriram Kulkarni, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111980
https://doi.org/10.1115/IPACK2023-111980
View Paper titled, Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors
Open the PDF for Line Width and Electrical Performance Prediction for Inkjet Printed Conductors-Resistors-Inductors-Capacitors in another window
Topics: Capacitors, Inductors, Resistors, Printing, Circuits, Drops, Electronics, Inks, Particulate matter, Resolution (Optics)
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

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Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

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Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97428
https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Open the PDF for Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits in another window
Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

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Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Open the PDF for Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications in another window
Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Additive Manufacturing of Electronic Patterns for Harsh Environments

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Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94052
https://doi.org/10.1115/IPACK2022-94052
View Paper titled, Additive Manufacturing of Electronic Patterns for Harsh Environments
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Topics: Additive manufacturing, Extruding, Modeling, Strain measurement, Internet of things, Adhesives, Blocks (Building materials), Inks, Optimization, Oscillations
Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

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Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
Open the PDF for Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment in another window
Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components