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Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68870
https://doi.org/10.1115/IPACK2021-68870
View Paper titled, Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications
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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines
Proceedings Papers

Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions

Arun V. Gowda, Rinaldo L. Miorini, Michael Fish, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2608
https://doi.org/10.1115/IPACK2020-2608
View Paper titled, Silicon Carbide Power Module Co-Designed for Enhanced Thermal and Electrical Performance in Steady State and Transient Conditions
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Topics: Silicon, Steady state, Transients (Dynamics), Additive manufacturing, Flow (Dynamics), Army, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6443
https://doi.org/10.1115/IPACK2019-6443
View Paper titled, Comparative Study on Power Module Architectures for Modularity and Scalability
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Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6429
https://doi.org/10.1115/IPACK2019-6429
View Paper titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators

Kazuma Obata, Takashi Fukue, Koichi Hirose, Mamoru Kikuchi, Yasuhiko Ueda, Shigekado Kusabuka, Tomoyasu Miyahara
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A045, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48607
https://doi.org/10.1115/IPACK2015-48607
View Paper titled, Enhancement of Water Cooling Performance in Narrow Flow Passages by Using Micro Heat Sinks With Miniature Vortex Generators
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Topics: Cooling, Flow (Dynamics), Generators, Heat sinks, Vortices, Water, Heat, Density, Electric vehicles, Energy dissipation
Proceedings Papers

A Study on Reliability of High-Temperature Joint in Packaging Structure

Takayuki Ishikawa, Toshikazu Oshidari, Hiromi Sugihara, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 45-51, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52154
https://doi.org/10.1115/IPACK2011-52154
View Paper titled, A Study on Reliability of High-Temperature Joint in Packaging Structure
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Topics: High temperature, Packaging, Reliability, Nickel plating, Aluminum, Plating, Stress, Temperature, Cooling systems, Cycles
Proceedings Papers

Multiphysics Approach to Modeling Supercapacitors for Improving Performance

Xinqiang Xu, Bahgat G. Sammakia, DaeYoung Jung, Thor Eilertsen
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 165-174, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52081
https://doi.org/10.1115/IPACK2011-52081
View Paper titled, Multiphysics Approach to Modeling Supercapacitors for Improving Performance
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Topics: Modeling, Ultracapacitors, Heat, Electrolytes, Temperature, Temperature distribution, Thermal management, Activated carbon, Boundary-value problems, Computer software
Proceedings Papers

High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis

Kazunori Shinohara, Qiang Yu, Takashi Anzawa, Hideaki Ishii
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 19-26, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89043
https://doi.org/10.1115/InterPACK2009-89043
View Paper titled, High-Accuracy Fatigue Evaluation of Power Devices by Multi-Coupled Analysis
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Topics: Fatigue, Power semiconductor devices, Electrical conductivity, Semiconductors (Materials), Vehicles, Electric vehicles, Engineering simulation, Heat, Hybrid electric vehicles, Reliability